公开(公告)号：US20240268028A1

公开(公告)日：2024-08-08

申请号：US18290728

申请日：2022-07-08

Applicant: HARTING ELECTRONICS GMBH

Inventor： Marc GENAU

IPC: H05K1/14 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K1/145 ,  H05K3/32 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10492 ,  H05K2201/105 ,  H05K2203/167

Abstract: A printed circuit board arrangement, is provided having a first printed circuit board with at least two first contact elements fastened thereto and protruding vertically therefrom, a second printed circuit board with at least two second contact elements fastened thereto, protruding vertically therefrom and corresponding to the first contact elements, and a plastics housing which is mounted on the first printed circuit board and in which the first contact elements are held with a form fit and the second contact elements are mounted displaceably.

公开(公告)号：US20240242740A1

公开(公告)日：2024-07-18

申请号：US18622813

申请日：2024-03-29

Applicant: Intel Corporation

Inventor： Phil GENG ,  Xiang LI ,  George VERGIS

IPC: G11C5/04 ,  H05K1/14 ,  H05K1/18

CPC classification number: G11C5/04 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: A retainer to inhibit movement of dual in-line memory modules (DIMMs) that are removably inserted into connectors attached to a printed circuit board (PCB) of a system. Inhibiting movement of the DIMMs, especially taller DIMMs, such as the higher height 2 U and 4 U DIMMs, mitigates the effects of operational vibration causing intermittent electrical discontinuity between DIMM and the PCB. The retainer inhibits movement of DIMMs at the connector component level by constraining all or a portion of top edges of DIMMs inserted into connectors. The retainer is implemented independently of the design of the system-level chassis. The retainer is shaped into any of a bracket or frame from multiple rigid horizontal, vertical and oblique members that permit airflow to the DIMMs and connectors retained therein.

公开(公告)号：US20240237193A1

公开(公告)日：2024-07-11

申请号：US18618075

申请日：2024-03-27

Applicant: Intel Corporation

Inventor： Yi HUANG ,  Xiaoning YE ,  Kai XIAO ,  James A. McCALL ,  Yanjie ZHU

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/0253 ,  H05K1/117 ,  H05K1/141 ,  H05K2201/10189

Abstract: An apparatus is described. The apparatus includes a memory module. The memory module includes a first printed circuit board having a first transmission line. The first printed circuit board has memory chips disposed thereon. The memory module includes a second printed board having a second transmission line that is coupled to the first transmission line to form a signal path through the first and second printed circuit boards. The second printed circuit board has greater flexibility than the first printed circuit board. The memory module includes a connector to align an I/O that is coupled to the second transmission line with a corresponding I/O that is associated with a motherboard that is to send and/or receive a signal to and/or from the signal path.

公开(公告)号：US12029237B2

公开(公告)日：2024-07-09

申请号：US16425705

申请日：2019-05-29

Applicant: Pax Labs, Inc.

Inventor： Joshua Fu ,  Christopher Loental ,  Marko Markovic ,  Alexander Weiss ,  Alexander Ringrose ,  David Carlberg ,  Robyn Nariyoshi ,  Devin Spratt ,  Nicholas J. Hatton ,  Yen Jen Chang ,  Chen Yu Li ,  Barry Tseng ,  Prince Wang ,  Thomas Germann ,  Andreas Schaefer

IPC: A24F40/40 ,  A24D1/14 ,  A24F7/00 ,  A24F40/10 ,  A61M11/04 ,  A61M15/00 ,  G01N35/00 ,  G08B6/00 ,  H01R13/52 ,  H02J7/00 ,  H05B1/02 ,  H05B3/00 ,  H05K1/14 ,  H05K1/18 ,  A24F15/015 ,  F16J15/02 ,  F17C9/02 ,  G01L13/00 ,  G01P15/00 ,  H01Q1/22

CPC classification number: A24D1/14 ,  A24F7/00 ,  A24F40/40 ,  A61M11/042 ,  A61M15/0028 ,  G01N35/00732 ,  G08B6/00 ,  H01R13/521 ,  H02J7/00 ,  H05B1/0244 ,  H05B3/0014 ,  H05B3/0019 ,  H05K1/147 ,  H05K1/189 ,  A24F15/015 ,  A24F40/10 ,  A61M2205/8206 ,  F16J15/02 ,  F17C9/02 ,  G01L13/00 ,  G01P15/00 ,  H01Q1/2283 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10318

