公开(公告)号：US09516748B2

公开(公告)日：2016-12-06

申请号：US14407074

申请日：2013-06-14

Applicant: OSRAM GmbH

Inventor： Jianghui Yang ,  Chuanpeng Zhong ,  Hao Li ,  Xiaomian Chen

IPC: H05K1/05 ,  H05K1/02 ,  H05K1/18 ,  H05K1/03 ,  H05K3/10 ,  H05K1/14

CPC classification number: H05K1/053 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/056 ,  H05K1/142 ,  H05K1/181 ,  H05K3/10 ,  H05K2201/048 ,  H05K2201/06 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10416 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.

Abstract translation: 各种实施例涉及包括基底和导热层的电路板。 所述基座的一侧面对所述导热层具有第一区域和第二区域，所述第一区域相对于所述第二区域凹陷，所述第一绝缘层容纳在所述第一区域中，形成第二绝缘层 在第二区域上，第一绝缘层和第二绝缘层具有不同的热导率。 此外，各种实施例还涉及电子模块和包括这种电路板的照明装置。 各种实施例还涉及一种用于制造这种电路板的方法。

公开(公告)号：US20160330342A1

公开(公告)日：2016-11-10

申请号：US15105724

申请日：2014-09-10

Applicant: CANON COMPONENTS, INC.

Inventor： Junya KINOSHITA ,  Takashi CHIBA ,  Yuusuke KATO ,  Noboru TATSUISHI

IPC: H04N1/03 ,  H05K1/11 ,  B41J2/01 ,  H05K1/18

CPC classification number: H04N1/03 ,  B41J2/01 ,  H04N2201/0094 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/0047 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09381 ,  H05K2201/10106 ,  H05K2203/167

Abstract: A sensor substrate (13) includes an insertion opening (131) for inserting a light source substrate (32), and a plurality of pads (111) that are arranged along the insertion opening (131). The plurality of pads (111) and an external connection terminal are connected through a solder, and a tip of the pads (111) reaches an opening edge of the insertion opening (131).

Abstract translation: 传感器基板（13）包括用于插入光源基板（32）的插入开口（131）和沿插入开口（131）布置的多个焊盘（111）。 多个焊盘（111）和外部连接端子通过焊料连接，并且焊盘（111）的尖端到达插入开口（131）的开口边缘。

公开(公告)号：US09433077B2

公开(公告)日：2016-08-30

申请号：US14599672

申请日：2015-01-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Thomas J. Brunschwiler ,  Dominic Gschwend ,  Keiji Matsumoto ,  Stefano S. Oggioni ,  Gerd Schlottig ,  Timo J. Tick ,  Jonas Zuercher

IPC: H01L21/76 ,  H05K1/02 ,  H01L23/14 ,  H01L23/373 ,  H05K3/34 ,  H05K3/40 ,  H01L23/498

CPC classification number: H01L23/49822 ,  H01L23/14 ,  H01L23/367 ,  H01L23/3735 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/0298 ,  H05K3/3436 ,  H05K3/4046 ,  H05K2201/048 ,  Y10T29/49126 ,  H01L2924/00

Abstract: A substrate device for electronic circuits or devices includes a first substrate section including a first plurality of layers attached to each other having a first orientation (x2) and a second substrate section including a second plurality of layers attached to each other. The second plurality of layers have a second orientation (x3). The first orientation (x2) and the second orientation (x3) are angled (α) with respect to one another.

Abstract translation: 一种用于电子电路或器件的衬底装置包括：第一衬底部分，包括彼此附接的第一多个层，具有第一取向（x2）;以及第二衬底部分，第二衬底部分包括彼此附接的第二多个层。 第二多个层具有第二取向（x3）。 第一取向（x2）和第二取向（x3）相对于彼此成角度（α）。

