公开(公告)号：US20180138589A1

公开(公告)日：2018-05-17

申请号：US15811817

申请日：2017-11-14

Applicant: ROGERS CORPORATION

Inventor： Joseph S. Clegg ,  Karl Edward Sprentall ,  Aniruddha Shere

IPC: H01Q1/52 ,  H05K1/09 ,  H01Q1/36 ,  H01Q1/24 ,  C08J9/40 ,  C08J9/32 ,  B32B3/26 ,  B32B5/18 ,  B32B7/12 ,  B32B27/06 ,  C08J9/28

CPC classification number: H01Q1/523 ,  B32B3/266 ,  B32B5/18 ,  B32B7/12 ,  B32B27/065 ,  B32B2307/204 ,  B32B2307/72 ,  B32B2457/00 ,  C08J9/28 ,  C08J9/32 ,  C08J9/405 ,  C08J2205/026 ,  C08J2300/00 ,  C08J2400/22 ,  C08J2400/24 ,  H01Q1/243 ,  H01Q1/364 ,  H01Q1/38 ,  H01Q1/521 ,  H01Q15/0086 ,  H05K1/032 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/0116 ,  H05K2201/0145 ,  H05K2201/0154

Abstract: Disclosed herein is a composite metamaterial comprising a polymer foam layer having one or both of a low dielectric constant of less than or equal to 2 and a low magnetic constant of less than or equal to 1, both determined at a frequency of 100 Hz and a temperature of 23° C.; wherein the polymer foam layer comprises a first surface, a second surface, and a plurality of vias that each independently at least partially extend from one or both of the first surface and the second surface into the polymer foam layer; and a via material having one or both of a high dielectric constant greater than the low dielectric constant and a high magnetic constant greater than the low magnetic constant disposed in and filling the plurality of vias.

公开(公告)号：US09920421B2

公开(公告)日：2018-03-20

申请号：US14101032

申请日：2013-12-09

Applicant: APPLIED MATERIALS, INC.

Inventor： Hans-Georg Lotz ,  Neil Morrison ,  Thomas Deppisch

IPC: C23C14/08 ,  C23C14/14 ,  C23C14/34 ,  C23C14/56 ,  C23C14/58 ,  H01J37/34 ,  G06F3/044 ,  G06F3/041 ,  G03F9/00 ,  C23C14/35 ,  H05K1/02 ,  H05K3/00 ,  H05K1/03

CPC classification number: C23C14/562 ,  C23C14/086 ,  C23C14/14 ,  C23C14/3464 ,  C23C14/35 ,  C23C14/5873 ,  G03F9/7042 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  H01J37/3405 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/00 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0326 ,  H05K2201/10128

Abstract: A process for manufacturing a transparent body for a touch screen panel is described. The process includes: depositing a first transparent layer stack over a flexible transparent substrate, wherein said first transparent layer stack includes at least a first dielectric film with a first refractive index, and a second dielectric film with a second refractive index different from the first refractive index; providing a transparent conductive film over the first transparent layer stack; depositing a layer of a conductive material over the transparent conductive film; providing a polymer layer over the layer of a conductive material; imprinting a pattern, e.g. a 3D pattern, on the polymer layer; etching the layer of the conductive material based upon the pattern to form conductive paths for the touch screen panel; and etching the transparent conductive film based upon the pattern to form a structured transparent conductive pattern for touch detection.

公开(公告)号：US20180061521A1

公开(公告)日：2018-03-01

申请号：US15789402

申请日：2017-10-20

Applicant: Chasm Technologies, Inc.

Inventor： Robert F. Praino, JR. ,  Sean P. Arthur ,  David J. Arthur

IPC: H01B1/24 ,  H01B1/02 ,  B32B7/02 ,  B32B5/02 ,  B32B15/02 ,  B32B15/08 ,  B32B27/20 ,  B32B15/20

CPC classification number: H01B1/24 ,  B32B5/02 ,  B32B7/02 ,  B32B15/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B2305/10 ,  B32B2305/30 ,  B32B2307/202 ,  B32B2307/40 ,  B32B2311/08 ,  B32B2311/12 ,  B32B2313/04 ,  B32B2457/00 ,  B32B2551/00 ,  B82Y10/00 ,  C08K3/041 ,  C08K3/08 ,  C08K2003/0806 ,  C09D5/24 ,  C09D7/61 ,  C09D11/52 ,  H01B1/026 ,  H01B1/22 ,  H05K1/095 ,  H05K1/097 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/026 ,  H05K2201/0323 ,  C08L39/06 ,  C08L27/18

Abstract: A transparent conductive film (10) that has a substrate (14) having a surface (14a, 14b), a nanowire layer (12, 12a) over one or more portions of the surface (14a, 14b) of the substrate (14), and a conductive layer (16, 16a) on the portions comprising the nanowire layer (12, 12a), the conductive layer (16, 16a) comprising carbon nanotubes (CNT) and a binder.