Abstract: Features relating to a vaporizer device including a vaporizer body and a cartridge for connecting to the vaporizer body are provided. The cartridge includes a wireless transceiver positioned proximate a distal end of the cartridge. The wireless transceiver is configured to transmit, receive, and/or store data and to communicate with a subset of remote devices, which may include the vaporizer body and one or more additional devices such as manufacturing, assembly, and filling equipment. The vaporizer body includes wireless communication circuitry that enables communication with remote devices, which may include the cartridge and user devices such as a wireless device. The vaporizer body is configured to identify the cartridge and implement operational instructions and/or apply configuration parameters received from an application and/or based on preset configuration parameters associated with the cartridge.

公开(公告)号：US20240206067A1

公开(公告)日：2024-06-20

申请号：US18533338

申请日：2023-12-08

Applicant: DENSO CORPORATION

Inventor： HIROYOSHI KUNIEDA ,  YUICHIRO SASAKI ,  MASASHI HIRAMATSU

IPC: H05K1/14 ,  H05K1/18

CPC classification number: H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/0367 ,  H05K2201/10189

Abstract: An electronic device includes first, second, and third circuit components, a reinforcing member, and electrical connectors. The second circuit component includes a surface on which the first circuit component mounts. The second circuit component is electrically connected to the first circuit component. The reinforcing member is in contact with the first circuit component and the surface of the second circuit component, and reinforces a connection between the first and second circuit components. The third circuit component has a mounting surface on which the second circuit component mounts, and is electrically connected the second circuit component. The electrical connectors include at least one electrical connecting portion establishing an electrical connection between the second circuit component and the third circuit component. At least one section of each of the electrical connectors is outside a member facing portion facing the reinforcing member.

公开(公告)号：US11985454B2

公开(公告)日：2024-05-14

申请号：US17994574

申请日：2022-11-28

Applicant: Ciena Corporation

Inventor： Simon J. E. Shearman ,  Fabien Colton ,  Daniel Rivaud ,  Michael R. Bishop

IPC: H05K5/00 ,  H04Q1/02 ,  H04Q1/06 ,  H04Q3/00 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K5/02 ,  H05K7/02 ,  H05K7/14

CPC classification number: H04Q1/09 ,  H04Q1/025 ,  H04Q1/035 ,  H04Q1/066 ,  H04Q3/0066 ,  H05K1/00 ,  H05K1/0209 ,  H05K1/0284 ,  H05K1/144 ,  H05K1/181 ,  H05K1/182 ,  H05K5/00 ,  H05K5/0026 ,  H05K5/0213 ,  H05K7/023 ,  H05K7/1422 ,  H04Q2213/13322 ,  H04Q2213/13523 ,  H05K2201/10189

Abstract: A module for a networking node is disclosed. The module includes a Printed Circuit Board (“PCB”); one or more circuits mounted to the PCB; and a faceplate that including a plurality of plates, angled relative to one another, such that the faceplate includes increased surface area relative to a substantially flat faceplate, wherein at least two plates of the plurality of plates include physical ports each having track lengths to a circuit of one or more circuits, wherein one or more of the physical ports support signals at a rate of at least 100 Gbps. Each plate of the plurality of plates can be flat. Any of the plurality of plates can include physical ports. The physical ports can be pluggable modules. Each type of the physical ports can be a same type on a given plate.

公开(公告)号：US11955706B2

公开(公告)日：2024-04-09

申请号：US17594495

申请日：2019-04-25

Applicant: LG ELECTRONICS INC.

