公开(公告)号：US08591750B2

公开(公告)日：2013-11-26

申请号：US12659893

申请日：2010-03-24

Applicant: Hiroyuki Uematsu ,  Kenichi Kawabata ,  Kenji Nagase

Inventor： Hiroyuki Uematsu ,  Kenichi Kawabata ,  Kenji Nagase

IPC: H01B13/00 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K3/427 ,  H05K3/002 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0041 ,  H05K3/0044 ,  H05K3/061 ,  H05K3/064 ,  H05K3/382 ,  H05K3/389 ,  H05K3/421 ,  H05K3/4652 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0394 ,  H05K2203/025 ,  H05K2203/0353 ,  H05K2203/054 ,  H05K2203/0585 ,  H05K2203/0733

Abstract: Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foil 20 composed of a primer resin layer 21 and a metal layer 22 is placed on a surface of a double-face CCL 10, which is prepared by applying metal layers 12 and 13 onto the surfaces of a support base 11, and the primer-coated metal foil 20 and the double-face CCL 10 are bonded and the primer resin layer 21 is cured. A via Vb is thereafter formed from the metal layer 22 side, and a metal-plate layer 30 is formed on the resulting metal layer 22. After that, the etched down metal-plate layer 30 and the metal layer 22 are patterned, and using the patterned layers as a mask, the primer resin layer 21 is patterned. Using the patterned primer resin layer 21 as a mask, the metal layer 12 of the double-face CCL 10 and the metal-plate layer 30 are patterned to form a wiring pattern.

Abstract translation: 提供一种多层布线板的制造方法，即使多层布线板发生翘曲或不均匀，也可以以简单的方式获得用作形成布线层的掩模的具有均匀性的薄膜图案 。 将由底漆树脂层21和金属层22构成的底漆涂布金属箔20放置在双面CCL 10的表面上，该双面CCL 10通过将金属层12和13施加到支撑基底11的表面上而制备 并且底漆涂覆的金属箔20和双面CCL 10被粘合，底漆树脂层21固化。 之后，从金属层22侧形成通孔Vb，在所得到的金属层22上形成金属板层30.之后，对蚀刻后的金属板层30和金属层22进行图案化，使用 作为掩模的图案化层，对底漆树脂层21进行图案化。 使用图案化底漆树脂层21作为掩模，将双面CCL 10的金属层12和金属板层30图案化以形成布线图案。

公开(公告)号：US20130105200A1

公开(公告)日：2013-05-02

申请号：US13807254

申请日：2011-06-29

Applicant: Noriyuki Ohigashi ,  Tadasuke Endo

Inventor： Noriyuki Ohigashi ,  Tadasuke Endo

IPC: B32B19/02 ,  H05K1/02

CPC classification number: B32B19/02 ,  B32B17/04 ,  C08J5/24 ,  C08J2363/00 ,  H01L2224/16227 ,  H05K1/02 ,  H05K1/0366 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/029 ,  H05K2201/0358 ,  Y10T428/24355 ,  Y10T428/2495 ,  Y10T428/252

Abstract: An object of the invention is to provide a prepreg which can be thinner, and has both surfaces which have different application, function, performance or properties to each other, one of which has excellent adhesion to the conductive layer, and the conductive layer which is in contact with the one surface of the prepreg can form a fine circuit, and the present invention provides a prepreg including a core layer containing a fibrous base, a first resin layer which is formed on one surface of the core layer, a second layer which is formed on the other surface of the core layer, and a carrier film which is selected from the group consisting of a metal foil and a resin film and which is laminated on at least one of the surfaces of the first resin layer and the second resin layer, wherein the first resin layer contains a first epoxy resin composition containing silica nanoparticles having an average particle diameter of 1 to 100 nm; a thermoplastic resin selected from the group consisting of a polyimide resin, a polyamide resin, a phenoxy resin, a polyphenylene oxide resin, and a polyether sulfone resin; and an epoxy resin, and the first resin layer is in contact with the fibrous base or a part of the first resin layer is infiltrated into the fibrous base; the second resin layer contains a second epoxy resin composition containing an inorganic filler, and an epoxy resin, and a part of the second resin layer is infiltrated into the fibrous base.

