公开(公告)号：US20150316487A9

公开(公告)日：2015-11-05

申请号：US14213451

申请日：2014-03-14

Applicant: Rudolph Technologies, Inc.

Inventor： John Thornell ,  Steven Knauber ,  Jatinder Dhaliwal ,  Justin Miller ,  Michael Grant ,  Kenneth Durden

IPC: G01N21/88

CPC classification number: G01N21/8803 ,  G01N21/88

Abstract: A system for assessing a structure and the tools and processes used to form the structure is described. 2D images of the structure are captured and processed to obtain 3D information concerning the structure. Both 2D and 3D information is then used to identify and analyze selected characteristics of the structure. This analysis allows for a quality assessment of the structure. The selected characteristics are correlated with information relating to the operation of the tool that carried out the process that at least in part created the structure. The correlation of tool/process information to structure characteristics allows for the generation of feedback that may be used to modify the tool or processed used to form the structure.

Abstract translation: 描述了用于评估结构以及用于形成结构的工具和过程的系统。 捕获并处理结构的2D图像以获得关于结构的3D信息。 然后使用2D和3D信息来识别和分析所选结构的特征。 该分析允许对结构进行质量评估。 所选择的特征与进行至少部分地创建结构的处理的工具的操作有关的信息相关联。 工具/过程信息与结构特征的相关性允许产生可用于修改用于形成结构的工具或处理的反馈。

公开(公告)号：US20150309425A1

公开(公告)日：2015-10-29

申请号：US14432912

申请日：2013-09-27

Applicant: RUDOLPH TECHNOLOGIES, INC.

Inventor： J. Casey Donaher ,  Craig Simpson ,  Peter John Gerard Dufault

IPC: G03F7/20 ,  H02K41/02

CPC classification number: G03F7/70716 ,  G03F7/70758 ,  H02K41/02 ,  H02K41/031 ,  H02K2201/18

Abstract: A planar motor system comprises a platen with a first planar motor component and a stage with a second planar motor component. The stage can move along a first cardinal axis or a second cardinal axis. The planar motor system further comprises a drive system. When the drive system is energized in a first drive configuration, it applies a first force and a second force. The first force and the second force are not parallel to any cardinal axis. A vector sum of the first force and the second force is parallel to the first cardinal axis. When the drive system is energized in a second drive configuration, it applies a third force and a fourth force. The third force and the fourth force are not parallel to any cardinal axis. A vector sum of the third force and the fourth force is parallel to the second cardinal axis.

Abstract translation: 平面电动机系统包括具有第一平面电动机部件的台板和具有第二平面电动机部件的台架。 舞台可以沿第一个主轴或第二个主轴移动。 平面马达系统还包括驱动系统。 当驱动系统在第一驱动配置中通电时，它施加第一力和第二力。 第一力和第二力不平行于任何主轴。 第一力和第二力的矢量和平行于第一个主轴。 当驱动系统在第二驱动配置中通电时，它施加第三力和第四力。 第三力和第四力不平行于任何基数轴。 第三力和第四力的矢量和平行于第二主轴。

公开(公告)号：US20150234281A1

公开(公告)日：2015-08-20

申请号：US14433194

申请日：2013-10-02

Applicant: RUDOLPH TECHNOLOGIES, INC.

Inventor： Steven D. Gardner ,  J. Casey Donaher

IPC: G03F7/20

CPC classification number: G03F7/2026 ,  G03F7/2022 ,  G03F7/70066 ,  G03F7/70216 ,  G03F7/707 ,  G03F7/70733

Abstract: An apparatus protects a portion of a peripheral region (310) of a photoresist-coated surface of a substrate (308) from light exposure. The apparatus includes a blade (502, 512, 522, 532) that can move, or that can move and rotate, and a drive assembly (504, 514, 524, 534) operably coupled to the blade. In response to at least one first drive force generated by the drive assembly, the blade translates, rotates, or translates and rotates, such that the blade is disposed above a portion of the peripheral region. In response to at least one second drive force generated by the drive assembly, the blade translates, rotates, or rotates and translates, such that the blade is not disposed above a portion of the peripheral region. In a step-and-repeat lithographic system, the blade covers a portion of the peripheral region, and the adjacent portion of the substrate is exposed to light.

