公开(公告)号：US09624094B1

公开(公告)日：2017-04-18

申请号：US15088557

申请日：2016-04-01

Applicant: Cypress Semiconductor Corporation

Inventor： Shan Sun ,  Ali Keshavarzi ,  Thomas Davenport ,  Thurman John Rodgers

IPC: B81B7/00

CPC classification number: B81B7/007 ,  B81B7/0025 ,  B81B2201/0292 ,  B81B2201/032 ,  B81B2207/07 ,  B81B2207/097 ,  H01L28/57 ,  H01L2224/16225 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A microelectronic system including hydrogen barriers and copper pillars for wafer level packaging and method of fabricating the same are provided. Generally, the method includes: forming an insulating hydrogen barrier over a surface of a first chip; exposing at least a portion of an electrical contact electrically coupled to a component in the first chip by removing a portion of the insulating hydrogen barrier, the component including a material susceptible to degradation by hydrogen; forming a conducting hydrogen barrier over at least the exposed portion of the electrical contact; and forming a copper pillar over the conducting hydrogen barrier. In one embodiment, the material susceptible to degradation is lead zirconate titanate (PZT) and the microelectronic systems device is a ferroelectric random access memory including a ferroelectric capacitor with a PZT ferroelectric layer. Other embodiments are also disclosed.

公开(公告)号：US09617144B2

公开(公告)日：2017-04-11

申请号：US14273845

申请日：2014-05-09

Applicant: INVENSENSE, Inc.

Inventor： Julius Ming-Lin Tsai ,  Baris Cagdaser ,  Martin Lim ,  Aleksey S. Khenkin

IPC: B81B7/02 ,  B81C1/00 ,  H04R1/04 ,  H04R19/04

CPC classification number: B81B7/02 ,  B81B2201/0214 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16152 ,  H04R1/04 ,  H04R19/04 ,  H04R29/004 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.

公开(公告)号：US20170057816A1

公开(公告)日：2017-03-02

申请号：US15249439

申请日：2016-08-28

Applicant: Semiconductor Manufacturing International (Shanghai) Corporation

Inventor： CHAO ZHENG

IPC: B81C1/00 ,  B81B1/00

CPC classification number: B01L3/5027 ,  B81B3/0083 ,  B81B2201/0292 ,  B81B2201/047 ,  H01L31/0203 ,  H01L31/0352 ,  H01L31/08

Abstract: A method for fabricating an MEMS device includes providing a first substrate with a central region and a peripheral region, and forming a plurality of first openings in the peripheral region and a plurality of third openings in the central region by etching the first substrate from a front side. The depth of the first openings is larger than the depth of the third openings. The method further includes forming a photosensitive layer on the surfaces of the first openings and the third openings, bonding a second substrate to the front side of the first substrate, and forming a trench by etching the first substrate from a back side using a patterned mask layer as an etch mask. The trench has a concave bottom surface and exposes a portion of the photosensitive layer formed on the bottom surfaces of the first openings and the third openings.

Abstract translation: 一种用于制造MEMS器件的方法包括：提供具有中心区域和周边区域的第一衬底，以及在周边区域中形成多个第一开口，以及通过从前面蚀刻第一衬底而在中心区域中形成多个第三开口 侧。 第一开口的深度大于第三开口的深度。 该方法还包括在第一开口和第三开口的表面上形成感光层，将第二基板结合到第一基板的正面，并且通过使用图案掩模从背面蚀刻第一基板来形成沟槽 层作为蚀刻掩模。 沟槽具有凹的底表面并且暴露形成在第一开口和第三开口的底表面上的感光层的一部分。

公开(公告)号：US09520505B2

公开(公告)日：2016-12-13

申请号：US13359490

申请日：2012-01-26

Applicant: Goro Nakatani

Inventor： Goro Nakatani

IPC: H01L29/84 ,  B81B3/00 ,  H04R19/00

CPC classification number: H01L29/84 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2201/0292 ,  B81B2203/0109 ,  B81B2203/04 ,  B81B2203/051 ,  H04R19/005