公开(公告)号：US20180014403A1

公开(公告)日：2018-01-11

申请号：US15544961

申请日：2016-01-19

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Takashi KASUGA ,  Yoshio OKA ,  Shigeaki UEMURA ,  Jinjoo PARK ,  Hiroshi UEDA ,  Kousuke MIURA

IPC: H05K1/02 ,  H05K3/40 ,  H05K3/18 ,  H05K3/10 ,  C23C28/02 ,  H05K3/06 ,  H05K3/02 ,  H05K1/09 ,  H05K3/42 ,  H05K3/12

CPC classification number: H05K1/0298 ,  C23C28/023 ,  H05K1/09 ,  H05K1/097 ,  H05K3/025 ,  H05K3/064 ,  H05K3/108 ,  H05K3/1283 ,  H05K3/188 ,  H05K3/245 ,  H05K3/381 ,  H05K3/4038 ,  H05K3/424 ,  H05K2201/0116 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2203/072 ,  H05K2203/095 ,  H05K2203/1131

Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties and a sintered layer formed of a plurality of metal particles, the sintered layer being stacked on at least one surface of the base film, in which a region of the sintered layer extending from an interface between the sintered layer and the base film to a position 500 nm or less from the interface has a porosity of 1% or more and 50% or less.

公开(公告)号：US20180007793A1

公开(公告)日：2018-01-04

申请号：US15527530

申请日：2016-09-22

Applicant: BOE Technology Group Co., Ltd. ,  Beijing BOE Display Technology Co., Ltd.

Inventor： Qiang Zhang ,  Bin Zhang ,  Dianzheng Dong ,  Guangxing Wang ,  Kan Zhang

IPC: H05K1/18 ,  H05K5/00 ,  H05K1/02

CPC classification number: H05K1/189 ,  H05K1/0269 ,  H05K1/028 ,  H05K5/0017 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0323 ,  H05K2201/10196 ,  H05K2201/10681 ,  H05K2203/161

Abstract: This disclosure discloses a flexible printed circuit, a chip on film, and a bonding method and a display device using this flexible printed circuit and chip on film. The flexible printed circuit/chip on film of this disclosure a humidity detection layer located between a flexible base film and a metal foil, wherein the humidity detection layer and the flexible base film, and/or the humidity detection layer and the metal foil, are optionally bonded by an adhesive layer. The humidity detection layer can change resistance and/or color according to the humidity, so that intuitive and rapid localization of coating badness is performed directly (by color change) or by means of a detecting lead and an impedance/voltage detecting circuit, and finally the object of reducing the ratio of defective products is achieved.

公开(公告)号：US20170367158A1

公开(公告)日：2017-12-21

申请号：US15675518

申请日：2017-08-11

Applicant: Elemental LED, Inc.

Inventor： Russell Petersen ,  Steven W. Gensler ,  Rick Stellmacher

IPC: H05B33/08 ,  H05K1/18 ,  F21V23/06 ,  F21S4/22 ,  F21V23/00 ,  H05K1/03 ,  F21Y2105/10 ,  F21Y2115/10

CPC classification number: H05B33/0827 ,  F21S4/22 ,  F21V23/005 ,  F21V23/02 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05B33/0809 ,  H05K1/0393 ,  H05K1/189 ,  H05K2201/0145 ,  H05K2201/1006 ,  H05K2201/10106 ,  H05K2201/10522

Abstract: A strip of linear lighting with distributed power conversion is disclosed. The linear lighting includes a flexible PCB. The flexible PCB is divided into repeating blocks, which are arranged electrically in parallel with one another between power and ground. Each repeating block includes power conversion and conditioning circuits. A plurality of LED light engines are connected to the outputs of the power conversion and conditioning circuits, electrically in series with one another. The power conversion and conditioning circuits typically include at least a full-bridge rectifier, and a filter may be connected to each of the LED light engines. A pair of conductors run the length of the PCB adjacent to it and are connected to each of the repeating blocks. A flexible, transparent covering surrounds the PCB and pair of conductors.

公开(公告)号：US09839168B2

公开(公告)日：2017-12-05

申请号：US14610306

申请日：2015-01-30

Applicant: Digi International Inc.

