公开(公告)号：US5679928A

公开(公告)日：1997-10-21

申请号：US403779

申请日：1995-03-24

Applicant: Akihiko Okano ,  Terutaka Okano

Inventor： Akihiko Okano ,  Terutaka Okano

IPC: H01R43/02 ,  G02F1/13 ,  H01R4/04 ,  H01R11/01 ,  H01R43/00 ,  H05K3/32 ,  H05K3/36 ,  H05K1/02

CPC classification number: H01R4/04 ,  H05K3/323 ,  G02F1/13452 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2203/0425 ,  H05K3/361 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A connection terminal portion of a substrate and a terminal portion of an external circuit substrate or a terminal portion of a part are electrically connected together using an anisotropic electrically conducting film. A structure in which a first substrate having a connection terminal portion and a second substrate having a connection terminal portion or a connection terminal portion of a part are connected together with an anisotropic electrically conducting adhesive containing electrically conducting particles, wherein the thickness of the electrically conducting film provided for the connection terminal of the first substrate, the second substrate or the part is smaller than the diameter of the electrically conducting particles. The invention is further concerned with a method of accomplishing the electrical connection.

Abstract translation: PCT No.PCT / JP94 / 01240 Sec。 371日期：1995年3月24日 102（e）1995年3月24日PCT PCT 1994年7月27日PCT公布。 公开号WO95 / 04387 日期1995年2月9日使用各向异性导电膜将基板的连接端子部分和外部电路基板的端子部分或部分的端子部分电连接在一起。 一种结构，其中具有连接端子部分的第一基板和具有连接端子部分或部分的连接端子部分的第二基板与包含导电颗粒的各向异性导电粘合剂连接在一起，其中导电 提供给第一基板，第二基板或部分的连接端子的薄膜小于导电颗粒的直径。 本发明还涉及一种完成电连接的方法。

公开(公告)号：US5180888A

公开(公告)日：1993-01-19

申请号：US713822

申请日：1991-06-12

Applicant: Kazuhiro Sugiyama ,  Yoshinori Atsumi

Inventor： Kazuhiro Sugiyama ,  Yoshinori Atsumi

IPC: G02F1/13 ,  G02F1/1339 ,  G02F1/1345 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R4/04 ,  G02F1/1345 ,  H05K3/323 ,  G02F1/1339 ,  G02F1/13452 ,  H01R12/57 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/09036 ,  H05K2201/10681 ,  H05K3/361

Abstract: In a conductive connecting structure for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch, a conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken. However, the insulating layers of the fine connecting particles in the planar direction are not broken and remain as they are. In this conductive connecting structure, even if the ratio of fine connecting particles is increased, and adjacent fine connecting particles are brought into contact with each other, insulating properties can be kept in the planar direction, while conduction is obtained only in the direction of thickness.

Abstract translation: 在用于电连接具有以小间距布置的多个连接端子的第一和第二电子部件的导电连接结构中，在第一和第二电子部件的多个连接端子之间插入导电粘接剂。 通过在绝缘粘合剂中混合多个细连接颗粒来制备导电剂。 每个细连接颗粒被设计成使得在其表面上形成有镀层的细导电颗粒或细绝缘颗粒被由热压接合断裂的材料构成的绝缘层覆盖。 当导电粘合剂在第一和第二电子部件的连接端子之间经受热压接时，由各个精细连接端子推动的细连接颗粒的部分被破坏。 然而，平面方向上的细连接颗粒的绝缘层不会断裂并保持原样。 在该导电连接结构中，即使细连接粒子的比例增加，相邻的细连接粒子彼此接触，也可以在平面方向上保持绝缘性，而仅在厚度方向上获得传导 。

公开(公告)号：US09332642B2

公开(公告)日：2016-05-03

申请号：US14481188

申请日：2014-09-09

Applicant: Panasonic Corporation

Inventor： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/10 ,  H05K3/18 ,  H05K3/40 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/119 ,  H01L2224/81385 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/0032 ,  H05K3/0044 ,  H05K3/0076 ,  H05K3/0079 ,  H05K3/0085 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4007 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0239 ,  H05K2201/0376 ,  H05K2201/0769 ,  H05K2201/09227 ,  H05K2201/09472 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/09972 ,  H05K2203/0108 ,  H05K2203/013 ,  H05K2203/0143 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K2203/0285 ,  H05K2203/0565 ,  H05K2203/0706 ,  H05K2203/0776 ,  H05K2203/1163 ,  Y02P70/611

Abstract: One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 μm or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate.

