Apparatus and method for applying surface coatings

    公开(公告)号:US10366868B2

    公开(公告)日:2019-07-30

    申请号:US14434525

    申请日:2013-10-09

    Applicant: Europlasma NV

    Abstract: The present invention provides a method for applying a surface coating on, for example, a sheet of fabric and further provides a plasma chamber (10) for coating a sheet of fabric, e.g. a textile material, with a polymer layer, the plasma chamber (10) comprising a plurality of electrode layers (RF, M) arranged successively within the plasma chamber, wherein at least two adjacent electrode layers are radiofrequency electrode layers (RF) or ground electrode layers (M), thereby providing a surface coating on both sides of a fabric sheet.

    Plasma Diffuser
    13.
    发明申请
    Plasma Diffuser 审中-公开
    等离子体扩散器

    公开(公告)号:US20170047201A1

    公开(公告)日:2017-02-16

    申请号:US15306147

    申请日:2015-04-22

    Applicant: Europlasma NV

    Abstract: The present invention concerns a method for at least partially preventing discolouration of a substrate by a plasma coating process, by diffusing a plasma prior to and/or during depositing of said plasma on said substrate to form a coating. The present invention also concerns a plasma coating apparatus comprising a plasma diffuser for homogenizing a plasma density nearby a substrate to be coated.

    Abstract translation: 本发明涉及一种通过在所述衬底上沉积所述等离子体之前和/或期间扩散等离子体以形成涂层来至少部分地防止通过等离子体涂覆方法使衬底变色的方法。 本发明还涉及一种等离子体涂覆装置,其包括用于使待涂覆的基底附近的等离子体密度均匀化的等离子体扩散器。

    Surface Coatings
    14.
    发明申请
    Surface Coatings 审中-公开
    表面涂层

    公开(公告)号:US20160324011A1

    公开(公告)日:2016-11-03

    申请号:US15103367

    申请日:2014-12-10

    Applicant: EUROPLASMA NV

    Abstract: The present invention concerns a process for the deposition of a solder-through polymer coating on an uncoated printed circuit board which comprises the use of an average low power and low pressure plasma polymerisation in a polymerisation chamber of an organosilane precursor monomer which is introduced into said polymerisation chamber by means of a carrier gas, said organosilane being of the Formula Y1-X—Y2 (I) or —[Si(CH3)2-X-]n- (II), wherein: X is O or NH; Y1 is —Si(Y3)(Y4)Y5; Y2 is Si(Y3′)(Y4′)Y5′; Y3, Y4, Y5, Y3′, Y4′, and Y5′ are each independently H or an alkyl group of up to 10 carbon atoms; the monomer of formula (II) is cyclic wherein n is 2 to 10, and wherein at most one of Y3, Y4 and Y5 is hydrogen, at most one of Y3′, Y4′ and Y5′ is hydrogen and the total number of carbon atoms is not more than 20.

    Abstract translation: 本发明涉及一种用于在未涂覆的印刷电路板上沉积焊料穿透聚合物涂层的方法,其包括在有机硅烷前体单体的聚合室中使用平均低功率和低压等离子体聚合,所述聚合室被引入所述 所述有机硅烷为式Y1-X-Y2(I)或 - [Si(CH3)2-X-n-(Ⅱ)),其中:X为O或NH; Y1是-Si(Y3)(Y4)Y5; Y2是Si(Y3')(Y4')Y5'; Y 3,Y 4,Y 5,Y 3',Y 4'和Y 5'各自独立地为H或至多10个碳原子的烷基; 式(II)的单体是环状的,其中n为2至10,并且其中Y 3,Y 4和Y 5中的至少一个为氢,Y 3',Y 4'和Y 5'中的至多一个为氢,并且碳 原子不超过20。

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