公开(公告)号：US20230276566A1

公开(公告)日：2023-08-31

申请号：US18195375

申请日：2023-05-10

Applicant: Western Digital Technologies, Inc.

Inventor： Teruhiro Nakamiya ,  Kazuhiro Nagaoka ,  Satoshi Nakamura ,  Nobuyuki Okunaga

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/10

CPC classification number: H05K1/0201 ,  H05K1/115 ,  H05K1/028 ,  H05K3/10 ,  H05K2201/10159 ,  H05K2201/09081

Abstract: A hard disk drive flexible printed circuit (FPC) includes a plurality of fingers extending from a main portion, with each finger having a first wiring layer including a first electrically conductive trace layout, a second wiring layer including a second electrically conductive trace layout, and a base film interposed between the first and second wiring layers, where the first conductive trace layout includes at least one thermally conductive protective island overlaying a respective portion of the second trace layout to provide a protective thermal barrier to the base film. Hence, maximum temperatures across various layers of the FPC laminate can be reduced, damage to the FPC prevented, and manufacturing yields improved.

公开(公告)号：US20230232596A1

公开(公告)日：2023-07-20

申请号：US17576778

申请日：2022-01-14

Applicant: NIO Technology (Anhui) Co., Ltd.

Inventor： Anthony P. Nguyen

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0201 ,  H05K1/14

Abstract: A removable subassembly is provided for use in a circuit board module. The removable subassembly includes a cooling element that is decoupled from an enclosure constructed for the circuit board module. The cooling element can be fastened directly to a daughter card or other printed circuit board of the electronic module and can act as part of the enclosure for the circuit board module. By having the cooling element fastened to the daughter card and being part of the enclosure, the daughter card or other components of the circuit board module can be removed without the need for a complete disassembly of the circuit board module.

公开(公告)号：US20230232590A1

公开(公告)日：2023-07-20

申请号：US17576700

申请日：2022-01-14

Applicant: Dell Products L.P.

Inventor： Eric Michael Tunks ,  Joseph Andrew Vivio ,  Tyler Baxter Duncan

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20163 ,  H05K7/20209 ,  H05K7/20409 ,  H05K1/0201 ,  H05K2201/06

Abstract: A computing device includes a heat dissipation component, a heating or cooling apparatus, and a printed circuit board. The heating or cooling apparatus includes a heating or cooling component and a wire, and the heating or cooling component is affixed to a surface of the heat dissipation component. The printed circuit board includes a printed circuit board component, and the heat dissipation component is affixed to the printed circuit board component and configured to heat or cool the printed circuit board component.

公开(公告)号：US20230221348A1

公开(公告)日：2023-07-13

申请号：US18060463

申请日：2022-11-30

Applicant: Tektronix, Inc.

Inventor： Julie A. Campbell

IPC: G01R1/067 ,  H05K1/02 ,  C09J7/30 ,  C09J11/04 ,  B32B9/00

CPC classification number: G01R1/067 ,  H05K1/0201 ,  C09J7/30 ,  C09J11/04 ,  B32B9/007 ,  H05K2201/0326 ,  C09J2203/326 ,  C09J2301/408 ,  C09J2400/12 ,  B32B7/12

Abstract: A structure has a flexible thermally conductive material having an adhesive surface and a non-adhesive surface, and a thermally conductive adhesive adhered to the adhesive surface of the flexible thermally conductive material leaving the non-adhesive surface exposed to an atmosphere in which the structure resides. A structure has a substrate having one or more conductive paths, and a flexible, thermally conductive material attached to at least a portion of the substrate to draw heat away from the conductive paths. An apparatus has a substrate having one or more conductive paths, a probe tip at one end of the substrate configured to electronically connect with a device under test, and a flexible, thermally conductive material attached to at least a portion of the substrate to draw heat away from the probe tip and conductive paths.

公开(公告)号：US20230219340A1

公开(公告)日：2023-07-13

申请号：US18153419

申请日：2023-01-12

Applicant: SEIKO EPSON CORPORATION

Inventor： Ryota KINOSHITA ,  Taiki HANAGAMI

IPC: B41J2/14 ,  H05K1/02

CPC classification number: B41J2/14 ,  H05K1/0201 ,  B41J2002/14491 ,  H05K2201/064

Abstract: A liquid ejecting head unit includes a first connector configured to be coupled to an external wiring member. The liquid ejecting head unit includes a wiring board having the first connector, a housing for the liquid ejecting head unit, the housing having an opening through which the first connector is exposed outside and having a housing space accommodating the wiring board, and a flexible member in the housing space. The flexible member separates the housing space into a first space that has at least a portion of the first connector and the opening and a second space that is larger than the first space.

公开(公告)号：US11683890B2

公开(公告)日：2023-06-20

申请号：US16227243

申请日：2018-12-20

Applicant: INTEL CORPORATION

Inventor： Jonathan W. Thibado ,  Jeffory L. Smalley ,  John C. Gulick ,  Phi Thanh ,  Mohanraj Prabhugoud

IPC: H05K3/34 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  G06F1/16 ,  H01L23/498

CPC classification number: H05K3/3494 ,  G06F1/16 ,  H01L23/49816 ,  H05K1/0201 ,  H05K1/0212 ,  H05K1/112 ,  H05K1/181 ,  H05K3/3421 ,  H05K2201/10053 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/10734

Abstract: A reflowable grid array (RGA) interposer includes first connection pads on a first surface of a body and second connection pads on a second surface of the body. Heating elements within the body are adjacent to the second connection pads. First interconnects within the body connect some of the second connection pads to the first connection pads. Second interconnects within the body connect pairs of the second connection pads. A motherboard assembly includes first and second components (e.g., CPU with co-processor and/or memory) and the RGA interposer. The first connection pads are in contact with motherboard contacts. The second connection pads are in contact with the first and second components. The first component passes signals directly to the motherboard by the first interconnects. The second component passes signals directly to the first component by the second interconnects but does not pass signals directly to the motherboard by the first interconnects.

