公开(公告)号：US08569630B2

公开(公告)日：2013-10-29

申请号：US12914378

申请日：2010-10-28

Applicant: Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/00 ,  H05K3/36

CPC classification number: H05K3/4691 ,  H05K2201/09527 ,  H05K2201/096

Abstract: A flex-rigid wiring board having a flexible wiring board, a first insulation layer positioned adjacent to a side of the flexible board and having a first hole which penetrates through the first layer, a second insulation layer laminated over the flexible board and the first layer and having a second hole which penetrates through the second layer, the second hole of the second layer being formed along the axis of the first hole of the first layer, a first conductor structure formed in the first hole and including a filled conductor formed by filling plating in the first hole, and a second conductor structure formed in the second hole and including a filled conductor formed by filling plating in the second hole, the second conductor structure being formed along the axis of the first conductor structure and electrically connected to the first conductor structure.

Abstract translation: 一种具有柔性布线板的挠性刚性布线板，与柔性板的一侧相邻并且具有穿过第一层的第一孔的第一绝缘层，层压在柔性板上的第二绝缘层和第一层 并且具有穿过所述第二层的第二孔，所述第二层的第二孔沿着所述第一层的第一孔的轴线形成，形成在所述第一孔中的第一导体结构，所述第一导体结构包括填充导体， 电镀在第一孔中，第二导体结构形成在第二孔中，并且包括通过在第二孔中填充电镀形成的填充导体，第二导​​体结构沿着第一导体结构的轴线形成并电连接到第一孔 导体结构。

公开(公告)号：US20130264010A1

公开(公告)日：2013-10-10

申请号：US13618322

申请日：2012-09-14

Applicant: Vijay Srinivasan ,  Vamsee K. Pamula ,  Michael G. Pollack

Inventor： Vijay Srinivasan ,  Vamsee K. Pamula ,  Michael G. Pollack

IPC: H05K3/40 ,  H05K3/28

CPC classification number: H05K3/4038 ,  B01L3/502707 ,  B01L3/502784 ,  B01L3/502792 ,  B01L2300/089 ,  B01L2300/12 ,  B01L2400/0427 ,  H05K1/113 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/28 ,  H05K3/421 ,  H05K3/427 ,  H05K2201/09527 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/10

Abstract: Alternative approaches to fabricating printed circuit boards for use in droplet actuator operations are provided. In one embodiment, a method of manufacturing a droplet actuator for conducting droplet operations includes positioning a dielectric material between a first metal layer configured to include an electrode and a second metal layer configured to include an interconnect pad. The method additionally includes forming a connection between the first and second metal layers. Droplet actuators and methods of fabricating and supporting printed circuit boards of droplet actuators are also provided.

Abstract translation: 提供制造用于液滴致动器操作的印刷电路板的替代方法。 在一个实施例中，制造用于进行液滴操作的液滴致动器的方法包括将介电材料定位在被配置为包括电极的第一金属层和被配置为包括互连焊盘的第二金属层之间。 该方法还包括在第一和第二金属层之间形成连接。 还提供了液滴致动器和制造和支持液滴致动器的印刷电路板的方法。

公开(公告)号：US20130235535A1

公开(公告)日：2013-09-12

申请号：US13870199

申请日：2013-04-25

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kazuhiro ISEBO

IPC: H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0306 ,  H05K1/11 ,  H05K3/0044 ,  H05K3/28 ,  H05K3/284 ,  H05K3/4007 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/09527 ,  H05K2201/098 ,  Y10T29/4916

Abstract: A composite substrate includes a ceramic substrate including, on at least one surface, a circuit wire on which an electronic component is to be mounted, a plurality of external connection terminals provided on one surface of the ceramic substrate, and a resin layer provided on the one surface of the ceramic substrate. The external connection terminals have a cross sectional area that decreases with increasing distance from the one surface of the ceramic substrate, and end surfaces of the external connection terminals opposite to end surfaces connected to the ceramic substrate are partially or entirely exposed from the resin layer.