公开(公告)号：US09374891B2

公开(公告)日：2016-06-21

申请号：US14410280

申请日：2012-06-20

Applicant: Roman Bartulec ,  Holger Kral ,  Frank Naumann

Inventor： Roman Bartulec ,  Holger Kral ,  Frank Naumann

IPC: H05K1/02 ,  H04R1/08 ,  H05K1/14 ,  H04R25/00

CPC classification number: H05K1/0284 ,  H04R1/08 ,  H04R25/00 ,  H04R25/60 ,  H05K1/142 ,  H05K2201/048 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/10083

Abstract: An electronic unit has a circuit board that is integrated into an injection molded circuit carrier. A hearing aid is provided with such an electronic unit. In order to reduce the complexity and size of an electronic unit with an injection molded circuit carrier and a circuit board, the circuit board is integrated into the injection molded circuit carrier by introducing the circuit board into the plastic mold such that the surface of a first side of the circuit board lies within the plastic mold and the surface of a second side of the circuit board is substantially flush with the surface of the plastic mold. At least one conductive track of the circuit board is electrically conductively connected to at least one conductive track of the injection molded circuit carrier.

Abstract translation: 电子单元具有集成到注塑模制电路载体中的电路板。 助听器设置有这样的电子单元。 为了降低具有注射成型电路载体和电路板的电子单元的复杂性和尺寸，电路板通过将电路板引入塑料模具中而被集成到注射成型电路载体中，使得第一 电路板的一侧位于塑料模具内，并且电路板的第二侧的表面与塑料模具的表面基本上齐平。 电路板的至少一个导电轨道导电地连接到注射成型电路载体的至少一个导电轨道。

公开(公告)号：US09351410B2

公开(公告)日：2016-05-24

申请号：US14201166

申请日：2014-03-07

Applicant: FUJIKURA LTD.

Inventor： Hirokazu Nanjo

IPC: H05K1/16 ,  H05K1/18 ,  H05K1/14 ,  H05K3/46 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48

CPC classification number: H05K3/4694 ,  H01L21/486 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/14 ,  H05K1/14 ,  H05K1/141 ,  H05K1/185 ,  H05K3/4617 ,  H05K2201/048 ,  Y10T29/49126 ,  H01L2224/82 ,  H01L2224/83

Abstract: An electronic component built-in multi-layer wiring board that is configured by collectively stacking a plurality of printed wiring boards therein by thermal compression bonding and that has a plurality of electronic components built in thereto, wherein the electronic components include a first electronic component and a second electronic component having a thickness which is greater than that of the first electronic component, the first electronic component is built in to an embedding-dedicated board set to a thickness which is 80% to 125% of the thickness of the second electronic component, and the embedding-dedicated board and the second electronic component are then mounted on the printed wiring board and thereby built in to the electronic component built-in multi-layer wiring board, and the embedding-dedicated board is formed by an identical material to that of the printed wiring board.

Abstract translation: 一种电子部件内置多层布线基板，其通过热压接而集中堆叠多个印刷布线板而构成，并且具有内置的多个电子部件，其中，所述电子部件包括第一电子部件和 第二电子部件，其厚度大于第一电子部件的厚度，第一电子部件内置于嵌入式专用板中，该嵌入专用板的厚度为第二电子部件的厚度的80％〜125％ ，然后将嵌入式专用板和第二电子部件安装在印刷电路板上，由此内置于电子部件内置的多层布线基板中，嵌入式专用基板由相同的材料形成 印刷电路板的。

公开(公告)号：US20150257273A1

公开(公告)日：2015-09-10

申请号：US14201166

申请日：2014-03-07

Applicant: FUJIKURA LTD.

Inventor： Hirokazu Nanjo

IPC: H05K1/18 ,  H05K3/36 ,  H05K1/14

CPC classification number: H05K3/4694 ,  H01L21/486 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/14 ,  H05K1/14 ,  H05K1/141 ,  H05K1/185 ,  H05K3/4617 ,  H05K2201/048 ,  Y10T29/49126 ,  H01L2224/82 ,  H01L2224/83

Abstract: An electronic component built-in multi-layer wiring board that is configured by collectively stacking a plurality of printed wiring boards therein by thermal compression bonding and that has a plurality of electronic components built in thereto, wherein the electronic components include a first electronic component and a second electronic component having a thickness which is greater than that of the first electronic component, the first electronic component is built in to an embedding-dedicated board set to a thickness which is 80% to 125% of the thickness of the second electronic component, and the embedding-dedicated board and the second electronic component are then mounted on the printed wiring board and thereby built in to the electronic component built-in multi-layer wiring board, and the embedding-dedicated board is formed by an identical material to that of the printed wiring board.