Abstract translation: 本发明的一个方面涉及一种包括绝缘基底的电路板; 以及电路层，其由导体形成，并且设置在所述绝缘基底基板的表面上，其中所述绝缘基底具有表面粗糙度Ra为0.5μm以下的平滑表面，并且所述导体至少部分地 嵌入形成在绝缘性基板的表面的布线槽。

公开(公告)号：US09093196B2

公开(公告)日：2015-07-28

申请号：US11863379

申请日：2007-09-28

Applicant: Toshifumi Hashiba ,  Kazutoshi Hayakawa ,  Satomi Kudo ,  Kohei Moriyama ,  Tsuyoshi Fujii

Inventor： Toshifumi Hashiba ,  Kazutoshi Hayakawa ,  Satomi Kudo ,  Kohei Moriyama ,  Tsuyoshi Fujii

IPC: H01B1/00 ,  H01B1/20 ,  C08J3/12 ,  H01B1/12 ,  H05K3/32

CPC classification number: H01B1/20 ,  C08J3/12 ,  C08J3/126 ,  C08J2333/20 ,  H01B1/128 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2998

Abstract: Conductive particles each includes a polymer base particle and a conductive layer coating the polymer base particle. Let the compressive elastic deformation characteristic KX of one conductive particle when the displacement of particle diameter of the conductive particles is X % be defined by the following formula: KX=(3/√2)·(SX−3/2)·(R−1/2)·FX. FX is the load (N) necessary for X % displacement of the conductive particles. SX is the compressive deformation amount (mm) upon X % displacement of the conductive particles. R is the particle radius (mm) of the conductive particles. The compressive elastic deformation characteristic K50 when the displacement of particle diameter of the conductive particles is 50% is 100 to 50000 N/mm2 at 20° C., and the recovery factor of particle diameter of the conductive particles when the displacement of particle diameter of the conductive particles is 50% is not less than 30% at 20° C.

Abstract translation: 导电粒子各自包含聚合物基体颗粒和涂覆聚合物基础颗粒的导电层。 使导电粒子的粒径的位移为X％时的一个导电性粒子的压缩弹性变形特性KX由下式定义：KX =（3 /√2）·（SX-3/2）·（R -1/2）·FX。 FX是导电颗粒的X％位移所需的载荷（N）。 SX是导电颗粒的X％位移时的压缩变形量（mm）。 R是导电粒子的粒子半径（mm）。 导电粒子的粒径为50％时的压缩弹性变形特性K50在20℃为100〜50000N / mm 2，当导电粒子的粒径移动时的导电粒子的粒径的回收率 导电颗粒在20℃下为50％不小于30％

公开(公告)号：US08089151B2

公开(公告)日：2012-01-03

申请号：US11500018

申请日：2006-08-07

Applicant: Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

Inventor： Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

IPC: H01L23/48

CPC classification number: H05K3/323 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29444 ,  H01L2224/2989 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19042 ,  H05K2201/0218 ,  H05K2201/0233 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments of the present invention include a conductive particle that includes a conductive nickel/gold (Ni/Au) complex metal layer having a phosphorous content of less than about 1.5 weight percent formed on the surface of a polymer resin particle. Methods of forming the same are also included. A conductive particle with a Ni/Au complex metal layer having less than about 1.5 weight percent of phosphorous may have relatively high conductivity while providing relatively good adhesion of the Ni/Au metal layer to the polymer resin particle.Further embodiments of the present invention provide an anisotropic adhesive composition comprising a conductive particle according to an embodiment of the invention.

Abstract translation: 本发明的实施方案包括导电颗粒，其包含在聚合物树脂颗粒的表面上形成的具有小于约1.5重量％的磷含量的导电镍/金（Ni / Au）复合金属层。 也包括其形成方法。 具有小于约1.5重量％的磷的Ni / Au复合金属层的导电颗粒可以具有相对高的导电性，同时提供Ni / Au金属层对聚合物树脂颗粒的相对良好的粘附。 本发明的其它实施方案提供了包含根据本发明实施方案的导电颗粒的各向异性粘合剂组合物。

公开(公告)号：US07413452B2

公开(公告)日：2008-08-19

申请号：US10969845

申请日：2004-10-22

Applicant: Young-Chul Jeong ,  Eun-Gon Kim ,  Ki-Jung Kim

Inventor： Young-Chul Jeong ,  Eun-Gon Kim ,  Ki-Jung Kim

IPC: H01R4/58

CPC classification number: H01R12/62 ,  H01J2211/46 ,  H01R4/04 ,  H05K1/147 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/1189

Abstract: A plasma display device may include a plasma display panel, a driving circuit portion for driving the plasma display panel, a connecter for electrically connecting electrodes of the plasma display panel with the driving circuit portion, and an interconnecter for electrically connecting the connecter with the plasma display panel. The interconnecter may include an adhesive layer, a plurality of conductive pellets, and a plurality of non-conductive pellets dispersed in the adhesive layer. The conductive pellets may be positioned substantially within a first region where the wiring of the connecter overlaps the electrodes of the plasma display panel. The non-conductive pellets may be positioned substantially at least at a second region other than the first region in the adhesive layer.