Abstract translation: 复合基板包括陶瓷基板，该陶瓷基板在至少一个表面上包括将要安装电子部件的电路线，设置在陶瓷基板的一个表面上的多个外部连接端子和设置在该陶瓷基板上的树脂层 陶瓷基板的一个表面。 外部连接端子的横截面积随陶瓷基板的一个表面的距离的增加而减小，与陶瓷基板连接的端面相对的外部连接端子的端面部分或全部从树脂层露出。

公开(公告)号：US20120280022A1

公开(公告)日：2012-11-08

申请号：US13551586

申请日：2012-07-17

Applicant: Tzu-Wei Huang

Inventor： Tzu-Wei Huang

IPC: H05K3/00 ,  B23K15/00

CPC classification number: H05K3/4682 ,  B23K11/11 ,  B23K2101/42 ,  B32B37/0084 ,  B32B37/02 ,  B32B37/04 ,  B32B38/04 ,  B32B38/10 ,  B32B2038/047 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2311/00 ,  B32B2311/12 ,  B32B2457/00 ,  B32B2457/08 ,  H05K1/115 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/02 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/46 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/09918 ,  H05K2203/1536 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. Two insulating layers are formed on the two metal layers. Two including upper and bottom conductive layers are formed on the two insulating layers. Then, the two insulating layers and the two conductive layers are laminated so that the two metal layers bonded to each other are embedded between the two insulating layers. A part of the two insulating layers and a part of the two conductive layers are removed to form a plurality of blind holes exposing the two metal layers. A conductive material is formed in the blind holes and on the remained two conductive layers. The sealed area of the two metal layers is separated to form two separated circuit substrates.

Abstract translation: 电路基板的制造方法包括以下步骤。 两个金属层的周边结合形成密封区域。 在两个金属层上形成两个绝缘层。 在两个绝缘层上形成包括上，下导电层的两个。 然后，将两个绝缘层和两个导电层层压，使得彼此接合的两个金属层嵌入在两个绝缘层之间。 去除两个绝缘层的一部分和两个导电层的一部分以形成暴露两个金属层的多个盲孔。 在盲孔和剩余的两个导电层上形成导电材料。 两个金属层的密封区域被分离以形成两个分开的电路基板。

公开(公告)号：US08268246B2

公开(公告)日：2012-09-18

申请号：US12531794

申请日：2008-08-11

Applicant: Vijay Srinivasan ,  Vamsee K. Pamula ,  Michael G. Pollack

Inventor： Vijay Srinivasan ,  Vamsee K. Pamula ,  Michael G. Pollack

IPC: B01J8/00 ,  G01N27/26

CPC classification number: H05K3/4038 ,  B01L3/502707 ,  B01L3/502784 ,  B01L3/502792 ,  B01L2300/089 ,  B01L2300/12 ,  B01L2400/0427 ,  H05K1/113 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/28 ,  H05K3/421 ,  H05K3/427 ,  H05K2201/09527 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/10

Abstract: Alternative approaches to fabricating printed circuit boards for use in droplet actuator operations are provided. In one embodiment, a method of manufacturing a droplet actuator for conducting droplet operations includes positioning a dielectric material between a first metal layer configured to include an electrode and a second metal layer configured to include an interconnect pad. The method additionally includes forming a connection between the first and second metal layers. Droplet actuators and methods of fabricating and supporting printed circuit boards of droplet actuators are also provided.

Abstract translation: 提供制造用于液滴致动器操作的印刷电路板的替代方法。 在一个实施例中，制造用于进行液滴操作的液滴致动器的方法包括将介电材料定位在被配置为包括电极的第一金属层和被配置为包括互连焊盘的第二金属层之间。 该方法还包括在第一和第二金属层之间形成连接。 还提供了液滴致动器和制造和支持液滴致动器的印刷电路板的方法。

公开(公告)号：US08198541B2

公开(公告)日：2012-06-12

申请号：US12519745

申请日：2007-12-14

Applicant: Kenji Sasaoka ,  Yoshitaka Fukuoka

Inventor： Kenji Sasaoka ,  Yoshitaka Fukuoka

IPC: H05K7/20 ,  H01K1/00

CPC classification number: H05K1/0206 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4647 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/49002 ,  H01L2224/0401

Abstract: An electronic component built-in wiring board includes: at least a pair of wiring patterns; an insulating layer disposed between the pair of wiring board; an electronic component embedded in the insulating layer; and a metallic body provided at least on or above a main surface of the electronic component in the insulating layer and thermally contacted with the electronic component.

Abstract translation: 电子部件内置布线板包括：至少一对布线图案; 绝缘层，设置在所述一对布线板之间; 嵌入绝缘层中的电子部件; 以及金属体，其设置在所述绝缘层中至少在所述电子部件的主表面上或上方，并与所述电子部件热接触。

公开(公告)号：US20100288550A1

公开(公告)日：2010-11-18

申请号：US12679615

申请日：2008-07-28

Applicant: Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

Inventor： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

IPC: H05K1/11

CPC classification number: H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/16 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K1/113 ,  H05K3/002 ,  H05K3/4007 ,  H05K2201/0191 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H01L2924/00 ,  H01L2224/05599

Abstract: There has been such a problem that conventional element mounting substrates and circuit devices using such substrates are not easily thinned, as there is a wiring layer formed on each of the substrates and that a part of the wiring layer is protruded and used as a bump electrode. In an element mounting substrate of this invention and a circuit device using such substrate, a through hole is arranged on an insulating base material, and a wiring layer is protruded from the surface of the insulating base material through the through hole. The protruding section of the wiring layer is used as a bump electrode, and a semiconductor element is mounted on the insulating base material. With such structure, the element mounting substrate is thinned, and the circuit device using such substrate is also thinned.

