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    Layer system comprising a silicon layer and a passivation layer, method for production a passivation layer on a silicon layer and the use of said system and method
    11.
    发明申请
    Layer system comprising a silicon layer and a passivation layer, method for production a passivation layer on a silicon layer and the use of said system and method 有权
    包括硅层和钝化层的层系统，在硅层上制造钝化层的方法以及所述系统和方法的使用

    公开(公告)号：US20060108576A1

    公开(公告)日：2006-05-25

    申请号：US10524610

    申请日：2003-05-06

    Applicant: Franz Laermer ,  Lutz Mueller ,  Winfried Bernhard

    Inventor： Franz Laermer ,  Lutz Mueller ,  Winfried Bernhard

    IPC: H01L29/08

    CPC classification number: H01L21/02252 ,  B81B2203/033 ,  B81C1/00571 ,  B81C2201/016 ,  H01L21/02123 ,  H01L21/02238 ,  H01L21/02337 ,  H01L21/02343 ,  H01L21/02359 ,  H01L21/3121 ,  H01L21/31612 ,  Y10S438/958

    Abstract: A layer system is described including a silicon layer and a passivation layer which is applied at least regionally to the silicon layer's surface, the passivation layer having a first, at least largely inorganic partial layer and a second partial layer, the second partial layer being made of an organic compound including silicon or containing such a material. In particular, the second partial layer is structured in the form of a “self-assembled monolayer.” Furthermore, a method is described for creating a passivation layer on a silicon layer, a first, inorganic partial layer being created on the silicon layer and a second partial layer, containing an organic compound including silicon or being made thereof, being created at least in certain areas on the first partial layer. Both partial layers form the passivation layer. The described layer system or the described method is particularly suited for creating self-supporting structures in silicon.

    Abstract translation: 描述了一种层系统，其包括至少区域地施加到硅层表面的硅层和钝化层，钝化层具有第一至少大部分无机部分层和第二部分层，第二部分层被制成 包含硅或含有这种材料的有机化合物。 特别地，第二部分层以“自组装单层”的形式构成。 此外，描述了一种用于在硅层上形成钝化层的方法，在硅层上形成第一无机部分层，以及第二部分层，其含有包含硅或由其形成的有机化合物，至少在 第一部分图层上的某些区域。 两个部分层形成钝化层。 所描述的层系统或所描述的方法特别适用于在硅中产生自支撑结构。

    Micromechanical component and method for producing same
    12.
    发明申请
    Micromechanical component and method for producing same 有权
    微机械部件及其制造方法

    公开(公告)号：US20050052092A1

    公开(公告)日：2005-03-10

    申请号：US10492896

    申请日：2002-09-05

    Applicant: Franz Laermer

    Inventor： Franz Laermer

    IPC: B81B3/00 ,  B81C1/00 ,  G01C19/5712 ,  G01P15/00 ,  H01L41/08

    CPC classification number: G01C19/5712 ,  B81B3/0086 ,  B81B2201/0242 ,  B81B2203/0136 ,  B81B2203/033 ,  B81C1/00801 ,  B81C2201/0104 ,  B81C2201/016

    Abstract: A micromechanical component and a method for producing the component are provided. The micromechanical component includes a substrate and a micromechanical functional layer of a first material provided over the substrate. The functional layer has a first and second regions, which are connected by a third region of a second material, and at least one of the regions is part of a movable structure, which is suspended over the substrate.

    Abstract translation: 提供微机械部件及其制造方法。 微机械部件包括衬底和设置在衬底上的第一材料的微机械功能层。 功能层具有通过第二材料的第三区域连接的第一和第二区域，并且至少一个区域是悬浮在基板上的可移动结构的一部分。

    SILICON PRESSURE MICRO-SENSING DEVICE AND THE FABRICATION PROCESS
    13.
    发明申请
    SILICON PRESSURE MICRO-SENSING DEVICE AND THE FABRICATION PROCESS 失效
    硅压敏感测装置及制造工艺

    公开(公告)号：US20030068838A1

    公开(公告)日：2003-04-10

    申请号：US09975125

    申请日：2001-10-09

    Inventor： Jin-shown Shie ,  Ji-cheng Lin ,  Chune-te Lin ,  Chih-tang Peng ,  Shih-han Yu ,  Kuo-ning Chiang

    IPC: H01L021/00 ,  H01L029/82

    CPC classification number: B81C1/00182 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C2201/014 ,  B81C2201/016 ,  G01L9/0054

    Abstract: The invention is a silicon pressure micro-sensing device and the fabrication process thereof. The silicon pressure micro-sensing device includes a pressure chamber, and is constituted of a P-type substrate with a taper chamber and an N-type epitaxial layer thereon. On the N-type epitaxial layer are a plurality of piezo-resistance sensing units which sense deformation caused by pressure. The fabrication pressure of the silicon pressure micro-sensing device includes a step of first making a plurality of holes on the N-type epitaxial layer to reach the P-type substrate beneath. Then, by an anisotropic etching stop technique, in which etchant pass through the holes, a taper chamber is formed in the P-type substrate. Finally, an insulating material is applied to seal the holes, thus attaining the silicon pressure micro-sensing device that is able to sense pressure differences between two ends thereof.