Abstract translation: 一种电子部件内置多层布线基板，其通过热压接而集中堆叠多个印刷布线板而构成，并且具有内置的多个电子部件，其中，所述电子部件包括第一电子部件和 第二电子部件，其厚度大于第一电子部件的厚度，第一电子部件内置于嵌入式专用板中，该嵌入专用板的厚度为第二电子部件的厚度的80％〜125％ ，然后将嵌入式专用板和第二电子部件安装在印刷电路板上，由此内置于电子部件内置的多层布线基板中，嵌入式专用基板由相同的材料形成 印刷电路板的。

公开(公告)号：US20150208497A1

公开(公告)日：2015-07-23

申请号：US14410280

申请日：2012-06-20

Applicant: Roman Bartulec ,  Holger Kral ,  Frank Naumann

Inventor： Roman Bartulec ,  Holger Kral ,  Frank Naumann

IPC: H05K1/02 ,  H04R25/00 ,  H04R1/08

CPC classification number: H05K1/0284 ,  H04R1/08 ,  H04R25/00 ,  H04R25/60 ,  H05K1/142 ,  H05K2201/048 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/10083

Abstract: An electronic unit has a circuit board that is integrated into an injection molded circuit carrier. A hearing aid is provided with such an electronic unit. In order to reduce the complexity and size of an electronic unit with an injection molded circuit carrier and a circuit board, the circuit board is integrated into the injection molded circuit carrier by introducing the circuit board into the plastic mold such that the surface of a first side of the circuit board lies within the plastic mold and the surface of a second side of the circuit board is substantially flush with the surface of the plastic mold. At least one conductive track of the circuit board is electrically conductively connected to at least one conductive track of the injection molded circuit carrier.

Abstract translation: 电子单元具有集成到注塑模制电路载体中的电路板。 助听器设置有这样的电子单元。 为了降低具有注射成型电路载体和电路板的电子单元的复杂性和尺寸，电路板通过将电路板引入塑料模具中而被集成到注射成型电路载体中，使得第一 电路板的一侧位于塑料模具内，并且电路板的第二侧的表面与塑料模具的表面基本上齐平。 电路板的至少一个导电轨道导电地连接到注射成型电路载体的至少一个导电轨道。

公开(公告)号：US08934261B2

公开(公告)日：2015-01-13

申请号：US12489429

申请日：2009-06-23

Applicant: Wey-Jiun Lin ,  Kevin Pan ,  Conrado Sacluti de la Cruz

Inventor： Wey-Jiun Lin ,  Kevin Pan ,  Conrado Sacluti de la Cruz

IPC: H05K1/11 ,  H05K1/14 ,  H01R13/11 ,  H01R12/00 ,  H01R13/66 ,  H01R12/57 ,  H05K3/36

CPC classification number: H01R13/111 ,  H01R9/091 ,  H01R12/57 ,  H01R12/58 ,  H01R13/6675 ,  H05K1/141 ,  H05K1/145 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09181 ,  H05K2201/10189 ,  Y10T29/49002 ,  Y10T29/49117

Abstract: High density electronic device assemblies and techniques for forming high density electronic device assemblies are disclosed. These assemblies and techniques can be used to form compact electronic devices. In one embodiment, substrate arrangements that include a multiple-part substrate can be used to form a high density electronic device assembly. In another embodiment, one or more clips can be used in a high density electronic device assembly to provide mechanical and electrical interconnection between electrical structures that are to be removably coupled together as parts of the high density electronic device assembly. In still another embodiment, a removable cap (and a method for forming the removable cap) can be used for an electronic device housing.

