公开(公告)号：US10680367B2

公开(公告)日：2020-06-09

申请号：US15084682

申请日：2016-03-30

Applicant: Intel Corporation

Inventor： Feifei Cheng ,  Kuang C. Liu ,  Michael Garcia ,  Eric W. Buddrius ,  Kevin J. Ceurter ,  Anthony P. Valpiani ,  Jonathon Robert Carstens

IPC: H01R12/75 ,  H01R12/77 ,  H01R13/62 ,  H01R13/639 ,  H01R12/70

Abstract: Embodiments of the disclosure are directed to a linear edge connector assembly for connecting to a substrate diving board of a mother board. The linear edge connector assembly can include an electrical interface to electrically connect the contacts on the diving board to one or more conducts of a cable bundle. The linear edge connector assembly can also include a retaining force mechanism. The retaining force mechanism can include a torsional spring, a spring loaded hooking mechanism, or a spring loaded cam and lever. In some embodiments, the linear edge connector can include a notch to receive a latch connected to a bolster plate on the mother board.

公开(公告)号：US20170288331A1

公开(公告)日：2017-10-05

申请号：US15084726

申请日：2016-03-30

Applicant: Intel Corporation

Inventor： Feifei Cheng ,  Kuang C. Liu ,  Michael Garcia ,  Eric W. Buddrius ,  Kevin J. Ceurter ,  Jonathon Robert Carstens

IPC: H01R12/75 ,  H01R12/70

CPC classification number: H01R12/75 ,  H01R12/7023 ,  H01R12/774 ,  H01R13/639

Abstract: Embodiments of the present disclosure are directed to a linear edge connector assembly and corresponding bolster plate features for receiving and securing a linear edge connector assembly. Embodiments of the disclosure are directed to a linear edge connector assembly that includes a grooved and indented receiver that can receive a spring loaded ball on the bolster plate. In embodiments, the linear edge connector assembly can include a magnetic element to create a magnetic attraction to magnetic elements on the bolster plate, such as a press-fit ball or a U-shaped hardstop. In some embodiments, the linear edge connector assembly includes a screw or push pin that can be received by a receiver on the bolster plate. The receiver can include a thread or friction fit receiver.

公开(公告)号：US12279395B2

公开(公告)日：2025-04-15

申请号：US17474974

申请日：2021-09-14

Applicant: Intel Corporation

Inventor： Phil Geng ,  Ralph V. Miele ,  David Shia ,  Jeffory L. Smalley ,  Eric W. Buddrius ,  Sean T. Sivapalan ,  Olaotan Elenitoba-Johnson ,  Mengqi Liu

IPC: H05K7/14 ,  H01L23/053 ,  H01L23/32 ,  H01L23/40

Abstract: An apparatus is described. The apparatus includes a back plate, where, an electronic circuit board is to be placed between the back plate and a thermal cooling mass for a semiconductor chip package. The back plate includes a first material and a second material. The first material has greater stiffness than the second material. The back plate further includes at least one of: a third material having greater stiffness than the second material; re-enforcement wires composed of the first material; a plug composed of the second material that is inserted into a first cavity in the first material, a stud inserted into a second cavity in the plug. An improved bolster plate having inner support arms has also been described.

公开(公告)号：US20240407092A1

公开(公告)日：2024-12-05

申请号：US18806367

申请日：2024-08-15

Applicant: Intel Corporation

Inventor： Ariatne Ramirez Macias ,  Allison Van Horn ,  Kristin L. Weldon ,  Israel Cruz Ruiz ,  Fernando Gonzalez Lenero ,  Min Pei ,  Francisco Javier Colorado Alonso ,  Randall Scott Sanford ,  Emery Evon Frey ,  Eric W. Buddrius

IPC: H05K1/11

Abstract: Covers for integrated circuit package sockets are disclosed herein. An example cover for a socket for an integrated circuit package includes a base including a cutout, the cutout to engage a pin associated with the socket, engagement of the cutout and the pin to maintain a position of the cover relative to the socket; and a handle to facilitate positioning of the cover to move the cutout into engagement with the pin.