Abstract: A capacitance type MEMS sensor has a first electrode portion and a second electrode portion facing each other. The sensor includes a semiconductor substrate having a recess dug in a thickness direction of the semiconductor substrate, the recess having sidewalls, one of which serves as the first electrode portion. The sensor further includes a diaphragm serving as the second electrode portion, the diaphragm arranged within the recess to face the first electrode portion in a posture extending along a depth direction of the recess, the diaphragm having a lower edge spaced apart from the bottom surface of the recess, and is made of the same material as the semiconductor substrate. The sensor further includes an insulating film arranged to join the diaphragm to the semiconductor substrate.

Abstract translation: 电容型MEMS传感器具有彼此面对的第一电极部分和第二电极部分。 传感器包括在半导体衬底的厚度方向上具有凹陷的半导体衬底，该凹部具有侧壁，其中一个侧壁用作第一电极部分。 传感器还包括用作第二电极部分的隔膜，隔膜布置在凹槽内，以沿凹槽深度方向延伸的姿势面对第一电极部分，该隔膜具有与底部表面间隔开的下边缘 并且由与半导体衬底相同的材料制成。 传感器还包括布置成将隔膜连接到半导体衬底的绝缘膜。

公开(公告)号：US20160139173A1

公开(公告)日：2016-05-19

申请号：US14943498

申请日：2015-11-17

Applicant: Mourad El-Gamal ,  Mohannad Elsayed ,  Paul-Vahe Cicek ,  Frederic Nabki

Inventor： Mourad El-Gamal ,  Mohannad Elsayed ,  Paul-Vahe Cicek ,  Frederic Nabki

IPC: G01P15/125 ,  B81C1/00 ,  G01R33/028 ,  B81B7/00

CPC classification number: G01P15/125 ,  B81B3/0021 ,  B81B7/008 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2201/0292 ,  B81B2203/0109 ,  B81B2203/0307 ,  B81C1/00015 ,  B81C2203/0735 ,  B81C2203/0771 ,  G01P15/18 ,  G01P2015/084 ,  G01R33/0286

Abstract: Considerations for selecting capacitive sensors include accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, integration options with other sensors and/or electronics, and cost effectiveness. It is beneficial if such sensors are amenable to above-IC integration with associated control/readout circuitry for reduced parasitics and reduced footprint through area sharing. The inventors have established a combined Lorentz force based magnetometer and accelerometer MEMS sensor exploiting a low temperature, above-IC-compatible fabrication process operating without requiring vacuum packaging. By switching an electrical current between two perpendicular directions on the device structure a 2D in-plane magnetic field measurement can be achieved whilst concurrently, the device serves as a 1D accelerometer for out-of-plane acceleration, by switching the current off and by monitoring the structure's capacitive change in response to acceleration. The design can thus separate magnetic and inertial force measurements, utilizing a single compact device.

Abstract translation: 选择电容式传感器的注意事项包括精度，重复性，长期稳定性，校准容易性，对化学和物理污染物的抵抗力，尺寸，包装，与其他传感器和/或电子设备的集成选项以及成本效益。 如果这样的传感器适合于与相关的控制/读出电路的IC集成以减少寄生效应并且通过区域共享来减少占地面积是有益的。 本发明人已经建立了一种组合的洛仑兹力量磁力计和加速度计MEMS传感器，利用低温，高于IC的兼容制造工艺，而不需要真空包装。 通过在器件结构上切换两个垂直方向之间的电流，可以在同时进行2D平面内磁场测量，同时通过切断电流和监测器件，作为用于超平面加速度的1D加速度计 结构的电容变化响应加速度。 因此，该设计可以利用单个紧凑装置分离磁力和惯性力测量。

公开(公告)号：US20160103002A1

公开(公告)日：2016-04-14

申请号：US14510224

申请日：2014-10-09

Applicant: InvenSense, Inc.