Abstract translation: 等离子体显示装置可以包括等离子体显示面板，用于驱动等离子体显示面板的驱动电路部分，用于将等离子体显示面板的电极与驱动电路部分电连接的连接器和用于将连接器与等离子体电连接的互连器 显示面板。 互连器可以包括粘合剂层，多个导电颗粒和分散在粘合剂层中的多个非导电颗粒。 导电颗粒可以位于第一区域中，其中连接器的布线与等离子体显示面板的电极重叠。 非导电性颗粒可以基本上至少位于粘合剂层中除了第一区域之外的第二区域。

公开(公告)号：US20060054867A1

公开(公告)日：2006-03-16

申请号：US10509204

申请日：2003-03-25

Applicant: Yukio Yamada

Inventor： Yukio Yamada

IPC: H01B1/12

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01B1/20 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/30105 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A conductive particle 30 which can be used for connecting a variety of adherends is provided, and the conductive particle 30 includes a resin particle 31, a first conductive particle disposed around the resin particle 31, a first resin coating 25 disposed on the periphery thereof and softer than the resin particle 31, and a second conductive thin film 36 disposed therearound; and if the surface part of, for example, an electrode 13 of an adherend that is to be connected is hard, a first resin coating 35 and the second conductive thin film 36 are destroyed by pressure to bring the second conductive thin film 36 in contact with the electrode 13 and a metal wiring 17. If the surface part of the electrode 13 is soft, the second conductive thin film on the surface side comes in contact with the electrode 13, which makes it possible for the particle to be used regardless of the surface state of an adherend, in other words, be used for connecting a variety of adherends

Abstract translation: 提供了可用于连接各种被粘物的导电粒子30，导电粒子30包括树脂粒子31，设置在树脂粒子31周围的第一导电粒子，设置在其周边的第一树脂被膜25和 比树脂粒子31柔软，以及设置在其周围的第二导电薄膜36。 并且如果例如要连接的被粘物的电极13的表面部分是硬的，则第一树脂涂层35和第二导电薄膜36被压力破坏，以使第二导电薄膜36接触 电极13和金属布线17.如果电极13的表面部分是软的，则表面侧的第二导电薄膜与电极13接触，这使得可以使用颗粒，而不管 被粘物的表面状态，换句话说，用于连接各种被粘体

公开(公告)号：US06447898B1

公开(公告)日：2002-09-10

申请号：US09440337

申请日：1999-11-15

Applicant: Ronald Pfaff

Inventor： Ronald Pfaff

IPC: B32B712

CPC classification number: H01L24/83 ,  C09J7/10 ,  H01B1/22 ,  H01L24/28 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/19043 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0329 ,  H05K2201/2036 ,  Y10T428/2813 ,  Y10T428/2817 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2878 ,  Y10T428/2887 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2996 ,  H01L2924/00

Abstract: Electrically conductive, thermoplastic and heat-activatable adhesive sheet comprising i) a thermoplastic polymer in a proportion of at least 30% by weight, ii) one or more tackifying resins in a proportion of from 5 to 50% by weight and/or iii) epoxy resins with hardeners, with or without accelerators, in a proportion of from 5 to 40% by weight, iv) metallized particles in a proportion of from 0.1 to 40% by weight, v) non-deformable or virtually non-deformable spacer particles, in a proportion of from 1 to 10% by weight, which do not melt at the bonding temperature of the adhesive sheet.

Abstract translation: 导电性，热塑性和热可活化的粘合片，其包含：i）至少30重量％的热塑性聚合物，ii）5重量％至50重量％的一种或多种增粘树脂和/或iii）环氧树脂 硬化剂，有或没有促进剂，其含量为5-40重量％，iv）0.1-40重量％的金属化颗粒，v）不可变形或实际上不可变形的间隔颗粒， 在粘合片的粘合温度下不熔化的比例为1〜10重量％。

公开(公告)号：US06423172B1

公开(公告)日：2002-07-23

申请号：US09582628

申请日：2000-07-07

Applicant: Ciaran McArdle ,  Rory B. Barnes

Inventor： Ciaran McArdle ,  Rory B. Barnes

IPC: B32B3200

CPC classification number: B05D3/207 ,  B05D3/067 ,  B05D7/00 ,  C23C24/08 ,  C23C24/10 ,  C23C26/00 ,  C23C26/02 ,  H01F41/16 ,  H01F41/18 ,  H01F41/34 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/0425 ,  H05K2203/104

Abstract: The present invention provides a variety of interrelated methods of coating non-random and ordered arrays of particles, as well as films containing such arrays. The present invention also relates to the coated non-random and ordered arrays of particles and films prepared therefrom. The coated non-random and ordered arrays are obtained by the use of ferrofluid compositions which may be curable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between conductors.

Abstract translation: 本发明提供了涂覆非随机和有序排列阵列的各种相互关联的方法，以及包含这种阵列的膜。 本发明还涉及由其制备的涂覆的非随机和有序排列的颗粒和膜。 通过使用可固化的铁磁流体组合物获得涂布的非随机和有序阵列。 阵列和膜可以包含可用于电子应用中的导电颗粒，用于实现导体之间的接触。

公开(公告)号：US20020067457A1

公开(公告)日：2002-06-06

申请号：US09988408

申请日：2001-11-19

Inventor： Akira Mase

IPC: G02F001/1339

CPC classification number: G02F1/13452 ,  G02F2203/69 ,  H01R4/04 ,  H05K1/0306 ,  H05K1/148 ,  H05K3/323 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0326 ,  H05K2201/2036

Abstract: A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.