公开(公告)号：US20140077078A1

公开(公告)日：2014-03-20

申请号：US14026385

申请日：2013-09-13

Applicant: EBARA CORPORATION

Inventor： Masahiro HATAKEYAMA ,  Yasushi TOMA ,  Shoji YOSHIKAWA ,  Kiwamu TSUKAMOTO

IPC: G01N23/225

CPC classification number: H01J37/22 ,  G01N23/2251 ,  G01N2223/204 ,  G01N2223/611 ,  H01J3/024 ,  H01J37/075 ,  H01J37/28 ,  H01J2237/063 ,  H01J2237/2448 ,  H01J2237/2806

Abstract: An inspection apparatus includes: beam generation means for generating any of charged particles and electromagnetic waves as a beam; a primary optical system that guides the beam into an inspection object held in a working chamber and irradiates the inspection object with the beam; a secondary optical system that detects secondary charged particles occurring from the inspection object; and an image processing system that forms an image on the basis of the detected secondary charged particles. The primary optical system includes a photoelectron generator having a photoelectronic surface. The base material of the photoelectronic surface is made of material having a higher thermal conductivity than the thermal conductivity of quartz.

公开(公告)号：US20230173636A1

公开(公告)日：2023-06-08

申请号：US18161707

申请日：2023-01-30

Applicant: EBARA CORPORATION

Inventor： Tetsuji TOGAWA ,  Hiroshi SOBUKAWA ,  Masahiro HATAKEYAMA

IPC: B24B37/013 ,  B24B37/16

CPC classification number: B24B37/013 ,  B24B37/16

Abstract: To terminate polishing at an appropriate position, an end point position of the polishing is sensed. According to one embodiment, a method that chemomechanically polishes a substrate including a functional chip is provided. The method includes: a step of disposing the functional chip on the substrate; a step of disposing an end point sensing element on the substrate; a step of sealing the substrate on which the functional chip and the end point sensing element are disposed with an insulating material; a step of polishing the insulating material; and a step of sensing an end point of the polishing based on the end point sensing element while the insulating material is polished.

公开(公告)号：US20220234164A1

公开(公告)日：2022-07-28

申请号：US17612721

申请日：2020-05-20

Applicant: Ebara Corporation

Inventor： Tsuneo TORIKOSHI ,  Masahiro HATAKEYAMA ,  Ryo NAKAGOMI

IPC: B24B37/013

Abstract: It is possible to save labor, energy, and/or cost for a substrate processing apparatus.
It is provided with a sensor installed in a substrate processing apparatus and configured to detect a target physical quantity during processing of a target substrate; and a prediction unit configured to output a polishing end point timing, which is timing of ending polishing, by inputting, to a learned machine learning model, time-series data of the physical quantity detected by the sensor or time-series data obtained by differentiating the time-series data of the physical quantity with respect to time, in which the machine learning model is obtained by machine learning using, as a learning data set, past time-series data of the physical quantity or time-series data obtained by differentiating the past time-series data of the physical quantity with respect to time as input and using the past polishing end point timing as output.

公开(公告)号：US20180093360A1

公开(公告)日：2018-04-05

申请号：US15714938

申请日：2017-09-25

Applicant: EBARA CORPORATION

Inventor： Hiroyuki SHINOZAKI ,  Yuta SUZUKI ,  Taro TAKAHASHI ,  Seiji KATSUOKA ,  Masahiro HATAKEYAMA

IPC: B24B37/013 ,  B24B37/32 ,  B24B37/10

Abstract: In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.

公开(公告)号：US20160322192A1

公开(公告)日：2016-11-03

申请号：US15147356

申请日：2016-05-05

Applicant: EBARA CORPORATION

Inventor： Takehide HAYASHI ,  Masahiro HATAKEYAMA ,  Shinji YAMAGUCHI ,  Masato NAKA

IPC: H01J37/22 ,  H01J37/28

CPC classification number: H01J37/28 ,  H01J37/185 ,  H01J37/222 ,  H01J37/224 ,  H01J2237/2448 ,  H01J2237/2806 ,  H01J2237/2817

Abstract: An inspection apparatus includes beam generation means, a primary optical system, a secondary optical system and an image processing system. Irradiation energy of the beam is set in an energy region where mirror electrons are emitted from the inspection object as the secondary charged particles due to the beam irradiation. The secondary optical system includes a camera for detecting the secondary charged particles, a numerical aperture whose position is adjustable along an optical axis direction and a lens that forms an image of the secondary charged particles that have passed through the numerical aperture on an image surface of the camera. In the image processing system, the image is formed under an aperture imaging condition where the position of the numerical aperture is located on an object surface to acquire an image.

公开(公告)号：US20140091215A1

公开(公告)日：2014-04-03

申请号：US14096361

申请日：2013-12-04

Applicant: Ebara Corporation

Inventor： Kenji WATANABE ,  Masahiro HATAKEYAMA ,  Yoshihiko NAITO ,  Tatsuya KOHAMA ,  Kenji TERAO ,  Takeshi MURAKAMI ,  Takehide HAYASHI ,  Kiwamu TSUKAMOTO ,  Hiroshi SOBUKAWA ,  Norio KIMURA

IPC: H01J37/22

CPC classification number: H01J37/22 ,  H01J37/265 ,  H01J37/29 ,  H01J2237/004 ,  H01J2237/022 ,  H01J2237/24495 ,  H01J2237/24564 ,  H01J2237/2817

Abstract: An electro-optical inspection apparatus is provided that is capable of preventing adhesion of dust or particles to the sample surface as much as possible. A stage (100) on which a sample (200) is placed is disposed inside a vacuum chamber (112) that can be evacuated to vacuum, and a dust collecting electrode (122) is disposed to surround a periphery of the sample (200). The dust collecting electrode (122) is applied with a voltage having the same polarity as a voltage applied to the sample (200) and an absolute value that is the same or larger than an absolute value of the voltage. Thus, because dust or particles such as particles adhere to the dust collecting electrode (122), adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber containing the stage, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied. In addition, adhesion of dust or particles can be further reduced by disposing a gap control plate (124) having a through hole (124a) at the center above the sample (200) and the dust collecting electrode (122).

Abstract translation: 提供一种电光检查装置，其能够尽可能地防止灰尘或颗粒附着到样品表面。 将其上放置有样品（200）的载物台（100）设置在能够抽真空的真空室（112）的内部，并且设置集尘电极（122）以包围样品（200）的周围， 。 集尘电极（122）施加与施加到样品（200）的电压相同极性的电压和与电压的绝对值相同或更大的绝对值。 因此，由于灰尘或颗粒例如颗粒附着在集尘电极122上，所以可以降低灰尘或颗粒对样品表面的粘附。 代替使用集尘电极，可以在包含载物台的真空室的壁上形成凹部，或者在壁上配置具有施加了预定电压的网状结构的金属板。 此外，通过在样品（200）上方的中心和集尘电极（122）设置具有通孔（124a）的间隙控制板（124），可以进一步减少灰尘或颗粒的附着。