Abstract translation: 本发明的目的是提供一种可以更薄的预浸料，并且具有彼此具有不同应用，功能，性能或性质的两个表面，其中一个对导电层具有优异的粘附性，导电层是 与预浸料坯的一个表面接触可以形成微细电路，本发明提供一种预浸料坯，其包括含有纤维基材的芯层，形成在芯层的一个表面上的第一树脂层，第二层， 形成在芯层的另一个表面上，并且载体膜选自金属箔和树脂膜，并且层压在第一树脂层和第二树脂的至少一个表面上 层，其中所述第一树脂层含有含有平均粒径为1〜100nm的二氧化硅纳米粒子的第一环氧树脂组合物; 选自聚酰亚胺树脂，聚酰胺树脂，苯氧基树脂，聚苯醚树脂和聚醚砜树脂的热塑性树脂; 和环氧树脂，所述第一树脂层与所述纤维基部接触，或者所述第一树脂层的一部分渗透到所述纤维基材中; 第二树脂层含有含有无机填料的第二环氧树脂组合物和环氧树脂，第二树脂层的一部分渗透到纤维基材中。

公开(公告)号：US08357443B2

公开(公告)日：2013-01-22

申请号：US12551802

申请日：2009-09-01

Applicant: Hirohisa Narahashi ,  Shigeo Nakamura ,  Tadahiko Yokota

Inventor： Hirohisa Narahashi ,  Shigeo Nakamura ,  Tadahiko Yokota

IPC: B32B9/00 ,  B32B33/00 ,  B32B17/10 ,  B32B27/08 ,  G11B11/105 ,  G11B5/64 ,  C09J7/02 ,  H05K1/00 ,  H05K1/03 ,  B29C53/82

CPC classification number: H05K3/025 ,  B32B37/025 ,  B32B38/10 ,  B32B2038/0076 ,  B32B2311/00 ,  B32B2457/08 ,  H05K3/386 ,  H05K2201/0358 ,  H05K2203/0264 ,  H05K2203/0769 ,  H05K2203/0786 ,  Y10T428/14 ,  Y10T428/1438 ,  Y10T428/1443 ,  Y10T428/1476 ,  Y10T428/26 ,  Y10T428/263 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/269

Abstract: Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity.

Abstract translation: 通过在基板上层叠具有金属膜的粘合膜来制造电路板，所述金属膜包括依次形成在支撑体上的水溶性聚合物剥离层，金属膜层和固化性树脂组合物层 并且具有能够使固化性树脂组合物层固化后使所述水溶性高分子脱离层从支撑层脱离的脱模性，使得固化性树脂组合物层与基材接触; 固化树脂组合物层; 通过将剥离层溶解在水溶液中，分离保护层，除去存在于金属膜层上的水溶性聚合物释放层，有效地形成绝缘层和与绝缘层的粘合性优异的金属膜层，均匀性 。

公开(公告)号：US08318292B2

公开(公告)日：2012-11-27

申请号：US12921567

申请日：2009-03-19

Applicant: Noriyuki Ohigashi

Inventor： Noriyuki Ohigashi

IPC: B32B3/00

CPC classification number: H05K3/4655 ,  B32B3/266 ,  B32B5/022 ,  B32B5/024 ,  B32B5/147 ,  B32B7/06 ,  B32B7/12 ,  B32B15/14 ,  B32B15/20 ,  B32B2255/062 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/50 ,  B32B2307/538 ,  B32B2307/734 ,  B32B2457/08 ,  H05K3/025 ,  H05K3/4652 ,  H05K2201/0358 ,  Y10T428/24917 ,  Y10T428/249921 ,  Y10T428/24994 ,  Y10T428/252 ,  Y10T428/265 ,  Y10T428/2839 ,  Y10T428/287

Abstract: A resin sheet with a copper foil, comprising: a carrier layer; a copper foil layer having a thickness 0.5 to 5 μm provided over the carrier layer; and an insulating resin layer formed over the copper foil layer, wherein the insulating resin layer is once abutted with base material, and then the carrier layer is delaminated from the copper foil layer, and wherein the insulating resin layer contains a cyanate ester resin having phenolic novolac backbone and a polyfunctional epoxy resin.