Inventor： Seungwoo Ryu ,  Joohee Lee ,  Junyoung Jung

IPC: H05K1/14 ,  H01Q1/48 ,  H01Q21/06 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01Q1/48 ,  H01Q21/06 ,  H05K1/0225 ,  H05K1/0251 ,  H05K1/181 ,  H05K2201/10189

Abstract: An electronic device according to the present invention comprises: a first multi-layer printed circuit board (PCB) including a transceiver circuit; a second multi-layer PCB including an antenna; and a connector configured to connect the first multi-layer PCB and the second multi-layer PCB to each other, wherein the first and the second multi-layer PCB include signal transmission lines configuring a vertical connection for signal transfer between different layers, and include multiple adjacent ground patterns configuring a vertical ground connection between the different boards. In order to improve the matching characteristic between the vertically connected signal transmission lines, window regions from which a metal pattern is eliminated are formed at the same positions in different layers of the first and the second multi-layer PCB between the adjacent ground patterns. Therefore, the present invention can provide the connector and the electronic device providing an optimal matching characteristic in vertically connecting the antenna and the transceiver circuit in mmWave bands.

公开(公告)号：US20240072461A1

公开(公告)日：2024-02-29

申请号：US18458464

申请日：2023-08-30

Applicant: LuxTech, LLC

Inventor： Brad KOERNER ,  Graham MERRIFIELD ,  Kyle DAVIS ,  Scott SOMA ,  Cooper HURLEY

IPC: H01R12/63 ,  H01R12/51 ,  H05K1/18 ,  H05K3/32

CPC classification number: H01R12/63 ,  H01R12/515 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2203/166

Abstract: A system comprises a printed circuit board (PCB) substrate and a housing. The PCB substrate has a plurality of light emitting diodes (LEDs), a first plurality of electrical conductor portions and a second plurality of electrical conductor portions. The housing has a first side and a second side opposite the first side. The housing has on the first side a first wire terminal and a second wire terminal. The housing has on the second side a first conductor contact and a second conductor contact. The housing is configured to be attachable to the PCB substrate so that first conductor contact is electrically coupled to an electrical conductor portion from the first plurality of electrical conductor portions and the second conductor contact is electrically coupled to an electrical conductor portion from the second plurality of electrical conductor portions.

公开(公告)号：US11904611B2

公开(公告)日：2024-02-20

申请号：US17713677

申请日：2022-04-05

Applicant: BROTHER KOGYO KABUSHIKI KAISHA

Inventor： Yusuke Ikemoto ,  Yushi Kato ,  Sho Asai ,  Shotaro Watanabe ,  Takehiko Inaba

IPC: B41J2/14 ,  H05K1/14

CPC classification number: B41J2/1433 ,  H05K1/144 ,  B41J2002/14491 ,  H05K2201/10189 ,  H05K2201/2018

Abstract: A printing device includes a frame, and an electronic circuit-board unit attached to the frame. The electronic circuit-board unit includes: a holder including a holding portion; a first substrate held to a first surface of the holder; a second substrate held to a second surface of the holder and attached to the frame; an electronic component; and a harness electrically connected to the electronic component. The holder has: a first region overlapped with the first substrate in a plan view; and a second region offset from the first region in the plan view. At least one of the electronic component and the harness is held by the holding portion.

公开(公告)号：US20240039193A1

公开(公告)日：2024-02-01

申请号：US17815838

申请日：2022-07-28

Applicant: DELL PRODUCTS L.P.

Inventor： Edward Davis Geist ,  Tung Yi Chen ,  HSU-MIN JEN ,  SHU-YU JIANG ,  Rong Yu Wang

IPC: H01R12/72 ,  H01R13/502 ,  H01R12/73 ,  H05K1/18

CPC classification number: H01R12/721 ,  H01R13/502 ,  H01R12/737 ,  H05K1/181 ,  H05K2201/10189 ,  H05K2201/09063

Abstract: A card connector corresponding to a first card type associated with a plurality of electrical contacts for receiving cards corresponding to various card types, each card type associated with a set of electrical contacts fewer than, more than or the same number of electrical contacts as the first card type. An elongated body may be formed with a closed end and an open end. A cap may be positioned on the open end to configure the card connector in a closed configuration to support cards of a card type associated with fewer or the same number of electrical contacts. The cap may be removed to configure the card connector in an open configuration to support cards associated with more electrical contacts. The cap may have PCB connectors for positioning the cap a distance from the elongated body to configure the card connector in an augmented open configuration.