公开(公告)号：US11647582B1

公开(公告)日：2023-05-09

申请号：US17412859

申请日：2021-08-26

Applicant: Ian Getreu ,  James A. Holmes ,  Brandon Dyer ,  Jacob Kupernik ,  Matthew Barlow ,  Nicholas Chiolino ,  Anthony Matt Francis

Inventor： Ian Getreu ,  James A. Holmes ,  Brandon Dyer ,  Jacob Kupernik ,  Matthew Barlow ,  Nicholas Chiolino ,  Anthony Matt Francis

IPC: H05K1/03 ,  H05K3/32 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0306 ,  H05K1/0201 ,  H05K3/32 ,  H05K3/4629

Abstract: A multi-layer ceramic wiring board is patterned with arrays of footprints for high-temperature surface mounted device active and passive components on one side of the board that is patterned with arrays of standard SMD footprints to enable placement and attachment of components including primary 2-terminal components and active components where the SMD pads are connected through vias and buried-layer interconnect traces to a multiple connection point arrays on the front and back side of the ceramic wiring board. Each pad is connected to multiple instances of the pad grid to connections to be made with a single post-fired print.

公开(公告)号：US20190098761A1

公开(公告)日：2019-03-28

申请号：US16134733

申请日：2018-09-18

Applicant: TDK CORPORATION

Inventor： Naoyoshi YOSHIDA ,  Kouki YAMADA ,  Hisashi AIBA ,  Kazuto TAKEYA ,  Hiroya NAKAMURA

IPC: H05K1/18 ,  H01G4/005 ,  H01G4/30 ,  H01G4/12 ,  H01G2/06

CPC classification number: H05K1/181 ,  H01C1/148 ,  H01C7/008 ,  H01C7/041 ,  H01C7/18 ,  H01G2/06 ,  H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0201

Abstract: An electronic component includes an element body, a thin film layer disposed to cover a pair of end surfaces and four side surfaces, a first external electrode and a second external electrode, and internal conductors, wherein each of the first external electrode and the second external electrode has first electrode layers disposed on the thin film layer and electrically connected to the internal conductors, and second electrode layers disposed to cover the first electrode layers, and a thermal conductivity of the second electrode layers is lower than a thermal conductivity of the first electrode layers.

公开(公告)号：US20180338820A1

公开(公告)日：2018-11-29

申请号：US16052481

申请日：2018-08-01

Applicant: Align Technology, Inc.

Inventor： Rami Boltanski

IPC: A61C9/00 ,  G02B23/24 ,  A61B5/00 ,  A61B1/00 ,  G02B27/12 ,  H05K1/02 ,  H05K5/02 ,  H05K5/04 ,  G02B26/10 ,  A61B1/247 ,  G01B11/24 ,  G02B3/00 ,  G02B7/00 ,  G02B27/10 ,  H05K1/18 ,  A61B1/12

CPC classification number: A61C9/0053 ,  A61B1/00096 ,  A61B1/00172 ,  A61B1/00186 ,  A61B1/128 ,  A61B1/247 ,  A61B5/0062 ,  A61B5/0068 ,  A61B5/0088 ,  A61B5/4547 ,  A61B2562/0233 ,  G01B11/24 ,  G02B3/0006 ,  G02B7/003 ,  G02B7/008 ,  G02B23/2492 ,  G02B26/10 ,  G02B27/10 ,  G02B27/123 ,  H05K1/0201 ,  H05K1/181 ,  H05K5/0217 ,  H05K5/04 ,  H05K2201/068 ,  H05K2201/10151

Abstract: An optical system comprises a detector to determine one or more intensities of light impinging on one or more locations of the detector and an optical element to direct light towards the detector along a detection axis. The detector and optical element are coupled together by three or more substantially flat flexures respectively defining three or more flexure planes parallel to the detection axis. The three or more substantially flat flexures maintain an alignment of the optical element to the detector with changes in temperature.

公开(公告)号：US10080283B1

公开(公告)日：2018-09-18

申请号：US15589142

申请日：2017-05-08

Applicant: International Business Machines Corporation

Inventor： Bruce J. Chamberlin ,  Scott B. King ,  Joseph Kuczynski ,  David J. Russell

IPC: H05K7/00 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/16

CPC classification number: H05K1/0293 ,  H05K1/0201 ,  H05K1/0263 ,  H05K1/11 ,  H05K1/111 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/182 ,  H05K1/183 ,  H05K1/186 ,  H05K3/341 ,  H05K2201/0308 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/105 ,  H05K2201/10568 ,  H05K2203/043 ,  H05K2203/175 ,  H05K2203/176

Abstract: An apparatus is provided with a component configured with an interface comprising a resilient material. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to the temperature that meets or exceeds the transition temperature of interface causes the resilient material to undergo a state change. The state change of the interface alters the position of the component, including separation of the component from the substrate. The separation disrupts the attachment thereby mitigating damage to the substrate and/or component.