公开(公告)号：US10017857B2

公开(公告)日：2018-07-10

申请号：US15144736

申请日：2016-05-02

Applicant: APPLIED MATERIALS, INC.

Inventor： Andrew Nguyen ,  Yang Yang ,  Kartik Ramaswamy ,  Steven Lane ,  Lawrence Wong

IPC: C23C16/00 ,  H01L21/306 ,  C23C16/505 ,  H01J37/32 ,  H01L21/687 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/3213

CPC classification number: C23C16/505 ,  H01J37/321 ,  H01J37/3211 ,  H01J37/32165 ,  H01J37/32715 ,  H01L21/68742 ,  H01L21/68785

Abstract: Methods and apparatus for processing a substrate are provided herein. In some embodiments, an apparatus for processing a substrate includes a process chamber having an internal processing volume disposed beneath a dielectric lid of the process chamber; a substrate support disposed in the process chamber and having a support surface to support a substrate; an inductive coil disposed above the dielectric lid to inductively couple RF energy into the internal processing volume to form a plasma above the substrate support; and a first inductive applicator ring coupled to a lift mechanism to position the first inductive applicator ring within the internal processing volume.

公开(公告)号：US20170092470A1

公开(公告)日：2017-03-30

申请号：US14867240

申请日：2015-09-28

Applicant: APPLIED MATERIALS, INC.

Inventor： Kartik Ramaswamy ,  Lawrence Wong ,  Steven Lane ,  Yang Yang ,  Srinivas D. Nemani ,  Praburam Gopalraja

IPC: H01J37/32

CPC classification number: H01J37/32449 ,  H01J37/32091 ,  H01J37/3211 ,  H01J37/32422 ,  H01J37/3244 ,  H01J2237/3323 ,  H01J2237/334

Abstract: A plasma source consisting of an array of plasma point sources that controls generation of charged particles and radicals spatially and temporally over a user defined region.

公开(公告)号：US20160048111A1

公开(公告)日：2016-02-18

申请号：US14460640

申请日：2014-08-15

Applicant: APPLIED MATERIALS, INC.

Inventor： Lawrence Wong ,  Kartik Ramaswamy ,  Yang Yang ,  Steven Lane ,  Richard Fovell

IPC: G05B13/02

CPC classification number: H01J37/32935 ,  C23F1/00 ,  H01J37/32082 ,  H01L21/67253

Abstract: Plural sensors on an interior surface of a reactor chamber are linked by respective RF communication channels to a hub inside the reactor chamber, which in turn is linked to a process controller outside of the chamber.

Abstract translation: 在反应室的内表面上的多个传感器通过相应的RF连通通道连接到反应器室内的轮毂，反应器室又连接到室外的过程控制器。

公开(公告)号：US20150075717A1

公开(公告)日：2015-03-19

申请号：US14026205

申请日：2013-09-13

Applicant: APPLIED MATERIALS, INC.

Inventor： Kartik Ramaswamy ,  Kenneth S. Collins ,  Shahid Rauf ,  Steven Lane ,  Yang Yang ,  Lawrence Wong

IPC: H01J37/32

CPC classification number: H01J37/32183 ,  H01J37/321 ,  H01J2237/3348

Abstract: An RF plasma source has a resonator with its shorted end joined to the processing chamber ceiling and inductively coupled to an array of radial toroidal channels in the ceiling.

Abstract translation: RF等离子体源具有谐振器，其短路端连接到处理室顶部并感应耦合到天花板中的径向环形通道阵列。

公开(公告)号：US20140232263A1

公开(公告)日：2014-08-21

申请号：US14270578

申请日：2014-05-06

Applicant: APPLIED MATERIALS, INC.

Inventor： Andrew Nguyen ,  Kartik Ramaswamy ,  Jason A. Kenney ,  Shahid Rauf ,  Kenneth S. Collins ,  Yang Yang ,  Steven Lane ,  Yogananda Sarode Vishwanath

IPC: H01J37/32

CPC classification number: H01J37/3211 ,  C23C16/45563 ,  C23C16/509 ,  H01J37/32174 ,  H05H1/46 ,  H05H2001/4667

Abstract: A plasma reactor has an overhead multiple coil antennas including a parallel spiral coil antenna and symmetric and radial RF feeds and cylindrical RF shielding around the symmetric and radial RF feeds. The radial RF feeds are symmetrically fed to the plasma source.

Abstract translation: 等离子体反应器具有架空多重线圈天线，包括平行的螺旋线圈天线以及围绕对称和径向射频馈送的对称和径向射频馈送以及圆柱形RF屏蔽。 径向RF馈送对称地馈送到等离子体源。

公开(公告)号：US20140034239A1

公开(公告)日：2014-02-06

申请号：US13958890

申请日：2013-08-05

Applicant: APPLIED MATERIALS, INC.

