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    CIRCUIT BOARD FOR ELECTRICAL CONNECTOR ADN ELECTRICAL CONNECTOR
    11.
    发明申请
    CIRCUIT BOARD FOR ELECTRICAL CONNECTOR ADN ELECTRICAL CONNECTOR 有权

    公开(公告)号：US20110014818A1

    公开(公告)日：2011-01-20

    申请号：US12935241

    申请日：2009-04-29

    Applicant: Michael Albert Carter ,  Scott David Lee

    Inventor： Michael Albert Carter ,  Scott David Lee

    IPC: H05K1/02 ,  H01R24/00

    CPC classification number: H05K1/0228 ,  H01R9/03 ,  H01R12/721 ,  H01R13/6461 ,  H01R13/6474 ,  H01R13/6658 ,  H05K1/0239 ,  H05K1/165 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09236 ,  H05K2201/10189 ,  Y10S439/941

    Abstract: The invention relates to a circuit board (100) for an electrical connector (400), comprising a plurality of pairs of first contacts (110) disposed at a first end (112) of the circuit board (100) and a plurality of pairs of second contacts (120) disposed at a second end (122), wherein each first contact (110) is connected to a second contact (120) by way of first conductors (115.1-115.8), wherein the first conductors (115.1-115.8) are disposed at least on a first side (104) of the circuit board (110), wherein second conductors (125.2, 125.4, 125.6, 125.8; 135.1, 135.3, 135.5, 135.7) are disposed on a further side (106) of the circuit board (100) and connected to a first contact (110) or a second contact (120), wherein a second conductor (135.1, 135.3, 135.5, 135.7) is associated with a first contact (110.1, 110.3, 110.5, 110.7) of each pair of first contacts (110), wherein the adjacent second conductors (135.1, 135.3, 135.5, 135.7) of the first contacts (110) comprise segments at least partially parallel to each other, and said second conductors are associated with a second contact (120.2, 120.4, 120.6, 120.8) of each pair of second contacts (120), wherein the adjacent second conductors (125.2, 125.4, 125.6, 125.8) of the second contacts comprise segments at least partially parallel to each other, wherein the first contacts (110.1, 110.3, 110.5, 110.7) connected to the second conductors (135.1, 135.3, 135.5, 135.7) are not connected to the second contacts (120.2, 120.4, 120.6, 120.8), which are connected to the second conductors (125.2., 125.4, 125.6, 125.8), wherein the second conductors (135.1, 135.3, 135.5, 135.7) form first coupling regions at the first contacts (110) and the second conductors (125.2, 125.4, 125.6, 125.8) form second coupling regions at the second contacts (120), and to an electrical connector.

    SEMICONDUCTOR MEMORY MODULE AND ELECTRONIC COMPONENT SOCKET FOR COUPLING WITH THE SAME
    12.
    发明申请
    SEMICONDUCTOR MEMORY MODULE AND ELECTRONIC COMPONENT SOCKET FOR COUPLING WITH THE SAME 有权
    半导体存储器模块和电子元件插座与其相连

    公开(公告)号：US20100243308A1

    公开(公告)日：2010-09-30

    申请号：US12411847

    申请日：2009-03-26

    Applicant: DONG YOU KIM ,  Yong Tae Kyeon ,  Ja Yong Ku

    Inventor： DONG YOU KIM ,  Yong Tae Kyeon ,  Ja Yong Ku

    IPC: H05K1/11 ,  H05K1/00

    CPC classification number: H05K1/117 ,  H05K1/0298 ,  H05K3/403 ,  H05K2201/09172 ,  H05K2201/0919

    Abstract: The present invention relates to a semiconductor memory module and an electronic component socket for coupling with the same. A printed circuit board of the semiconductor memory module includes three signal pad arrays longitudinally formed in a row on one sides of a first surface, a second surface and a third surface thereof. Each signal pad array includes a plurality of signal pads. An electronic component socket for coupling with the printed circuit board includes thee pin arrays. Thus, an increased number of the signal pads can be provided while retaining the size of the memory module and the electronic component socket.

    Abstract translation: 本发明涉及半导体存储器模块和与其耦合的电子元件插座。 半导体存储器模块的印刷电路板包括在第一表面，第二表面和第三表面的一侧纵向形成为一排的三个信号垫阵列。 每个信号焊盘阵列包括多个信号焊盘。 用于与印刷电路板耦合的电子元件插座包括引脚阵列。 因此，可以在保持存储器模块和电子部件插座的尺寸的同时提供增加数量的信号焊盘。

    METHOD OF MANUFACTURING A CIRCUIT BOARD ASSEMBLY FOR A CONTROLLER
    13.
    发明申请
    METHOD OF MANUFACTURING A CIRCUIT BOARD ASSEMBLY FOR A CONTROLLER 有权
    制造控制器的电路板组件的方法

