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    Welded High-Density Low-Profile Interconnect System
    11.
    发明申请
    Welded High-Density Low-Profile Interconnect System 有权
    焊接高密度薄型互连系统

    公开(公告)号：US20160081193A1

    公开(公告)日：2016-03-17

    申请号：US14487869

    申请日：2014-09-16

    Applicant: Apple Inc.

    Inventor： William F. Leggett ,  John Raff

    IPC: H05K1/14 ,  H05K1/11 ,  H05K7/14 ,  H05K1/02

    CPC classification number: H05K7/1427 ,  G06F1/1658 ,  H05K1/189 ,  H05K3/361 ,  H05K3/363 ,  H05K3/368 ,  H05K2201/09918 ,  H05K2201/10128 ,  H05K2203/107

    Abstract: An electronic device may have printed circuits to which electrical components are mounted. The printed circuits may have metal traces that form signal lines and contact pads. Vias or other conductive structures may he used in interconnecting the signal lines to the contact pads. The contact pads may have elongated shapes or other shapes and may he formed in arrays on the printed circuits. Laser welds or other electrical connections may be used to join contact pads on a first printed circuit to respective contact pads on a second printed circuit. The laser welds may form part of a rectangular region of welds or may form part of a non-rectangular region of welds such as a region with a curved edge. Alignment marks may be used in aligning the contact pads.

    Abstract translation: 电子设备可以具有安装电气部件的印刷电路。 印刷电路可以具有形成信号线和接触焊盘的金属迹线。 他可以使用通路或其他导电结构将信号线互连到接触焊盘。 接触垫可以具有细长形状或其他形状，并且可以在印刷电路上以阵列形式。 可以使用激光焊接或其它电连接将第一印刷电路上的接触焊盘连接到第二印刷电路上的相应接触焊盘。 激光焊缝可以形成一个矩形焊缝区域的一部分，或者可以形成非矩形焊接区域的一部分，例如具有弯曲边缘的区域。 对准标记可用于对准接触垫。

    Electronic device module
    12.
    发明授权
    Electronic device module 有权
    电子设备模块

    公开(公告)号：US09167695B2

    公开(公告)日：2015-10-20

    申请号：US13459768

    申请日：2012-04-30

    Applicant: Takuya Asano ,  Masaki Kondoh

    Inventor： Takuya Asano ,  Masaki Kondoh

    IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02

    CPC classification number: H05K1/141 ,  H01L27/3276 ,  H05K1/0269 ,  H05K1/144 ,  H05K3/361 ,  H05K2201/0108 ,  H05K2201/09918 ,  H05K2203/166

    Abstract: An electronic device module includes a first substrate having a first wiring layer and a first alignment mark, the first alignment mark being transparent in a visible region of the electromagnetic spectrum, and a second substrate facing a part of the first substrate and having a second wiring layer and a second alignment mark facing the first alignment mark.

    Abstract translation: 电子设备模块包括具有第一布线层和第一对准标记的第一基板，第一对准标记在电磁光谱的可见区域是透明的，第二基板面对第一基板的一部分，并具有第二布线 层和面向第一对准标记的第二对准标记。

    Apparatus and method for making fiducials on a substrate
    16.
    发明授权
    Apparatus and method for making fiducials on a substrate 有权
    在基板上制作基准的装置和方法

    公开(公告)号：US08992104B2

    公开(公告)日：2015-03-31

    申请号：US13130610

    申请日：2009-12-09

    Applicant: Daniel H. Carlson ,  Daniel J. Theis ,  Brian K. Nelson

    Inventor： Daniel H. Carlson ,  Daniel J. Theis ,  Brian K. Nelson

    IPC: B41J11/46 ,  H05K1/02 ,  B41J3/54 ,  H05K3/00

    CPC classification number: H05K1/0269 ,  B41J3/543 ,  B41J11/46 ,  H05K3/0082 ,  H05K2201/09918 ,  H05K2203/013 ,  H05K2203/107 ,  H05K2203/1545 ,  Y10T83/02 ,  Y10T83/0333

    Abstract: Fiducials having substantially continuous portions made on a substrate allow the position of the substrate to be determined. An approach for making fiducials involves moving first and second fiducial devices together back and forth across the substrate along a trajectory having a component along the lateral axis of the substrate while the substrate and the first and second fiducial devices are in relative motion along the longitudinal axis of the substrate. The first fiducial device operates to make one fiducial on the substrate during the movement along the trajectory and the relative motion. The second fiducial device operates to make another fiducial on the substrate during the movement along the trajectory and the relative motion. The fiducials may be formed so that they have a constant spatial frequency with the first fiducial being out of phase with respect to the second fiducial.

