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公开(公告)号：US20170290184A1
公开(公告)日：2017-10-05
申请号：US15401707
申请日：2017-01-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Min Soo KIM , Ki Man KIM , Chul Hyung YANG , Ji Woo LEE
CPC classification number: H05K7/1427 , G06F1/1626 , G06F1/1658 , H04M1/0274 , H04M1/0277 , H05K1/11 , H05K1/14 , H05K1/147 , H05K1/148 , H05K3/4691 , H05K2201/04 , H05K2201/10189
Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board seated inside the housing, and a second printed circuit board seated inside the housing such that a height of the second printed circuit board from the second surface is different from that of the first printed circuit board, wherein the first printed circuit board includes a mounting part on which at least one component is mounted, a first connector which extends from a first part of the mounting part. A portion of the first connector being substantially perpendicular to the mounting part and configured to be connected to the second printed circuit board, and a second connector which extends from a second part of the mounting part and configured to be connected to the second printed circuit board.
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公开(公告)号：US20170196096A1
公开(公告)日：2017-07-06
申请号：US15398935
申请日：2017-01-05
Applicant: IBIDEN CO., LTD.
Inventor： Teruyuki ISHIHARA , Ayumi SHIBATA , Kosuke IKEDA
CPC classification number: H05K3/4682 , H05K1/113 , H05K1/115 , H05K1/116 , H05K1/181 , H05K3/0035 , H05K3/0097 , H05K3/061 , H05K3/4007 , H05K3/4038 , H05K3/4647 , H05K2201/04 , H05K2201/09863 , H05K2203/1536
Abstract: A printed wiring board includes a resin insulating layer, a projecting conductor layer formed on a surface of the resin insulating layer such that the projecting conductor layer is projecting from the surface of the resin insulating layer, and an integral conductor structure formed in the resin insulating layer and including a via conductor portion and an embedded conductor layer portion such that the embedded conductor layer portion is embedded in the resin insulating layer on the opposite side of the resin insulating layer with respect to the projecting conductor layer and has an exposed surface exposed from the resin insulating layer and the via conductor portion is formed through the resin insulating layer and is connecting the embedded conductor layer portion and projecting conductor layer. The projecting conductor layer and integral conductor structure are formed such that the projecting conductor layer and integral conductor structure are individual conductor structures.
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公开(公告)号：US20170135251A1
公开(公告)日：2017-05-11
申请号：US15276830
申请日：2016-09-27
Applicant: FUJI ELECTRIC CO., LTD.
Inventor： Takashi KUWABARA
CPC classification number: H05K7/20909 , H02M1/143 , H02M7/003 , H02M2001/327 , H05K1/0203 , H05K1/14 , H05K1/181 , H05K7/209 , H05K2201/04 , H05K2201/10015
Abstract: A first printed circuit board on which a heatsink having a discrete semiconductor device attached to it and first capacitors for smoothing an electric current after a conversion from AC to DC are mounted is arranged in the horizontal direction of a bottom portion of a device casing. On the first printed circuit board, various electronic components such as a resistor, a diode, a capacitor, a coil, etc. are mounted in addition to the heatsink and the first capacitors. Further, in an in-device-casing vacant space in an upper portion of the heatsink mounted on the first printed circuit board, a second printed circuit board on which second capacitors for performing smoothing upon a conversion from AC to DC are mounted is arranged orthogonally to the first printed circuit board in the device spacing.
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公开(公告)号：US20170135201A1
公开(公告)日：2017-05-11
申请号：US15410485
申请日：2017-01-19
Applicant: LG Display Co., Ltd.
Inventor： InHo YEO , KyongShik JEON
CPC classification number: H05K1/0218 , H05K1/0219 , H05K1/0296 , H05K1/111 , H05K1/117 , H05K1/118 , H05K1/14 , H05K2201/04 , H05K2201/09709 , H05K2201/09727 , H05K2201/09781 , H05K2201/10128
Abstract: An electronic device connection unit includes a substrate and a plurality of signal pads on the substrate configured to send signals from an electronic device to a driving printed circuit board (PCB). One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device. One or more dummy ground pads on the substrate are configured to connect to the reference voltage of the electronic device without extending onto the driving PCB. One or more connectors are connected to the one or more dummy ground pads, where each of the one or more connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads.
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公开(公告)号：US20170099734A1
公开(公告)日：2017-04-06
申请号：US15052813
申请日：2016-02-24
Applicant: KABUSHIKI KAISHA TOSHIBA
Inventor： Masaya Hirashima , Takahiro Sakaguchi
CPC classification number: H05K1/14 , H05K1/028 , H05K1/111 , H05K3/363 , H05K13/00 , H05K2201/04 , H05K2201/10636 , H05K2201/10651 , H05K2203/167 , Y02P70/611
Abstract: According to one embodiment, a electronic module includes a circuit board including an electronic component mounted thereon, a flexible conducting member including a conductor including a portion covered with a covering member and a portion exposed from an edge of the covering member and soldered to the circuit board, and an engagement member engaging with the flexible conducting member to place the engaged flexible conducting member in a predetermined position on the circuit board and is attached to the circuit board by an attachment method the same as a method of mounting the electronic component on the circuit board.
