中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

20 records (took 0.015 seconds)

    APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL
    12.
    发明申请
    APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL 有权

    公开(公告)号：US20210402555A1

    公开(公告)日：2021-12-30

    申请号：US17362802

    申请日：2021-06-29

    Applicant: Applied Materials, Inc.

    Inventor： Surajit Kumar ,  Hari Soundararajan ,  Hui Chen ,  Shou-Sung Chang

    IPC: B24B37/015 ,  B24B37/10 ,  B24B37/26

    Abstract: A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of heated or coolant fluid and a plenum having a plurality of openings positioned over the platen and separated from the polishing pad for delivering the fluid onto the polishing pad, wherein at least some of the openings are each configured to deliver a different amount of the fluid onto the polishing pad.

    High quality factor embedded resonator wafers
    14.
    发明授权
    High quality factor embedded resonator wafers 有权

    公开(公告)号：US11209398B2

    公开(公告)日：2021-12-28

    申请号：US16597615

    申请日：2019-10-09

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Chuang-Chia Lin ,  Surajit Kumar ,  Upendra Ummethala

    IPC: G01N29/12 ,  H03H9/02 ,  H01L21/66 ,  H01L21/67

    Abstract: Embodiments disclosed herein include diagnostic substrates and methods of using such substrates. In an embodiment, a diagnostic substrate comprises a substrate, and a device layer over the substrate. In an embodiment, the diagnostic substrate further comprises a resonator in the device layer. In an embodiment, the resonator comprises a cavity, a cover layer over the cavity, and electrodes within the cavity for driving and sensing resonance of the cover layer. In an embodiment, the diagnostic substrate further comprises a reflector surrounding a perimeter of the resonator.

    Liner for processing chamber
    15.
    发明授权
    Liner for processing chamber 有权

    公开(公告)号：US11021790B2

    公开(公告)日：2021-06-01

    申请号：US16521826

    申请日：2019-07-25

    Applicant: Applied Materials, Inc.

    Inventor： Zhepeng Cong ,  Schubert Chu ,  Nyi O. Myo ,  Kartik Shah ,  Surajit Kumar

    IPC: C23C16/44 ,  C30B25/08 ,  C23C16/458 ,  C23C16/46

    Abstract: Embodiments herein relate to chamber liners with a multi-piece design for use in processing chambers. The multi-piece design can have an inner portion and an outer portion. A portion of the inner surface of the outer portion may be designed to be in contact with the outer surface of the inner portion at a single junction point, creating a thermal barrier between the inner portion and outer portion, thus reducing heat transfer from the inner portion and outer portion. The thermal barrier creates higher temperatures at the chamber liner inner surface and therefore leads to shorter heat up times within the chamber. Additionally, the thermal barrier also creates lower temperatures near the base ring and outer surface of the outer ring, thereby protecting the chamber walls and requiring less thermal regulation/dissipation at the chamber walls.

    UNIFORM RADIATION HEATING CONTROL ARCHITECTURE
    16.
    发明公开
    UNIFORM RADIATION HEATING CONTROL ARCHITECTURE 审中-公开

    公开(公告)号：US20230297740A1

    公开(公告)日：2023-09-21

    申请号：US17695619

    申请日：2022-03-15

    Applicant: Applied Materials, Inc.

    Inventor： Preetham Rao ,  Surajit Kumar ,  Dongming Iu ,  Wolfgang Aderhold

    IPC: G06F30/27 ,  G06K9/62

    CPC classification number: G06F30/27 ,  G06K9/6256 ,  G06F2119/08

    Abstract: Embodiments disclosed herein include a method of modeling a rapid thermal processing (RTP) tool. In an embodiment, the method comprises developing a lamp model of an RTP tool, wherein the lamp model comprises a plurality of lamp zones, calculating an irradiance graph for the plurality of lamp zones, multiplying irradiance values of the plurality of lamp zones in the irradiance graph by a power of an existing RTP tool at a given time during a process recipe, summing the multiplied irradiance values for the plurality of lamp zones to form an irradiation graph of the lamp model, using the irradiation graph as an input to a machine learning algorithm, and outputting the temperature across a hypothetical substrate from the machine learning algorithm.

