公开(公告)号：US20110304018A1

公开(公告)日：2011-12-15

申请号：US13214773

申请日：2011-08-22

Applicant: Islam A. Salama ,  Yongki Min

Inventor： Islam A. Salama ,  Yongki Min

IPC: H01L29/40

CPC classification number: H05K1/162 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/4602 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/1105

Abstract: Some embodiments of the invention include thin film capacitors formed on a package substrate of an integrated circuit package. At least one of the film capacitors includes a first electrode layer, a second electrode layer, and a dielectric layer between the first and second electrode layers. Each of the first and second electrode layers and the dielectric layer is formed individually and directly on the package substrate. Other embodiments are described and claimed.

Abstract translation: 本发明的一些实施例包括形成在集成电路封装的封装衬底上的薄膜电容器。 薄膜电容器中的至少一个包括在第一和第二电极层之间的第一电极层，第二电极层和电介质层。 第一和第二电极层和电介质层中的每一个单独形成并直接形成在封装衬底上。 描述和要求保护其他实施例。

公开(公告)号：US07983020B2

公开(公告)日：2011-07-19

申请号：US12661568

申请日：2010-03-19

Applicant: Yongki Min ,  Daewoong Dave Suh

Inventor： Yongki Min ,  Daewoong Dave Suh

IPC: H01G4/228

CPC classification number: H01G4/005 ,  H01G4/008 ,  H01G4/33 ,  H01L28/40

Abstract: Devices and methods for their formation, including electronic devices containing capacitors, are described. In one embodiment, a device includes a substrate and a capacitor is formed on the substrate. The capacitor includes first and second electrodes and a capacitor dielectric between the first and second electrodes. At least one of the first and second electrodes includes a metal layer having carbon nanotubes coupled thereto. In one aspect of certain embodiments, the carbon nanotubes are at least partially coated with an electrically conductive material. In another aspect of certain embodiments, the substrate comprises an organic substrate and the capacitor dielectric comprises a polymer material. Other embodiments are described and claimed.

Abstract translation: 描述了其形成装置和方法，包括含有电容器的电子器件。 在一个实施例中，器件包括衬底，并且在衬底上形成电容器。 电容器包括第一和第二电极以及在第一和第二电极之间的电容器电介质。 第一和第二电极中的至少一个包括具有与其结合的碳纳米管的金属层。 在某些实施方案的一个方面，碳纳米管至少部分地涂覆有导电材料。 在某些实施方案的另一方面，基底包括有机基底，电容器电介质包括聚合物材料。 描述和要求保护其他实施例。

公开(公告)号：US20100177475A1

公开(公告)日：2010-07-15

申请号：US12661568

申请日：2010-03-19

Applicant: Yongki Min ,  Daewoong Suh

Inventor： Yongki Min ,  Daewoong Suh

IPC: H01G4/008 ,  G06F1/16

CPC classification number: H01G4/005 ,  H01G4/008 ,  H01G4/33 ,  H01L28/40

Abstract: Devices and methods for their formation, including electronic devices containing capacitors, are described. In one embodiment, a device includes a substrate and a capacitor is formed on the substrate. The capacitor includes first and second electrodes and a capacitor dielectric between the first and second electrodes. At least one of the first and second electrodes includes a metal layer having carbon nanotubes coupled thereto. In one aspect of certain embodiments, the carbon nanotubes are at least partially coated with an electrically conductive material. In another aspect of certain embodiments, the substrate comprises an organic substrate and the capacitor dielectric comprises a polymer material. Other embodiments are described and claimed.

Abstract translation: 描述了其形成装置和方法，包括含有电容器的电子器件。 在一个实施例中，器件包括衬底，并且在衬底上形成电容器。 电容器包括第一和第二电极以及在第一和第二电极之间的电容器电介质。 第一和第二电极中的至少一个包括具有与其结合的碳纳米管的金属层。 在某些实施方案的一个方面，碳纳米管至少部分地涂覆有导电材料。 在某些实施方案的另一方面，基底包括有机基底，电容器电介质包括聚合物材料。 描述和要求保护其他实施例。

公开(公告)号：US20100134992A1

公开(公告)日：2010-06-03

申请号：US12699939

申请日：2010-02-04

Applicant: Myitzu Soe Myat ,  Mooi Ling Chang ,  Eu Soon Lee ,  Yongki Min ,  King Keong Wong

Inventor： Myitzu Soe Myat ,  Mooi Ling Chang ,  Eu Soon Lee ,  Yongki Min ,  King Keong Wong

IPC: H05K1/18

CPC classification number: H01L23/5223 ,  H01L23/50 ,  H01L23/5228 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/023 ,  H01L2924/00

Abstract: Using die side capacitors and embedded resistors, an advantageous power delivery network may be achieved. In some embodiments, the embedded resistors may be more precisely controllable. The number of die side capacitors may be reduced by combining embedded resistors with these capacitors to reduce costs. The embedded resistors may be provided within the metallization layers either at an upper layer or a lower layer, as two examples.