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Patent Agency Ranking
公开(公告)号：US20150124420A1
公开(公告)日：2015-05-07
申请号：US14071296
申请日：2013-11-04
Applicant: Infineon Technologies AG
Inventor： Alexander Heinrich , Peter Scherl , Magdalena Hoier , Hans-Joerg Timme
CPC classification number: H05K1/11 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/45015 , H01L2224/45028 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45184 , H01L2224/4554 , H01L2224/48091 , H01L2224/48092 , H01L2224/48137 , H01L2224/48227 , H01L2224/48465 , H01L2224/48507 , H01L2224/48511 , H01L2224/85 , H01L2224/85181 , H01L2224/85205 , H01L2224/85207 , H01L2924/00014 , H01L2924/13055 , H01L2924/181 , H05K1/111 , H05K1/14 , H05K3/32 , H05K3/36 , H05K3/4015 , H05K2201/04 , H05K2203/0285 , Y10T29/49126 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00012 , H01L2224/48247 , H01L2224/43 , H01L2224/85399 , H01L2224/05599
Abstract: An electronic device may comprise a semiconductor element and a wire bond connecting the semiconductor element to a substrate. Using a woven bonding wire may improve the mechanical and electrical properties of the wire bond. Furthermore, there may be a cost benefit. Woven bonding wires may be used in any electronic device, for example in power devices or integrated logic devices.
Abstract translation: 电子器件可以包括半导体元件和将半导体元件连接到衬底的引线键合。 使用编织的接合线可以改善引线接合的机械和电学性质。 此外，可能会有成本效益。 编织接合线可用于任何电子设备中，例如功率器件或集成逻辑器件中。
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公开(公告)号：US20240184732A1
公开(公告)日：2024-06-06
申请号：US18526727
申请日：2023-12-01
Applicant: Enfabrica Corporation
Inventor： David Skirmont , Rochan Sankar , Shrijeet Mukherjee
IPC: H05K1/14
CPC classification number: H05K1/141 , H05K2201/04
Abstract: A modular interconnection system is disclosed. In some embodiments, the modular interconnection system comprising a server fabric adapter (SFA) on a primary circuit board, the SFA configured to perform peripheral component interconnect express (PCIe) interconnection or compute express link (CXL) interconnection; a plurality of ports on one or more PCIe slots configured to connect the SFA to external resources; and a PCIe slot adaptation device configured to adapt a first lane count slot of the one or more PCIe slots to support a second lane count device.
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公开(公告)号：US09961763B2
公开(公告)日：2018-05-01
申请号：US15410485
申请日：2017-01-19
Applicant: LG Display Co., Ltd.
Inventor： InHo Yeo , KyongShik Jeon
CPC classification number: H05K1/0218 , H05K1/0219 , H05K1/0296 , H05K1/111 , H05K1/117 , H05K1/118 , H05K1/14 , H05K2201/04 , H05K2201/09709 , H05K2201/09727 , H05K2201/09781 , H05K2201/10128
Abstract: An electronic device connection unit includes a substrate and a plurality of signal pads on the substrate configured to send signals from an electronic device to a driving printed circuit board (PCB). One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device. One or more dummy ground pads on the substrate are configured to connect to the reference voltage of the electronic device without extending onto the driving PCB. One or more connectors are connected to the one or more dummy ground pads, where each of the one or more connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads.
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公开(公告)号：US09877391B2
公开(公告)日：2018-01-23
申请号：US15052813
申请日：2016-02-24
Applicant: KABUSHIKI KAISHA TOSHIBA
Inventor： Masaya Hirashima , Takahiro Sakaguchi
CPC classification number: H05K1/14 , H05K1/028 , H05K1/111 , H05K3/363 , H05K13/00 , H05K2201/04 , H05K2201/10636 , H05K2201/10651 , H05K2203/167 , Y02P70/611
Abstract: According to one embodiment, a electronic module includes a circuit board including an electronic component mounted thereon, a flexible conducting member including a conductor including a portion covered with a covering member and a portion exposed from an edge of the covering member and soldered to the circuit board, and an engagement member engaging with the flexible conducting member to place the engaged flexible conducting member in a predetermined position on the circuit board and is attached to the circuit board by an attachment method the same as a method of mounting the electronic component on the circuit board.
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公开(公告)号：US09839118B2
公开(公告)日：2017-12-05
申请号：US15031369
申请日：2013-11-01
Applicant: TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)
Inventor： Bo Zhou , Junyou Chen , Kun Liu
IPC: H01P3/08 , H01P5/08 , H05K1/14 , H05K1/02 , H01Q1/38 , H01Q1/22 , H01Q1/48 , H05K3/10 , H05K3/46 , H05K1/11
CPC classification number: H05K1/0237 , H01L2924/19107 , H01P3/081 , H01P5/028 , H01Q1/2283 , H01Q1/38 , H01Q1/48 , H05K1/0213 , H05K1/025 , H05K1/117 , H05K1/14 , H05K1/142 , H05K3/10 , H05K3/4644 , H05K2201/04 , H05K2201/0979 , H05K2203/049
Abstract: A wide bandwidth circuit board arrangement includes two coplanar substrates separated by a predetermined gap, and at least one bond wire arranged across the gap and interconnecting a respective conducting microstrip line on a first side of each respective substrate. Further, the arrangement includes at least one open stub arrangement configured on the first side of each respective substrate, each open stub arrangement comprising a microstrip extending at an angle from an end of each conducting strip on each respective substrate. Finally, the arrangement includes a ground layer on a second side of each respective substrate, and a defected ground structure arranged on the second side of each respective substrate and laterally overlapping each respective open stub arrangement arranged on the first side.
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