    Apparatus for controlling temperature uniformity of a substrate
    18.
    发明授权
    Apparatus for controlling temperature uniformity of a substrate 有权

    公开(公告)号：US10386126B2

    公开(公告)日：2019-08-20

    申请号：US15050419

    申请日：2016-02-22

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Kallol Bera ,  Xiaoping Zhou ,  Douglas A. Buchberger, Jr. ,  Andrew Nguyen ,  Hamid Tavassoli ,  Surajit Kumar ,  Shahid Rauf

    IPC: F28F3/12 ,  F28F13/00

    Abstract: Apparatus for controlling the thermal uniformity of a substrate can control the thermal uniformity of the substrate to be more uniform or to be non-uniform. In some embodiments, an apparatus for controlling the thermal uniformity of a substrate includes: a substrate support having a support surface to support a substrate thereon. A flow path is disposed within the substrate support to flow a heat transfer fluid beneath the support surface. The flow path comprises a first portion and a second portion, each portion having a substantially equivalent axial length. The first portion is spaced about 2 mm to about 10 mm from the second portion. The first portion provides a flow of heat transfer fluid in a direction opposite a flow of heat transfer fluid of the second portion.

    REFLECTIVE LINERS
    19.
    发明申请
    REFLECTIVE LINERS 审中-公开
    反射线

    公开(公告)号：US20140287170A1

    公开(公告)日：2014-09-25

    申请号：US14186566

    申请日：2014-02-21

    Applicant: Applied Materials, Inc.

    Inventor： JOSEPH M. RANISH ,  Paul Brillhart ,  Surajit Kumar

    IPC: H01L21/67

    CPC classification number: H01L21/67115 ,  Y10T428/13

    Abstract: An apparatus for processing a semiconductor substrate is described. The apparatus is a process chamber having an optically transparent upper dome and lower dome. Vacuum is maintained in the process chamber during processing. The upper dome is thermally controlled by flowing a thermal control fluid along the upper dome outside the processing region. Thermal lamps are positioned proximate the lower dome, and thermal sensors are disposed among the lamps. The lamps are powered in zones, and a controller adjusts power to the lamp zones based on data received from the thermal sensors. A reflective liner may provide for improved temperature measurement and heating of a substrate.

    Abstract translation: 对半导体衬底的处理装置进行说明。 该装置是具有光学透明的上部圆顶和下部圆顶的处理室。 在处理过程中真空保持在处理室中。 通过使热控制流体沿着加工区域外的上部圆顶流动来对上部圆顶进行热控制。 散热灯靠近下穹顶定位，热传感器设置在灯之间。 灯具已通电，并且控制器根据从热传感器接收的数据调节灯区的电源。 反射衬垫可以提供对衬底的改进的温度测量和加热。

    EPI BASE RING
    20.
    发明申请
    EPI BASE RING 有权
    EPI基座

    公开(公告)号：US20140261185A1

    公开(公告)日：2014-09-18

    申请号：US13846355

    申请日：2013-03-18

    Applicant: Applied Materials, Inc.

    Inventor： STEVE ABOAGYE ,  Paul Brillhart ,  Surajit Kumar ,  Anzhong Chang ,  Satheesh Kuppurao ,  Mehmet Tugrul Samir ,  David K. Carlson

    IPC: C23C16/455

    CPC classification number: C23C16/45502 ,  C23C16/4411 ,  C23C16/45504 ,  C23C16/45563 ,  C23C16/458 ,  C23C16/4584 ,  C23C16/481

    Abstract: Embodiments described herein relate to a base ring assembly for use in a substrate processing chamber. In one embodiment, the base ring assembly comprises a ring body sized to be received within an inner circumference of the substrate processing chamber, the ring body comprising a loading port for passage of the substrate, a gas inlet, and a gas outlet, wherein the gas inlet and the gas outlet are disposed at opposing ends of the ring body, and an upper ring configured to dispose on a top surface of the ring body, and a lower ring configured to dispose on a bottom surface of the ring body, wherein the upper ring, the lower ring, and the ring body, once assembled, are generally concentric or coaxial.

    Abstract translation: 本文所述的实施例涉及用于衬底处理室中的基座环组件。 在一个实施例中，基环组件包括尺寸适于容纳在基板处理室的内圆周内的环体，环体包括用于通过基板的装载口，气体入口和气体出口，其中， 气体入口和气体出口设置在环体的相对端，并且配置成设置在环体的顶表面上的上环和被配置为设置在环体的底表面上的下环，其中， 一旦组装，上环，下环和环体大致同心或同轴。

Patent Agency Ranking