    Abstract translation: 在基板上具有基本上连续的部分的基准允许确定基板的位置。 用于制造基准的方法涉及使第一和第二基准装置沿着具有沿着基板的横向轴线的分量的轨迹穿过基板一起来回移动，同时基板和第一和第二基准装置沿着纵向轴线相对运动 的基底。 第一个基准装置用于在轨迹和相对运动的运动过程中在基板上形成一个基准点。 第二基准装置在沿着轨迹和相对运动的运动期间操作以在基底上形成另一基准。 基准可以被形成为使得它们具有恒定的空间频率，其中第一基准相对于第二基准是异相的。

    OLED DISPLAY DEVICE AND CORRESPONDING FLEXIBLE PRINTED CIRCUIT
    17.
    发明申请
    OLED DISPLAY DEVICE AND CORRESPONDING FLEXIBLE PRINTED CIRCUIT 有权
    OLED显示器件和相应的柔性印刷电路

    公开(公告)号：US20150060782A1

    公开(公告)日：2015-03-05

    申请号：US14226766

    申请日：2014-03-26

    Applicant: Tianma Micro-Electronics Co., Ltd. ,  Shanghai Tianma Micro-Electronics Co., Ltd.

    Inventor： Yujun LI ,  Bengang Zhao

    IPC: H01L51/00 ,  H01L27/32

    CPC classification number: H01L51/0097 ,  H01L27/3244 ,  H01L51/5246 ,  H05K1/0269 ,  H05K1/0306 ,  H05K3/4635 ,  H05K2201/09918 ,  H05K2201/10106 ,  H05K2201/2027

    Abstract: An Organic Light-Emitting Diode (OLED) display device and a corresponding flexible printed circuit (FPC) are disclosed. The display device includes a first substrate and a second substrate arranged in opposition. In addition, frit is arranged on an inner side of the first substrate, and the display device also includes at least one bonding mark, where the bonding mark includes the frit, and at least one sub-bonding mark arranged on a surface of the first substrate. The at least one sub-bonding mark includes a first portion and a second portion arranged apart from each other, and the first portion and the second portion are arranged at an edge of the frit. The FPC includes at least one auxiliary bonding mark aligning the FPC to the OLED display device, where the at least one auxiliary bonding mark is aligned with the at least one sub-bonding mark of the OLED display device.

    Abstract translation: 公开了一种有机发光二极管（OLED）显示装置和相应的柔性印刷电路（FPC）。 显示装置包括第一基板和布置成相对布置的第二基板。 此外，玻璃料布置在第一基板的内侧，并且显示装置还包括至少一个接合标记，其中接合标记包括玻璃料，以及至少一个子接合标记布置在第一基板的表面上 基质。 所述至少一个子接合标记包括彼此分开布置的第一部分和第二部分，并且所述第一部分和所述第二部分布置在所述玻璃料的边缘处。 FPC包括将FPC与OLED显示装置对准的至少一个辅助接合标记，其中至少一个辅助接合标记与OLED显示装置的至少一个子接合标记对准。

    Printed wiring board and method for manufacturing the same
    20.
    发明授权
    Printed wiring board and method for manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号：US08925192B2

    公开(公告)日：2015-01-06

    申请号：US12757163

    申请日：2010-04-09

    Applicant: Kota Noda ,  Tsutomu Yamauchi

    Inventor： Kota Noda ,  Tsutomu Yamauchi

    IPC: H01K3/10 ,  H05K1/11 ,  H05K3/00 ,  H05K3/46 ,  H05K1/02 ,  H05K3/42

    CPC classification number: H05K1/115 ,  H05K1/0269 ,  H05K3/0032 ,  H05K3/0038 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09918 ,  H05K2203/0554 ,  H05K2203/1572 ,  H05K2203/166 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: A method for manufacturing printed wiring board includes irradiating laser on first surface of substrate such that first opening portion having first opening on the first surface and inner diameter decreasing toward the second surface is formed, irradiating laser on second surface of the substrate such that second opening portion having second opening on the second surface and inner diameter decreasing toward the first surface is formed and that the second portion joins the first portion and forms a penetrating hole penetrating through the substrate, forming a first circuit on the first surface, forming a second circuit on the second surface, and filling the hole with plating such that a through-hole conductor which electrically connects the first and second circuits is formed. The first opening has diameter same as or greater than diameter of the second opening, and the first portion has depth less than depth of the second portion.

    Abstract translation: 一种制造印刷电路板的方法，包括：在基板的第一表面上照射激光，使得形成在第一表面上具有第一开口的第一开口部分和朝向第二表面减小的内径;在基板的第二表面上照射激光使得第二开口 形成在第二表面上具有第二开口的部分和朝向第一表面减小的内径，并且第二部分接合第一部分并形成穿透基板的穿透孔，在第一表面上形成第一电路，形成第二电路 在第二表面上，并且用电镀填充孔，从而形成电连接第一和第二电路的通孔导体。 第一开口具有与第二开口的直径相同或更大的直径，并且第一部分的深度小于第二部分的深度。

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