Inventor： Andy Milota ,  James Lim ,  William Kerry Keal

IPC: G01D18/00 ,  B81B7/02

CPC classification number: G01D18/008 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0292 ,  B81B2207/09 ,  H03L1/00 ,  H03L7/00

Abstract: Various aspects of this disclosure comprise systems and methods for synchronizing sensor data acquisition and/or output. For example, various aspects of this disclosure provide for achieving a desired level of timing accuracy in a MEMS sensor system, even in an implementation in which timer drift is substantial.

Abstract translation: 本公开的各个方面包括用于同步传感器数据采集和/或输出的系统和方法。 例如，本公开的各个方面提供了在MEMS传感器系统中实现期望水平的定时精度，即使在定时器漂移很大的实现中。

公开(公告)号：US09285522B2

公开(公告)日：2016-03-15

申请号：US14320935

申请日：2014-07-01

Applicant: SEIKO EPSON CORPORATION

Inventor： Takahiko Yoshizawa

IPC: B32B3/00 ,  G02B5/28 ,  G01J3/26 ,  G02B26/00 ,  B81C1/00 ,  G01J3/02 ,  G01J3/36 ,  G01J3/51

CPC classification number: G02B5/284 ,  B81B2201/0292 ,  B81C1/00126 ,  G01J3/0213 ,  G01J3/26 ,  G01J3/36 ,  G01J3/51 ,  G02B5/28 ,  G02B26/007 ,  Y10T428/24562 ,  Y10T428/24612

Abstract: A tilt structure includes a shaft section formed on a substrate section, a tilt structure film having one end formed on an upper surface of the shaft section, and the other end bonded to the substrate section, and a thin film section provided to the tilt structure film, located on a corner section composed of the upper surface of the shaft section and a side surface of the shaft section, and having a film thickness thinner than the tilt structure film, the tilt structure film is bent in the thin film section, and an acute angle is formed by the substrate section and the tilt structure film.

Abstract translation: 倾斜结构包括形成在基板部分上的轴部分，倾斜结构膜，其一端形成在轴部分的上表面上，另一端接合到基板部分;以及薄膜部分，设置在倾斜结构 薄膜，位于由所述轴部的上表面构成的角部和所述轴部的侧面之间，并且具有比所述倾斜结构膜更薄的膜厚，所述倾斜结构膜在所述薄膜部弯曲，并且 由基板部和倾斜结构膜形成锐角。

公开(公告)号：US09260289B2

公开(公告)日：2016-02-16

申请号：US14016699

申请日：2013-09-03

Applicant: Jae I. Park

Inventor： Jae I. Park

IPC: B81B3/00 ,  H01L29/06 ,  B81B7/00 ,  G02B6/00 ,  B82Y20/00

CPC classification number: B81B3/0029 ,  B81B3/0021 ,  B81B7/0093 ,  B81B2201/0292 ,  B81B2201/047 ,  B82Y20/00 ,  G02B6/00 ,  G02B6/1225 ,  G02B6/1228

Abstract: An optical-microwave-quantum transducer can include a tapered optical fiber configured to transmit and receive optical signals. The optical-microwave-quantum transducer can also include a cantilever that can include an optical cavity that includes a nanophotonic crystal. The optical cavity can be configured to provide mechanical excitation in response to electromagnetic excitation induced by photons emitted from the tapered optical fiber. The cantilever can also include a mechanical coupler that is configured to induce electrical modulation onto a superconducting cavity in response to the mechanical excitation. The mechanical coupler can also be configured to provide mechanical excitation in response to electromagnetic excitation induced by photons from the superconducting cavity. The optical cavity can further be configured to provide electromagnetic excitation that induces optical modulation on the tapered optical fiber in response to the mechanical excitation.