Abstract translation: 使用裸片侧电容器和嵌入式电阻器，可以实现有利的电力输送网络。 在一些实施例中，嵌入式电阻器可以更精确地可控制。 可以通过将嵌入式电阻器与这些电容器组合来降低芯片侧电容器的数量，以降低成本。 作为两个实例，嵌入式电阻器可以在上层或下层设置在金属化层内。

公开(公告)号：US07572709B2

公开(公告)日：2009-08-11

申请号：US11427532

申请日：2006-06-29

Applicant: Huankiat Seh ,  Yongki Min

Inventor： Huankiat Seh ,  Yongki Min

IPC: H01L21/20

CPC classification number: H05K1/162 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15313 ,  H05K1/112 ,  H05K3/4644 ,  H05K2201/0175 ,  H05K2203/102 ,  H05K2203/1105

Abstract: Some embodiments of the invention include thin film capacitors formed in a package substrate of an integrated circuit package. At least one of the thin film capacitors includes a first electrode layer, a second electrode layer, and a dielectric layer between the first and second electrode layers. Each of the first and second electrode layers and the dielectric layer is formed individually and directly on the package substrate. Other embodiments are described and claimed.

Abstract translation: 本发明的一些实施例包括形成在集成电路封装的封装衬底中的薄膜电容器。 薄膜电容器中的至少一个包括在第一和第二电极层之间的第一电极层，第二电极层和电介质层。 第一和第二电极层和电介质层中的每一个单独形成并直接形成在封装衬底上。 描述和要求保护其他实施例。

公开(公告)号：US07525140B2

公开(公告)日：2009-04-28

申请号：US11304649

申请日：2005-12-14

Applicant: Yongki Min ,  John Guzek

Inventor： Yongki Min ,  John Guzek

IPC: H01L27/108 ,  H01L29/76 ,  H01L29/94 ,  H01L31/119

CPC classification number: H05K1/162 ,  H05K1/113 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/10674

Abstract: In an embodiment, a substrate includes a thin film capacitor embedded within. In an embodiment, a plurality of adhesion holes extend through the thin film capacitor. These adhesion holes may improve the adhesion of the capacitor to other portions of the substrate.

Abstract translation: 在一个实施例中，衬底包括嵌入其中的薄膜电容器。 在一个实施例中，多个粘附孔延伸通过薄膜电容器。 这些粘附孔可以改善电容器与基片的其它部分的粘合性。

公开(公告)号：US20080239620A1

公开(公告)日：2008-10-02

申请号：US11694909

申请日：2007-03-30

Applicant: Yongki Min ,  Daewoong Suh

Inventor： Yongki Min ,  Daewoong Suh

IPC: H01G4/005 ,  H01G4/00

CPC classification number: H01G4/005 ,  H01G4/008 ,  H01G4/33 ,  H01L28/40

Abstract: Devices and methods for their formation, including electronic devices containing capacitors, are described. In one embodiment, a device includes a substrate and a capacitor is formed on the substrate. The capacitor includes first and second electrodes and a capacitor dielectric between the first and second electrodes. At least one of the first and second electrodes includes a metal layer having carbon nanotubes coupled thereto. In one aspect of certain embodiments, the carbon nanotubes are at least partially coated with an electrically conductive material. In another aspect of certain embodiments, the substrate comprises an organic substrate and the capacitor dielectric comprises a polymer material. Other embodiments are described and claimed.