    公开(公告)号：US20090151156A1

    公开(公告)日：2009-06-18

    申请号：US11954419

    申请日：2007-12-12

    Applicant: Xiao YAN ,  Thomas J. BERGHERR

    Inventor： Xiao YAN ,  Thomas J. BERGHERR

    IPC: H05K3/00

    CPC classification number: H05K3/366 ,  H05K2201/048 ,  H05K2201/09145 ,  H05K2201/09172 ,  H05K2201/10446 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149

    Abstract: A method of manufacturing a circuit board assembly for a controller. The method includes providing first and second printed circuit boards wherein the first printed circuit board has a plurality of copper pads containing slots therein that correspond to a plurality of power tabs in the second printed circuit board. The power tabs are then slid into the slots and the tabs are flooded with copper. At this time the power tabs are soldered within the slots to provide an electrical connection between the first and second printed circuit boards that allows for the transfer of current between the boards of more than three amps.

    Abstract translation: 一种制造用于控制器的电路板组件的方法。 该方法包括提供第一印刷电路板和第二印刷电路板，其中第一印刷电路板具有多个包含槽的铜焊盘，其对应于第二印刷电路板中的多个电源接头。 电源接头然后滑入插槽中，并且接头被铜淹没。 此时，电源接头焊接在插槽内，以在第一和第二印刷电路板之间提供电连接，允许电路板之间的电流传输超过3安培。

    Light source module
    14.
    发明授权
    Light source module 有权
    光源模块

    公开(公告)号：US07535727B2

    公开(公告)日：2009-05-19

    申请号：US11656525

    申请日：2007-01-23

    Applicant: Tsukasa Tokida

    Inventor： Tsukasa Tokida

    IPC: H05K7/00

    CPC classification number: F21V29/74 ,  F21S41/147 ,  F21S41/192 ,  F21S45/47 ,  F21V29/76 ,  F21Y2115/10 ,  H01L2224/16225 ,  H05K1/117 ,  H05K3/0061 ,  H05K3/328 ,  H05K2201/09172 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/1034

    Abstract: A light source module includes a circuit board on which a predetermined conductive pattern is formed, a semiconductor light emitting element mounted on the circuit board, and a plurality of power supplying terminals to which power cords for supplying electric power to the semiconductor light emitting element are connected. An entire lower face of the circuit board is electrically insulated, and the plurality of power supplying terminals is fixed onto the conductive pattern on the circuit board. The plurality of power supplying terminals protrudes from the circuit board.

    Abstract translation: 光源模块包括其上形成有预定导电图案的电路板，安装在电路板上的半导体发光元件和多个供电端子，用于向半导体发光元件供电的电源线为 连接的。 电路板的整个下表面是电绝缘的，并且多个供电端子固定在电路板上的导电图案上。 多个供电端子从电路板突出。

    Electronic Module Expansion Bridge
    16.
    发明申请
    Electronic Module Expansion Bridge 审中-公开
    电子模块扩展桥

    公开(公告)号：US20090025962A1

    公开(公告)日：2009-01-29

    申请号：US12088546

    申请日：2006-09-29

    Applicant: John A. Gelardi

    Inventor： John A. Gelardi

    IPC: H05K1/00 ,  H05K3/00

    CPC classification number: H05K1/147 ,  H05K1/117 ,  H05K1/141 ,  H05K1/148 ,  H05K3/222 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/09172 ,  H05K2201/0969 ,  Y10T29/49147

    Abstract: Taught herein is an electronic module expansion bridge (115). In an exemplary embodiment, the bridge (115) includes a flexible mounting plate (155). In contact with the mounting plate (155) is a conductive lead (160) with at least one first contact area (165) and at least one second contact area (170). The bridge (115) is configured to connect an electronic module (110), at the first contact area (165), to a conductive trace (125) that is in contact with a substrate (105) at the second contact area (170). In one embodiment, a substrate (105) is used to form a package (100) for enclosing one or more articles. An electronic module (110) is positioned in the package (100) and connected to the conductive trace (125) via the bridge (115). In an alternative embodiment, the bridge (115) is extended to form an inner sleeve to enclose or otherwise cover or protect the electronic module (110).

    Abstract translation: 这里讲的是一个电子模块扩展桥（115）。 在示例性实施例中，桥（115）包括柔性安装板（155）。 与安装板（155）接触的是具有至少一个第一接触区域（165）和至少一个第二接触区域（170）的导电引线（160）。 桥（115）被配置为将第一接触区域（165）处的电子模块（110）连接到在第二接触区域（170）与衬底（105）接触的导电迹线（125） 。 在一个实施例中，衬底（105）用于形成用于封闭一个或多个物品的包装（100）。 电子模块（110）定位在封装（100）中并通过桥（115）连接到导电迹线（125）。 在替代实施例中，桥（115）被延伸以形成内套筒以封闭或以其他方式覆盖或保护电子模块（110）。

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