Abstract translation: 光学微波量子换能器可以包括配置成发送和接收光信号的锥形光纤。 光学微波量子换能器还可以包括悬臂，其可以包括包括纳米光子晶体的光学腔。 光腔可以被配置为响应于从锥形光纤发射的光子引起的电磁激发而提供机械激励。 悬臂还可以包括机械耦合器，其被配置为响应于机械激励而在超导腔上引起电调制。 机械耦合器还可以被配置为响应于来自超导腔的光子引起的电磁激励而提供机械激励。 光腔可以进一步配置成提供响应于机械激励而在锥形光纤上引起光调制的电磁激励。

公开(公告)号：US20160009548A1

公开(公告)日：2016-01-14

申请号：US14688128

申请日：2015-04-16

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Jerod F. MASON ,  Dylan Charles BARTLE ,  David Scott WHITEFIELD ,  Dogan GUNES ,  Paul T. DICARLO ,  David T. PETZOLD

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0041 ,  B81B2201/014 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2201/0292 ,  B81B2207/11 ,  B81C1/00293

Abstract: Microelectromechanical systems (MEMS) having contaminant control features. In some embodiments, a MEMS die can include a substrate and an electromechanical assembly implemented on the substrate. The MEMS die can further include a contaminant control component implemented relative to the electromechanical assembly. The contaminant control component can be configured to move contaminants relative to the electromechanical assembly. For example, such contaminants can be moved away from the electromechanical assembly.

Abstract translation: 具有污染控制特征的微机电系统（MEMS）。 在一些实施例中，MEMS管芯可以包括衬底和在衬底上实现的机电组件。 MEMS管芯还可以包括相对于机电组件实现的污染物控制部件。 污染物控制部件可以配置成相对于机电组件移动污染物。 例如，这种污染物可以从机电组件移开。

公开(公告)号：US09222185B2

公开(公告)日：2015-12-29

申请号：US12933184

申请日：2009-03-12

Applicant: Thomas Cornelius ,  Wolfgang Ensinger ,  Reinhard Neumann ,  Markus Rauber

Inventor： Thomas Cornelius ,  Wolfgang Ensinger ,  Reinhard Neumann ,  Markus Rauber

IPC: B82Y15/00 ,  B82Y30/00 ,  B82Y40/00 ,  C25D1/00 ,  B01J19/00 ,  B01J23/42 ,  B01J23/72 ,  B01J35/00 ,  B22F1/00 ,  B22F3/00 ,  B81C99/00 ,  C25D1/04 ,  C25D1/08 ,  C25D5/18

CPC classification number: C25D1/006 ,  B01J19/0093 ,  B01J23/42 ,  B01J23/72 ,  B01J35/0006 ,  B01J2219/00783 ,  B01J2219/00835 ,  B01J2219/00846 ,  B01J2219/00853 ,  B01J2219/0086 ,  B01J2219/00873 ,  B22F1/0025 ,  B22F3/002 ,  B81B2201/0292 ,  B81B2201/051 ,  B81C99/0085 ,  B82Y15/00 ,  B82Y30/00 ,  B82Y40/00 ,  C25D1/00 ,  C25D1/003 ,  C25D1/04 ,  C25D1/08 ,  C25D5/18 ,  G01F1/688 ,  G01N25/00 ,  Y10S977/762 ,  Y10T29/49117 ,  Y10T428/12201 ,  Y10T428/12389 ,  Y10T428/24562 ,  Y10T428/24893 ,  Y10T428/25

Abstract: The invention concerns a nanowire structural element suited for use in a microreactor system or microcatalyzer system. A template based process is used for the production of the nanowire structural element, wherein the nanowires are electrochemically depositioned in the nanopores. The irradiation is carried out at different angles, such that a nanowire network is formed. The hollow chamber-like structure in the nanowire network is established through the dissolving of the template foil and removal of the dissolved template material. The interconnecting of the nanowires provides stability to the nanowire structural element and an electrical connection between the nanowires is created thereby.

Abstract translation: 本发明涉及适用于微反应器系统或微型催化剂系统的纳米线结构元件。 使用基于模板的工艺来生产纳米线结构元件，其中纳米线被电化学沉积在纳米孔中。 以不同的角度进行照射，形成纳米线网络。 通过模板箔的溶解和去除溶解的模板材料来建立纳米线网络中的中空室状结构。 纳米线的互连提供了对纳米线结构元件的稳定性，并且由此形成纳米线之间的电连接。