Abstract translation: 一种装置保护基底（308）的光致抗蚀剂涂覆的表面的周边区域（310）的一部分免受光照射。 该装置包括可移动或可以移动和旋转的叶片（502,512,522,532）以及可操作地联接到叶片的驱动组件（504,514,524,534）。 响应于由驱动组件产生的至少一个第一驱动力，叶片平移，旋转或平移和旋转，使得叶片设置在周边区域的一部分上方。 响应于由驱动组件产生的至少一个第二驱动力，叶片平移，旋转或旋转和平移，使得叶片不设置在周边区域的一部分上方。 在步进重复平版印刷系统中，刀片覆盖周边区域的一部分，并且衬底的相邻部分暴露于光。

公开(公告)号：US20140375983A1

公开(公告)日：2014-12-25

申请号：US14251945

申请日：2014-04-14

Applicant: Rudolph Technologies, Inc.

Inventor： Robert Gregory Wolf ,  Michael J. Kotelyanskii

IPC: G01N21/21

CPC classification number: G01N21/211 ,  G01B11/02 ,  G01B11/0625 ,  G01B11/0641 ,  G01B11/24 ,  G01B2210/56 ,  G01N21/4788 ,  G01N21/95607 ,  G01N2021/213

Abstract: A system for monitoring thin-film fabrication processes is herein disclosed. Diffraction of incident light is measured and the results are compared to a predictive model based on at least one idealized or nominal structure. The model and/or the measurement of diffracted incident light may be modified using the output of one or more additional metrology systems.

Abstract translation: 本文公开了一种用于监测薄膜制造工艺的系统。 测量入射光的衍射，并将结果与​​基于至少一个理想化或标称结构的预测模型进行比较。 可以使用一个或多个附加计量系统的输出来修改衍射入射光的模型和/或测量。

公开(公告)号：US20140063799A1

公开(公告)日：2014-03-06

申请号：US13868710

申请日：2013-04-23

Applicant: Rudolph Technologies, Inc.

Inventor： Christopher Voges ,  Ajay Pai ,  Antony Ravi Philip ,  Tuan D. Le

IPC: F21V13/02

CPC classification number: F21V13/02 ,  G01N21/9503

Abstract: Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.

Abstract translation: 公开了晶片边缘检查方法，其中成像装置捕获晶片边缘的至少一个图像。 可以分析至少一个图像以便识别边缘珠去除线。 具有扩散器的照明系统可以进一步用于拍摄图像。

公开(公告)号：US10664714B2

公开(公告)日：2020-05-26

申请号：US15850869

申请日：2017-12-21

Applicant: Rudolph Technologies, Inc.

Inventor： Kevin Barr

IPC: G06K9/00 ,  G06K9/18 ,  G03F9/00 ,  G03F7/20 ,  G06K9/20 ,  H01L23/544

Abstract: A structure and method for employing the structure to reliably read indicia formed on a substrate such as a panel or wafer is disclosed. A gripping member pulls the substrate into at least partial compliance with a locating structure to facilitate the proper function of a code reader. Where the indicia are not read, the substrate is moved relative to the code reader, starting from a position that may be determined based on the material properties of the substrate.

公开(公告)号：US10412311B2

公开(公告)日：2019-09-10

申请号：US15209218

申请日：2016-07-13

Applicant: Rudolph Technologies, Inc.

Inventor： Robert Bishop ,  Timothy Pinkney

IPC: H04N7/18 ,  H04N5/235 ,  G01N21/64 ,  G01N21/956 ,  G01N21/95 ,  G01N21/88 ,  H04N5/33 ,  H04N5/372 ,  H04N5/378 ,  G03B13/36

Abstract: A method and apparatus for optimizing inspection high-speed optical inspection of parts using intelligent image analysis to determine optimal focus using high numerical aperture (NA) optics, achieve a superior signal-to-noise ratio, resolution, and inspection speed performance with very limited depth of field lenses.