Abstract translation: 一种具有铜箔的树脂片，包括：载体层; 设置在载体层上的厚度为0.5〜5μm的铜箔层; 以及形成在铜箔层上的绝缘树脂层，其中绝缘树脂层一旦与基材接触，然后载体层从铜箔层分层，并且其中绝缘树脂层含有具有酚醛树脂的氰酸酯树脂 酚醛清漆骨架和多官能环氧树脂。

公开(公告)号：US20110076802A1

公开(公告)日：2011-03-31

申请号：US12960547

申请日：2010-12-06

Applicant: David C. H. Cheng

Inventor： David C. H. Cheng

IPC: H01L21/50

CPC classification number: H01L24/24 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/5384 ,  H01L23/5389 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/16225 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H05K1/187 ,  H05K3/20 ,  H05K3/4602 ,  H05K2201/0358 ,  H05K2201/10674

Abstract: An embedded chip package process is disclosed. A first substrate having a first patterned circuit layer is provided. A second substrate having a second patterned circuit layer is provided. A dielectric material layer is formed to cover the first patterned circuit layer. A compression process is performed to cover the second substrate over the dielectric material layer and the second patterned circuit layer is embed into the dielectric material layer. A curing process is performed to cure the dielectric material layer after the step of performing the compression process. At least a conductive plug through the dielectric material layer is formed to electrically connect the first patterned circuit layer to the second patterned circuit layer after the step of performing the curing process. The first substrate, the second substrate and a portion of the at least a conductive plug are removed after the step of forming the conductive through hole.

Abstract translation: 公开了一种嵌入式芯片封装工艺。 提供具有第一图案化电路层的第一基板。 提供具有第二图案化电路层的第二基板。 形成介电材料层以覆盖第一图案化电路层。 执行压缩处理以覆盖电介质材料层上的第二衬底，并且将第二图案化电路层嵌入电介质材料层中。 执行固化处理以在执行压缩处理的步骤之后固化电介质材料层。 通过电介质材料层的至少一个导电插塞被形成为在执行固化过程的步骤之后将第一图案化电路层电连接到第二图案化电路层。 在形成导电通孔的步骤之后，去除第一基板，第二基板和至少导电塞子的一部分。

公开(公告)号：US07754803B2

公开(公告)日：2010-07-13

申请号：US10503491

申请日：2003-02-04

Applicant: Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

Inventor： Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

IPC: C08K3/34 ,  C08K5/98 ,  C08L67/02 ,  C08J5/18 ,  C08K5/50 ,  H05K1/03

CPC classification number: H05K1/0373 ,  C08K3/01 ,  H05K1/0393 ,  H05K3/4626 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2201/068

Abstract: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of 1.0×10−3 [° C.−1] or below over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

Abstract translation: 提供了具有改进的物理性能，尺寸稳定性，耐热性和阻燃性的树脂组合物，基材，片，层压板，含树脂铜箔，覆铜层压板，TAB带，印刷电路板，预浸料和粘合片 ，特别是高温物理性能。 含有100重量份热塑性树脂和0.1-65重量份无机化合物的树脂组合物，该树脂组合物的平均线膨胀系数（α2）为1.0×10-3 [℃-1]或 在比树脂组合物的玻璃化转变温度高10℃的温度范围内，比在树脂组合物的玻璃化转变温度高50℃的温度范围内。

公开(公告)号：US20100129604A1

公开(公告)日：2010-05-27

申请号：US12451359

申请日：2008-05-13

Applicant: Makoto Uchida ,  Ryutaro Tanaka ,  Shigeo Hayashimoto

Inventor： Makoto Uchida ,  Ryutaro Tanaka ,  Shigeo Hayashimoto

IPC: B32B15/088 ,  B32B15/092 ,  B32B3/10

CPC classification number: H05K1/0346 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/281 ,  B32B27/34 ,  B32B27/38 ,  B32B2262/101 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/202 ,  B32B2307/208 ,  B32B2307/21 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/718 ,  B32B2457/08 ,  C08G69/32 ,  C09D177/10 ,  H05K3/384 ,  H05K2201/0358 ,  Y10T428/24355 ,  Y10T428/31529 ,  Y10T428/31681