公开(公告)号：US20230395460A1

公开(公告)日：2023-12-07

申请号：US18450928

申请日：2023-08-16

Applicant: Intel Corporation

Inventor： David Shia ,  Rick Canham ,  Eric W. Buddrius ,  Jeffory L. Smalley ,  John Beatty ,  Kenan Arik ,  Mohanraj Prabhugoud ,  Kirk Wheeler ,  Shelby Ferguson ,  Jorge Contreras Perez ,  Daniel Neumann ,  Ernesto Borboa Lizarraga

IPC: H01L23/40

CPC classification number: H01L23/4093 ,  H01L23/4006 ,  H01L2023/4087 ,  H01L2023/405

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for supports for internal hardware of electronic devices. An example support includes an integrated circuit (IC) carrier that includes a plurality of walls, supports carried by the walls to support an IC from below the IC, and a retention clip to secure the IC.

公开(公告)号：US11557529B2

公开(公告)日：2023-01-17

申请号：US15942270

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Thomas Boyd ,  Ming-Chen Chang ,  Evan A. Chenelly ,  Divya Swamy Bandaru ,  Craig J. Jahne ,  Andrew Larson ,  Eric W. Buddrius ,  Eric D. McAfee ,  Mustafa Haswarey ,  Ralph V. Miele ,  Rolf Laido

IPC: H05K7/14 ,  H01L23/40 ,  H01L23/367

Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

公开(公告)号：US11387163B2

公开(公告)日：2022-07-12

申请号：US15942278

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Andrew Larson ,  Bijoyraj Sahu ,  Craig J. Jahne ,  Eric W. Buddrius ,  Ralph V. Miele

IPC: F16B33/00 ,  F16B37/00 ,  H01L23/40 ,  F16B37/14

Abstract: A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.

公开(公告)号：US20210193558A1

公开(公告)日：2021-06-24

申请号：US17187470

申请日：2021-02-26

Applicant: Intel Corporation

Inventor： Ralph V. Miele ,  Phil Geng ,  Mengqi Liu ,  David Shia ,  Sandeep Ahuja ,  Eric W. Buddrius ,  Jeffory L. Smalley

IPC: H01L23/40

Abstract: Techniques for processor loading mechanisms are disclosed. In the illustrative embodiment, a heat sink is in contact with a top surface of a processor, applying a downward force on the processor. A load plate is also in contact with the processor, applying a downward force to the processor as well. The combination of the downward force from the load plate and the heat sink keep the processor in good physical contact with pins of the processor socket. The heat sink has enough force applied to the processor to be in good thermal contact with the processor without applying higher stress to the heat sink. The load plate can apply force to the processor without regard to the thermal characteristics of the load plate. Other embodiments are envisioned and described.

公开(公告)号：US20190302857A1

公开(公告)日：2019-10-03

申请号：US15942280

申请日：2018-03-30

Applicant: INTEL CORPORATION

Inventor： Eric W. Buddrius ,  Ralph V. Miele ,  Mohanraj Prabhugoud ,  David Shia ,  Jeffory L. Smalley

IPC: G06F1/18 ,  H05K7/14 ,  H05K7/16 ,  H05K7/18 ,  H05K7/20

Abstract: A microprocessor loading mechanism, comprising a bolster plate surrounding an aperture, wherein the opening is to receive a microprocessor socket, one or more torsion bars coupled to the bolster plate, and a stud coupled to each of the one or more torsion bars, wherein each stud is to receive a nut to secure a microprocessor package to the microprocessor socket within the aperture and wherein each stud is secured to the bolster plate by each corresponding torsion bar.

公开(公告)号：US09825387B2

公开(公告)日：2017-11-21

申请号：US15084726

申请日：2016-03-30

Applicant: Intel Corporation

Inventor： Feifei Cheng ,  Kuang C. Liu ,  Michael Garcia ,  Eric W. Buddrius ,  Kevin J. Ceurter ,  Jonathon Robert Carstens

IPC: H01R13/62 ,  H01R12/75 ,  H01R12/70 ,  H01R13/639

CPC classification number: H01R12/75 ,  H01R12/7023 ,  H01R12/774 ,  H01R13/639

Abstract: Embodiments of the present disclosure are directed to a linear edge connector assembly and corresponding bolster plate features for receiving and securing a linear edge connector assembly. Embodiments of the disclosure are directed to a linear edge connector assembly that includes a grooved and indented receiver that can receive a spring loaded ball on the bolster plate. In embodiments, the linear edge connector assembly can include a magnetic element to create a magnetic attraction to magnetic elements on the bolster plate, such as a press-fit ball or a U-shaped hardstop. In some embodiments, the linear edge connector assembly includes a screw or push pin that can be received by a receiver on the bolster plate. The receiver can include a thread or friction fit receiver.