Abstract translation: 存在使用这种基板的常规元件安装基板和电路装置不容易变薄的问题，因为在每个基板上形成布线层，并且布线层的一部分突出并用作凸块电极 。 在本发明的元件安装基板和使用这种基板的电路装置中，在绝缘基材上设置通孔，并且通过贯通孔从绝缘基材的表面突出布线层。 布线层的突出部分用作凸起电极，半导体元件安装在绝缘基材上。 通过这种结构，元件安装基板变薄，并且使用这种基板的电路装置也变薄。

公开(公告)号：US20090140415A1

公开(公告)日：2009-06-04

申请号：US12163150

申请日：2008-06-27

Applicant: Toru FURUTA

Inventor： Toru FURUTA

IPC: H01L23/485

CPC classification number: H05K3/4614 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/113 ,  H05K1/185 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A combination substrate includes a first substrate having wiring board mounting pads for installing a printed wiring board and connection pads on an opposite side of the wiring board mounting pads, a second substrate having package substrate mounting pads for mounting one or more package substrates and having connection pads on an opposite side of the package substrate mounting pads, a middle substrate positioned between the first substrate and the second substrate and including conductive members electrically connecting the connection pads on the first substrate and the connection pads on the second substrate, and a die positioned between the first substrate and the second substrate and mounted on one of the first substrate and the second substrate.

Abstract translation: 组合基板包括具有用于安装印刷线路板的布线板安装焊盘和布线板安装焊盘相对侧上的连接焊盘的第一基板，具有用于安装一个或多个封装基板并具有连接的封装基板安装焊盘的第二基板 位于所述封装衬底安装焊盘的相对侧上的焊盘，位于所述第一衬底和所述第二衬底之间的中间衬底，并且包括电连接所述第一衬底上的连接焊盘和所述第二衬底上的所述连接焊盘的导电构件， 在第一基板和第二基板之间并且安装在第一基板和第二基板中的一个上。

公开(公告)号：US07427716B2

公开(公告)日：2008-09-23

申请号：US11384744

申请日：2006-03-20

Applicant: Christopher C. Jones

Inventor： Christopher C. Jones

IPC: H05K1/00

CPC classification number: H05K3/421 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/15311 ,  H05K1/115 ,  H05K3/243 ,  H05K3/4602 ,  H05K2201/0367 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2203/0574 ,  H05K2203/0733 ,  H05K2203/1476 ,  Y10T29/49165

Abstract: A system may include a first microvia pad, a second microvia pad having a projection extending in a direction toward the first microvia pad, and a microvia electrically coupled to the first microvia pad and to the second microvia pad.

Abstract translation: 系统可以包括第一微孔垫，具有沿朝向第一微孔垫的方向延伸的突起的第二微孔垫，以及电耦合到第一微孔垫和第二微孔垫的微孔。

公开(公告)号：US07339118B1

公开(公告)日：2008-03-04

申请号：US09380994

申请日：1998-03-09

Applicant: Masaru Takada ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Hiroyuki Kobayashi ,  Mitsuhiro Kondo

Inventor： Masaru Takada ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Hiroyuki Kobayashi ,  Mitsuhiro Kondo

IPC: H05K1/03 ,  H05K3/36

CPC classification number: H01L24/49 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/021 ,  H05K1/113 ,  H05K1/114 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/3457 ,  H05K3/385 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2203/0315 ,  H05K2203/0554 ,  H05K2203/1581 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive layer (13) is an external connecting layer which is connected to external connecting terminals (7). The second to (n−1)-th conductive layers (12) are current transmitting layers for transmitting internal currents. The surface of the n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to make the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.

Abstract translation: 在印刷电路板中，奇数（n）个导电层（11-13）和绝缘层（21-23）交替层叠。 第一导电层（11）是部分连接层，第n导电层（13）是连接到外部连接端子（7）的外部连接层。 第二到第（n-1）个导电层（12）是用于传输内部电流的电流传输层。 第n绝缘层（23）的表面露出外部连接端子（7）的状态。 优选制作玻璃布预浸料坯的初始绝缘层和树脂的外部绝缘层。