    Abstract translation: 本发明是一种硅压力微型感测装置及其制造方法。 硅压力微型感测装置包括压力室，由具有锥形室的P型衬底和其上的N型外延层构成。 在N型外延层上是感测由压力引起的变形的多个压电感测单元。 硅压力微型感测装置的制造压力包括首先在N型外延层上制造多个孔以到达下面的P型衬底的步骤。 然后，通过各向异性蚀刻停止技术，其中蚀刻剂穿过孔，在P型衬底中形成锥形室。 最后，施加绝缘材料以密封孔，从而获得能够感测其两端之间的压力差的硅压力微检测装置。

    LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM
    15.
    发明申请
    LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM 有权
    低剖面堆叠式MEMS谐振器系统

    公开(公告)号：US20150123220A1

    公开(公告)日：2015-05-07

    申请号：US14597825

    申请日：2015-01-15

    Applicant: SiTime Corporation

    Inventor： Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0083 ,  B81B7/007 ,  B81B7/0077 ,  B81B2201/0271 ,  B81B2207/07 ,  B81B2207/094 ,  B81C1/0023 ,  B81C1/00301 ,  B81C1/00333 ,  B81C1/00341 ,  B81C2201/016 ,  B81C2203/0118 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/498 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

    Abstract translation: 用于微机电系统（MEMS）谐振器系统的薄型封装结构包括电引线，其在封装结构的横截面轮廓内的相应的第一和第二高度处具有内部和外部电接触表面，并且模具安装表面 第一和第二高度之间的中间高度。 谐振器控制芯片安装到电引线的管芯安装表面，使得谐振器控制芯片的至少一部分设置在第一和第二高度之间并且引线接合到电气的内部电接触表面 铅。 MEMS谐振器芯片以堆叠的管芯配置安装到谐振器控制芯片，并且电机的谐振器芯片，谐振器控制芯片和内部电接触和管芯安装表面被封装在暴露外部的封装外壳内 电气引线的电接触表面在包装结构的外表面。

    Display device and manufacturing method of the display device
    16.
    发明授权
    Display device and manufacturing method of the display device 有权
    显示装置的显示装置及制造方法

    公开(公告)号：US08970940B2

    公开(公告)日：2015-03-03

    申请号：US13526568

    申请日：2012-06-19

    Applicant: Takuo Kaitoh ,  Takeshi Kuriyagawa ,  Ryou Sakata ,  Osamu Karikome ,  Timothy J. Brosnihan

    Inventor： Takuo Kaitoh ,  Takeshi Kuriyagawa ,  Ryou Sakata ,  Osamu Karikome ,  Timothy J. Brosnihan

    IPC: G02B26/00 ,  G02B26/08 ,  B81B7/00

    CPC classification number: G02B26/0841 ,  B81B7/007 ,  B81B2201/045 ,  B81C2201/0132 ,  B81C2201/016

    Abstract: The MEMS shutter includes a shutter having an aperture part, a first spring connected to the shutter, a first anchor connected to the first spring, a second spring and a second anchor connected to the second spring, an insulation film on a surface of the shutter, the first spring, the second spring, the first anchor and the second anchor, the surfaces being in a perpendicular direction to a surface of a substrate, and the insulation film is not present on a surface of the plurality of terminals, and a surface of the shutter, the first spring, the second spring, the first anchor and the second anchor, the surfaces being in a parallel direction to a surface of the substrate and on the opposite side of the side facing the substrate.

    Abstract translation: MEMS快门包括具有开口部分的快门，连接到快门的第一弹簧，连接到第一弹簧的第一锚杆，连接到第二弹簧的第二弹簧和第二锚固件，在挡板的表面上的绝缘膜 所述第一弹簧，所述第二弹簧，所述第一锚固件和所述第二锚固件，所述表面在垂直于基板表面的方向上，并且所述绝缘膜不存在于所述多个端子的表面上，并且所述表面 所述第一弹簧，所述第二弹簧，所述第一锚固件和所述第二锚固件，所述表面在与所述基板的表面平行的方向上以及在面向所述基板的所述一侧的相对侧上。

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