Abstract: An object of the present invention is to provide a copper foil with a resin layer to be used as a resin substrate for a flexible printed wiring board and having good adhesiveness between the copper foil, to which no roughening treatment is applied, and a raw material resin layer.A copper foil with a resin layer characterized in that a copper foil having no roughening treatment applied thereto is directly joined to a resin layer, which contains a phenolic hydroxyl group-containing aromatic polyamide resin having a structure represented by the following formula (1): in the formula (1), m and n denote average values and satisfy the relationship: 0.005≦n/(m+n)

Abstract translation: 本发明的目的是提供一种铜箔，其具有用作柔性印刷线路板的树脂基板的树脂层，并且在不进行粗糙化处理的铜箔和原料之间具有良好的粘附性 树脂层。 一种具有树脂层的铜箔，其特征在于将不进行粗糙化处理的铜箔直接接合到树脂层上，所述树脂层含有具有由下式（1）表示的结构的含酚羟基的芳族聚酰胺树脂： 在式（1）中，m和n表示平均值，满足关系式：0.005＆nlE; n /（m + n）<0.05，m + n为2〜200; Ar1是二价芳族基团; Ar 2是具有酚性羟基的二价芳香族基团，Ar 3是二价芳香族基团。

公开(公告)号：US20100083490A1

公开(公告)日：2010-04-08

申请号：US12632948

申请日：2009-12-08

Applicant: KENICHI KAWABATA ,  Takaaki Morita

Inventor： KENICHI KAWABATA ,  Takaaki Morita

IPC: H05K3/30 ,  H05K3/10

CPC classification number: H05K3/4652 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/185 ,  H05K3/0044 ,  H05K3/0058 ,  H05K3/4602 ,  H05K3/4682 ,  H05K3/4688 ,  H05K2201/0358 ,  H05K2201/09518 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49128 ,  Y10T428/24917 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

Abstract: A multilayer circuit board comprises core layers 101 and 102 made of a core material impregnated with resin, resin layers 111 and 112 interposed between the core layers 101 and 102, a wiring pattern 140 embedded in the resin layers 111 and 112. The core layers 101 and 102 have a thickness of 100 μm or smaller, whereby the entire board can significantly be thinned. Furthermore, the less strong resin layers 111 and 112 are interposed between the hard core layers 101 and 102, whereby the entire board has increased strength.

Abstract translation: 多层电路板包括由浸渍有树脂的芯材制成的芯层101和102，插入在芯层101和102之间的树脂层111和112，嵌入在树脂层111和112中的布线图案140.芯层101 102的厚度为100μm以下，从而能够使整个基板变薄。 此外，较不强的树脂层111和112插入在硬芯层101和102之间，由此整个板具有增加的强度。

公开(公告)号：US20100051338A1

公开(公告)日：2010-03-04

申请号：US12613222

申请日：2009-11-05

Applicant: Kenji Takai ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

Inventor： Kenji Takai ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

IPC: H05K1/02

CPC classification number: H05K3/4655 ,  H05K3/108 ,  H05K3/28 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4652 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T428/12431 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/31681

Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Abstract translation: 本发明涉及一种粘合促进剂金属箔，其包含含有环氧树脂作为金属上不可或缺的成分的粘合助剂层，其中粘合助剂层的厚度为0.1〜10μm。 本发明还涉及作为具有多层的多层布线基板的印刷布线板，其中在绝缘层之间形成粘附辅助剂层。

公开(公告)号：US20100028689A1

公开(公告)日：2010-02-04

申请号：US12183425

申请日：2008-07-31

Applicant: Kam-Chuen Yung ,  Tai-Man Yue

Inventor： Kam-Chuen Yung ,  Tai-Man Yue

IPC: B32B15/092

CPC classification number: B05D7/16 ,  B05D2504/00 ,  B05D2601/20 ,  C08G59/38 ,  C08L63/00 ,  C09D163/00 ,  H05K1/056 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0358 ,  Y10T428/31529 ,  C08L2666/22

Abstract: A thermal conductive dielectric coated metal-plate includes a metal carrier, and a partially cured dielectric layer coated to the metal carrier. The dielectric layer includes an epoxy resin, a filler, and a coupling agent.

Abstract translation: 导热电介质涂覆的金属板包括金属载体和涂覆到金属载体的部分固化的电介质层。 介电层包括环氧树脂，填料和偶联剂。