Abstract translation: 公开了用于形成高密度电子器件组件的高密度电子器件组件和技术。 这些组件和技术可用于形成紧凑的电子设备。 在一个实施例中，包括多部分衬底的衬底布置可用于形成高密度电子器件组件。 在另一个实施例中，一个或多个夹子可用于高密度电子器件组件中，以提供电气结构之间的机械和电气互连，电气结构可以作为高密度电子器件组件的部件可拆卸地耦合在一起。 在另一个实施例中，可拆卸盖（以及用于形成可拆卸盖的方法）可用于电子设备外壳。

公开(公告)号：US20140291001A1

公开(公告)日：2014-10-02

申请号：US13888434

申请日：2013-05-07

Applicant: BRIDGE SEMICONDUCTOR CORPORATION

Inventor： Charles W.C. LIN ,  Chia-Chung WANG

IPC: H05K3/42 ,  H05K1/11

CPC classification number: H01L21/56 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/1132 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24101 ,  H01L2224/24221 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92244 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/18162 ,  H01L2924/3511 ,  H05K1/141 ,  H05K1/183 ,  H05K3/4694 ,  H05K2201/048 ,  H05K2203/0152 ,  Y10T29/49165 ,  H01L2224/13099 ,  H01L2924/00

Abstract: The present invention relates to a method of making a hybrid wiring board. In accordance with a preferred embodiment, the method includes: preparing a dielectric layer and a supporting board including a stiffener, a bump/flange sacrificial carrier and an adhesive, wherein the adhesive bonds the stiffener to the sacrificial carrier and the dielectric layer covers the supporting board; then removing the bump and a portion of the flange to form a cavity and expose the dielectric layer; then mounting an interposer into the cavity; and then forming a build-up circuitry that includes a first conductive via in direct contact with the interposer and provides signal routing for the interposer. Accordingly, the direct electrical connection between the interposer and the build-up circuitry is advantageous to high I/O and high performance, and the stiffener can provide adequate mechanical support for the build-up circuitry and the interposer.

Abstract translation: 本发明涉及一种制造混合布线板的方法。 根据优选实施例，该方法包括：制备介电层和包括加强件，凸块/凸缘牺牲载体和粘合剂的支撑板，其中粘合剂将加强件粘合到牺牲载体上，并且介电层覆盖支撑 板; 然后去除所述凸块和所述凸缘的一部分以形成空腔并暴露所述介电层; 然后将插入件安装到空腔中; 然后形成一个积累电路，其包括与插入器直接接触的第一导电通孔，并为插入器提供信号路由。 因此，插入器和积聚电路之间的直接电连接对于高I / O和高性能是有利的，并且加强件可以为积聚电路和插入器提供足够的机械支撑。

公开(公告)号：US20130077252A1

公开(公告)日：2013-03-28

申请号：US13310101

申请日：2011-12-02

Applicant: Ted Ju ,  Chin Chi Lin

Inventor： Ted Ju ,  Chin Chi Lin

IPC: H05K7/20 ,  H05K1/14

CPC classification number: H01L23/36 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/117 ,  H05K1/141 ,  H05K3/368 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/10477 ,  H01L2924/00

Abstract: The invention relates to an electrical connector assembly. The electrical connector assembly includes a main circuit board having a through hole, a processor, and an auxiliary circuit board. The processor includes a chip and a substrate. The chip is electrically connected to the substrate and located in the through hole. The substrate is at least partially located in the through hole. The auxiliary circuit board has a transitional connecting surface. A first conducting region and a second conducting region electrically connected to each other are disposed on the transitional connecting surface. The first conducting region is electrically connected to the substrate, and the second conducting region is electrically connected to the main circuit board.

Abstract translation: 本发明涉及电连接器组件。 电连接器组件包括具有通孔的主电路板，处理器和辅助电路板。 处理器包括芯片和基板。 芯片电连接到基板并位于通孔中。 衬底至少部分地位于通孔中。 辅助电路板具有过渡连接面。 电连接的第一导电区域和第二导电区域设置在过渡连接面上。 第一导电区域电连接到基板，并且第二导电区域电连接到主电路板。