Abstract translation: 描述了其形成装置和方法，包括含有电容器的电子器件。 在一个实施例中，器件包括衬底，并且在衬底上形成电容器。 电容器包括第一和第二电极以及在第一和第二电极之间的电容器电介质。 第一和第二电极中的至少一个包括具有与其结合的碳纳米管的金属层。 在某些实施方案的一个方面，碳纳米管至少部分地涂覆有导电材料。 在某些实施方案的另一方面，基底包括有机基底，电容器电介质包括聚合物材料。 描述和要求保护其他实施例。

公开(公告)号：US20070065973A1

公开(公告)日：2007-03-22

申请号：US11601101

申请日：2006-11-17

Applicant: Yongki Min

Inventor： Yongki Min

IPC: H01L21/00

CPC classification number: H01L23/49822 ,  H01G4/228 ,  H01G4/33 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/162 ,  H05K3/048 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355 ,  H05K2201/09763 ,  Y10T29/417 ,  H01L2924/00

Abstract: An embedded passive structure, its method of formation, and its integration onto a substrate during fabrication are disclosed. In one embodiment, the embedded passive structure is a thin film capacitor (TFC) formed using a thin film laminate that has been mounted onto a substrate. The TFC's capacitor dielectric and/or lower electrode layers are patterned in such a way as to reduce damage and improve cycle time. In one embodiment, the capacitor dielectric has a high dielectric constant and the substrate is an organic packaging substrate.

Abstract translation: 公开了嵌入式被动结构，其形成方法及其在制造过程中与衬底的集成。 在一个实施例中，嵌入式无源结构是使用已经安装在基板上的薄膜层叠体形成的薄膜电容器（TFC）。 TFC的电容器电介质和/或下电极层被图案化以减少损坏并改善循环时间。 在一个实施例中，电容器电介质具有高介电常数，并且衬底是有机封装衬底。

公开(公告)号：US20060097246A1

公开(公告)日：2006-05-11

申请号：US10971829

申请日：2004-10-21

Applicant: Cengiz Palanduz ,  Yongki Min

Inventor： Cengiz Palanduz ,  Yongki Min

IPC: H01L29/08 ,  H05K3/10

CPC classification number: H01G4/12 ,  H01L2224/16225 ,  H05K1/0313 ,  H05K1/092 ,  H05K1/162 ,  H05K2201/017 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/1131 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49155

Abstract: A method including forming a ceramic material directly on a sheet of a first conductive material; forming a second conductive material on the ceramic material; and sintering the ceramic material. A method including forming a ceramic material directly on a sheet of a first conductive material; forming a second conductive material on the ceramic material so that the ceramic material is disposed between the first conductive material and the second conductive material; thermal processing at a temperature sufficient to sinter the ceramic material and form a film of the second conductive material; and coating an exposed surface of at least one of the first conduct material and the second conductive material with a different conductive material. An apparatus including first and second electrodes; and a ceramic material between the first electrode and the second electrode, wherein the ceramic material is sintered directly on one of the first and second electrode.

Abstract translation: 一种包括在第一导电材料的片材上直接形成陶瓷材料的方法; 在所述陶瓷材料上形成第二导电材料; 并烧结陶瓷材料。 一种包括在第一导电材料的片材上直接形成陶瓷材料的方法; 在所述陶瓷材料上形成第二导电材料，使得所述陶瓷材料设置在所述第一导电材料和所述第二导电材料之间; 在足以烧结陶瓷材料并形成第二导电材料的膜的温度下进行热处理; 以及用不同的导电材料涂覆第一导电材料和第二导电材料中的至少一个的暴露表面。 一种包括第一和第二电极的装置; 以及在第一电极和第二电极之间的陶瓷材料，其中陶瓷材料直接烧结在第一和第二电极之一上。

公开(公告)号：US20170179094A1

公开(公告)日：2017-06-22

申请号：US14974978

申请日：2015-12-18

Applicant: Yongki Min ,  Reynaldo A. Olmedo ,  William J. Lambert ,  Kaladhar Radhakrishnan ,  Leigh E. Wojewoda ,  Venkat Anil K. Magadala ,  Clive R. Hendricks

Inventor： Yongki Min ,  Reynaldo A. Olmedo ,  William J. Lambert ,  Kaladhar Radhakrishnan ,  Leigh E. Wojewoda ,  Venkat Anil K. Magadala ,  Clive R. Hendricks

IPC: H01L25/18 ,  H01L23/00 ,  H01L25/16 ,  H01L25/065 ,  H01L23/498 ,  H01L23/522

CPC classification number: H01L25/18 ,  H01F17/00 ,  H01F17/0006 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5227 ,  H01L24/06 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/16265 ,  H01L2924/1427 ,  H01L2924/143 ,  H01L2924/19011 ,  H01L2924/19042

Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.