公开(公告)号：US09460953B2

公开(公告)日：2016-10-04

申请号：US14758718

申请日：2013-12-20

Applicant: RUDOLPH TECHNOLOGIES, INC.

Inventor： Isao Sato ,  Hiroki Ueno ,  Yasutoshi Ito ,  Masataka Ryu ,  Troy Palm

IPC: H01L21/687 ,  B25J11/00 ,  H01L21/67 ,  B25J15/00

CPC classification number: H01L21/68707 ,  B25J11/0095 ,  B25J15/0014 ,  H01L21/67259

Abstract: A mechanism for handling substrates such as semiconductor wafers is disclosed. The mechanism supports the substrate in a tilted orientation to ensure that undesirable contact between a bowed substrate and the mechanism does not occur. The structure that supports the substrate in a tilted orientation may be fixed or adjustable. A sensor may be provided to measure and/or monitor a distance between a substrate and the mechanism. Alternatively, a sensor for determining contact between the substrate and the mechanism may be provided.

Abstract translation: 公开了一种用于处理诸如半导体晶片的衬底的机构。 该机构以倾斜方向支撑衬底，以确保弓形衬底和机构之间不会发生不期望的接触。 以倾斜方向支撑衬底的结构可以是固定的或可调节的。 可以提供传感器来测量和/或监测衬底和机构之间的距离。 或者，可以提供用于确定基板和机构之间的接触的传感器。

公开(公告)号：US20160223470A1

公开(公告)日：2016-08-04

申请号：US15093130

申请日：2016-04-07

Applicant: Rudolph Technologies, Inc.

Inventor： Jeffrey L. O'Dell ,  Thomas Verburgt ,  Mark Harless ,  Cory Watkins

IPC: G01N21/95 ,  G06T7/00 ,  H04N5/225 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/8803 ,  G01N21/8806 ,  G01N2021/8838 ,  G01N2201/06113 ,  G01N2201/0696 ,  G01N2201/0697 ,  G01N2201/12 ,  G06T7/0004 ,  G06T2207/30148 ,  H01L21/67242 ,  H01L21/67271 ,  H01L21/67288 ,  H01L22/12 ,  H01L2924/0002 ,  H04N5/2256 ,  H01L2924/00

Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.

Abstract translation: 已经发明了一种自动化缺陷检查系统，并且用于图案化晶片，整个晶片，破碎的晶片，部分晶片，锯状晶片，例如胶片框架，JEDEC托盘，Auer船，凝胶或华夫饼包，MCM等中， 并且专门用于第二光学晶片检查，例如金属化缺陷（例如划痕，空隙，腐蚀和桥接），扩散缺陷，钝化层缺陷，划线缺陷，玻璃化缺陷，切屑和锯切裂纹等缺陷 凸起缺陷和焊盘区域缺陷。

公开(公告)号：US20160148831A1

公开(公告)日：2016-05-26

申请号：US14944839

申请日：2015-11-18

Applicant: Rudolph Technologies, Inc.

Inventor： James H. Greer ,  Troy Palm

IPC: H01L21/687 ,  H01L21/66 ,  H01L21/683

CPC classification number: H01L22/12 ,  H01L21/67288 ,  H01L21/673 ,  H01L21/67346 ,  H01L21/6838 ,  H01L21/68714 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/6875

Abstract: A method and apparatus for detecting and handling deformed substrates, thus allowing them to be processed, and for increasing device yield on the substrate is herein disclosed. A sensor detects deformity, then the substrate is flattened, allowing a support to hold it securely.

Abstract translation: 本文公开了一种用于检测和处理变形的基板，从而允许它们被处理以及用于提高基板上的器件产量的方法和装置。 传感器检测到畸形，然后将基板压平，允许支撑件牢固地固定。