Inventor： Timothy John Miller

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K9/0032 ,  H05K1/0218 ,  H05K9/003 ,  H05K2201/0145 ,  H05K2201/0715

Abstract: Systems and methods for serviceable EMI shielding are provided. In one embodiment, an electronics device comprises: a circuit board; at least one component mounted to the circuit board; an electro-magnetic interference (EMI) shield that encloses the at least one component within a volume of space, wherein the EMI shield comprises: a sheet of shielding material shaped to define a shield fence and a shield cover, wherein the shield fence is mechanically attached to a surface of the circuit board and extends away from the surface; and a kiss-cut feature in the sheet of shielding material between the shield fence and the shield cover.

公开(公告)号：US20170273181A1

公开(公告)日：2017-09-21

申请号：US15240132

申请日：2016-08-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hiesang SOHN ,  Chan KWAK ,  Mi Jeong KIM ,  Hyeon Cheol PARK ,  Weonho SHIN ,  Youngjin CHO

IPC: H05K1/09 ,  C01B31/04 ,  H05K3/22 ,  H05K1/03 ,  H05K3/14

CPC classification number: H05K1/09 ,  C01B31/0484 ,  C01B32/184 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/146 ,  H05K3/22 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2203/0783 ,  Y02E10/50

Abstract: A conductor includes a substrate, a first conductive layer disposed on the substrate and including two or more islands including graphene, and a second conductive layer disposed on the first conductive layer and including a conductive metal nanowire, wherein at least one of an upper surface and a lower surface of the islands including graphene includes a P-type dopant.

公开(公告)号：US09724869B2

公开(公告)日：2017-08-08

申请号：US14583940

申请日：2014-12-29

Applicant: TactoTek Oy

Inventor： Paavo Niskala ,  Jarmo Saaski ,  Pasi Raappana ,  Mikko Heikkinen ,  Mikko Sippari ,  Jarkko Torvinen ,  Antti Keranen

IPC: H05K1/00 ,  B29C51/14 ,  H05K1/18 ,  G06F1/16 ,  H05K3/00 ,  B29L31/34 ,  B29C51/16

CPC classification number: B29C51/14 ,  B29C51/16 ,  B29L2031/3406 ,  B29L2031/3425 ,  B29L2031/3431 ,  B29L2031/3481 ,  G06F1/163 ,  G06F1/1652 ,  G06F1/1658 ,  H05K1/0266 ,  H05K1/0284 ,  H05K1/185 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/284 ,  H05K2201/0108 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/09118 ,  H05K2201/10545 ,  H05K2203/1311 ,  H05K2203/1316

Abstract: Multilayer structure (200) for electronic devices, including a flexible substrate film (102) for accommodating electronics, a number of electrical elements (204, 206) provided to the flexible substrate film, preferably by element of printed electronics and/or surface mounting, a protective layer (104) laminated onto at least first surface of the substrate film, the protective layer being configured to mask perceivable physical deviation of the substrate, such as uneven surface profile or coloring, substantially at the location of the number of elements, from outside perception, optionally visual perception and/or tactile inspection taking place via the protective layer, and plastic layer (106) molded over at least second surface of the substrate film opposite to the first surface. A corresponding method of manufacture is presented.

公开(公告)号：US09723711B2

公开(公告)日：2017-08-01

申请号：US14819040

申请日：2015-08-05

Applicant: MC10, Inc.

Inventor： Brian David Elolampi ,  Roozbeh Ghaffari ,  Bassel de Graff ,  William J. Arora ,  Xiaolong Hu

IPC: H05K1/02 ,  H01L21/683 ,  H05K3/46 ,  H05K3/06 ,  H05K1/11 ,  H05K1/03 ,  H01L23/13 ,  H01L25/065 ,  H01L25/07 ,  H01L25/00 ,  H01L23/498 ,  H01L23/538

CPC classification number: H05K1/0278 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/4985 ,  H01L23/5389 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/1461 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/115 ,  H05K3/067 ,  H05K3/4644 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H01L2924/00

Abstract: Flexible electronic structure and methods for fabricating flexible electronic structures are provided. An example method includes applying a first layer to a substrate, creating a plurality of vias through the first layer to the substrate, and applying a second polymer layer to the first layer such that the second polymer forms anchors contacting at least a portion of the substrate. At least one electronic device layer is disposed on a portion of the second polymer layer. At least one trench is formed through the second polymer layer to expose at least a portion of the first layer. At least a portion of the first layer is removed by exposing the structure to a selective etchant to providing a flexible electronic structure that is in contact with the substrate. The electronic structure can be released from the substrate.