Inventor： Yang Yang ,  Kartik Ramaswamy ,  Kenneth S. Collins ,  Steven Lane ,  Douglas A. Buchberger, JR. ,  Lawrence Wong ,  Nipun Misra

IPC: H01L21/67

CPC classification number: H01L21/67069 ,  H01J37/32082 ,  H01J37/32174 ,  H01J37/32568 ,  H01J37/32623 ,  H01J37/32642 ,  H01J37/32935 ,  H01J2237/2001 ,  H01L21/67109 ,  H01L21/6833

Abstract: A plasma reactor includes an RF-driven wafer support electrode underlying a process zone and two (or more) counter electrodes overlying the process zone and facing different portions of the process zones, two (or more) variable reactances connected between respective ones of the counter electrodes and ground, and a controller governing the variable reactances to control distribution of a plasma parameter such as plasma ion density or ion energy.

Abstract translation: 等离子体反应器包括位于处理区下面的RF驱动的晶片支撑电极和覆盖处理区并面对处理区的不同部分的两个（或更多个）对电极，两个（或更多个）可变电抗连接在相应的计数器之间 电极和接地，以及控制可变电抗以控制诸如等离子体离子密度或离子能量之类的等离子体参数分布的控制器。

公开(公告)号：US12261019B2

公开(公告)日：2025-03-25

申请号：US18047006

申请日：2022-10-17

Applicant: Applied Materials, Inc.

Inventor： Kartik Ramaswamy ,  Yang Yang ,  Yue Guo

IPC: H01J37/32 ,  H03K3/57

Abstract: Embodiments provided herein generally include apparatus, plasma processing systems and methods for generation of a waveform for plasma processing of a substrate in a processing chamber. One embodiment includes a waveform generator having a voltage source circuitry, a first switch coupled between the voltage source circuitry and a first output node of the waveform generator, the first output node being configured to be coupled to a chamber, and a second switch coupled between the first output node and electrical ground node. The waveform generator also includes a third switch coupled between the voltage source circuitry and a second output node of the waveform generator, the second output node being configured to be coupled to the chamber, and a fourth switch coupled between the second output node and the electrical ground node.

公开(公告)号：US12136537B2

公开(公告)日：2024-11-05

申请号：US17963146

申请日：2022-10-10

Applicant: Applied Materials, Inc.

Inventor： Yue Guo ,  Kartik Ramaswamy ,  Farhad Moghadam ,  Yang Yang

IPC: H01J37/32 ,  H03H7/40

Abstract: Embodiments provided herein generally include apparatus and methods in a plasma processing system for rapid and inexpensive repair and replacement of RF sensors necessary for the operation of radio frequency (RF) power generation and impedance matching equipment used for generating a plasma in a plasma chamber during semiconductor processing therein. Flexible communications between equipment of the plasma processing system allows sharing of process information and equipment settings for batch processing of a plurality of semiconductor wafers during the manufacturing process. Operational settings of a master plasma processing system may be used to control the operation of a plurality of slave processing systems. In addition, the operational settings of the master plasma processing system may be recorded and reused for controlling the plurality of slave processing systems.

公开(公告)号：US12130561B2

公开(公告)日：2024-10-29

申请号：US17892211

申请日：2022-08-22

Applicant: Applied Materials, Inc.

Inventor： Kartik Ramaswamy ,  Michael D. Willwerth ,  Yang Yang

IPC: G03F7/42 ,  G03F7/00 ,  H01J37/32

CPC classification number: G03F7/70808 ,  G03F7/42 ,  G03F7/427 ,  G03F7/70925 ,  H01J37/32633 ,  H01J2237/3342

Abstract: Apparatus for processing substrates can include a gas distribution plate that includes an upper plate and a lower plate and a solid disk between the upper plate and the lower plate. Each of the upper plate and the lower plate has a central region and an outer region surrounding the central region, the central region being solid and the outer region having a plurality of through holes. The upper plate and the lower plate are coaxially aligned along a central axis extending through a center of the central region of the upper plate and a center of the central region of the lower plate. The solid disk is coaxially aligned with the upper plate and the lower plate. The solid disk is configured to block transmission of ultraviolet radiation through the solid disk.

公开(公告)号：US12111341B2

公开(公告)日：2024-10-08

申请号：US17960666

申请日：2022-10-05

Applicant: Applied Materials, Inc.

Inventor： Yue Guo ,  Yang Yang ,  Kartik Ramaswamy ,  Fernando Silveira ,  A N M Wasekul Azad

IPC: G01R29/08

CPC classification number: G01R29/0885

Abstract: Embodiments of the disclosure include an electric field measurement system that includes a first light source, a first light sensor configured to receive electromagnetic energy transmitted from the first light source, an electro-optic sensor, and a controller. The electro-optic sensor may include a package comprising a first electro-optic crystal disposed within a body; and at least one optical fiber. The optical fiber is configured to transmit electromagnetic energy transmitted from the first light source to a surface of the first electro-optic crystal, and transmit at least a portion of the electromagnetic energy transmitted to the surface of the first electro-optic crystal and subsequently passed through at least a portion of the first electro-optic crystal to the first light sensor that is configured to generate a signal based on an attribute of the electromagnetic energy received by the first light sensor from the at least one optical fiber. The controller is configured to generate a command signal based on a signal received from the first light sensor.