公开(公告)号：US09978486B2

公开(公告)日：2018-05-22

申请号：US15410409

申请日：2017-01-19

Applicant: Fluke Corporation

Inventor： Mark Steven Buckner ,  Steven Wayne Higgins ,  Donald A. Gessling ,  Bryan Charles Hoog ,  Michael A. Schoch

IPC: H05B3/00 ,  H05K3/30 ,  H05K7/12 ,  H01B17/00 ,  H05K1/14 ,  H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H01C3/10 ,  H01C7/22 ,  H01C13/02

CPC classification number: H01C13/02 ,  H01C1/01 ,  H01C1/082 ,  H05K1/181 ,  H05K3/301 ,  H05K2201/10022 ,  H05K2201/10227 ,  H05K2201/10409 ,  H05K2201/10583 ,  H05K2201/10606

Abstract: A resistor support assembly includes first, second, third, and fourth support members. Each of the first and second support members includes one or more resistor contact regions and apertures extending therethrough. Each third support member is at least partially disposed within one of the apertures of one of the first support members and one of the apertures of one of the second support members. Recesses may be formed in the resistor contact regions of the first and the second support members, and one or more load resistors may be at least partially disposed within the recesses. The resistor support assembly may be used to mount one or more load resistors to a printed circuit board, without obstructing airflow through hollow portions of the load resistors. To reduce parasitic capacitance and inductance, the first support members and the second support members are formed from non-conductive materials.

公开(公告)号：US09949370B2

公开(公告)日：2018-04-17

申请号：US15373583

申请日：2016-12-09

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki Tanabe ,  Naohiro Terada ,  Yuu Sugimoto ,  Daisuke Yamauchi

IPC: H05K1/03 ,  H05K1/05 ,  H05K3/22 ,  H05K3/46 ,  G11B5/48 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/05 ,  G11B5/483 ,  G11B5/4853 ,  H05K1/117 ,  H05K3/22 ,  H05K3/3442 ,  H05K3/4608 ,  H05K3/4644 ,  H05K2201/10151 ,  H05K2201/10227 ,  Y02P70/613

Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, a conductor layer disposed at the one side of the base insulating layer and including a connecting terminal electrically connected to a slider, a cover insulating layer covering the conductor layer to expose the connecting terminal and disposed at the one side of the base insulating layer, and a plating layer covering the connecting terminal. The cover insulating layer includes a first cover insulating layer disposed at the one side of the base insulating layer and a second cover insulating layer disposed at the one side of the first cover insulating layer, and the thickness of the plating layer is not more than the total sum of the thickness of the first cover insulating layer and that of the second cover insulating layer.

公开(公告)号：US09936576B2

公开(公告)日：2018-04-03

申请号：US15174208

申请日：2016-06-06

Applicant: International Business Machines Corporation

Inventor： Ai Kiar Ang ,  Michael Lauri

IPC: H01L21/44 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K1/14 ,  H01L23/495 ,  H01L25/10 ,  H01L25/00 ,  H01L21/48 ,  H05K1/03

CPC classification number: H05K1/11 ,  H01L21/4839 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49565 ,  H01L23/49575 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1029 ,  H01L2924/181 ,  H05K1/0313 ,  H05K1/144 ,  H05K1/18 ,  H05K1/181 ,  H05K3/328 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10227 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00012

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

公开(公告)号：US20170332492A1

公开(公告)日：2017-11-16

申请号：US15152218

申请日：2016-05-11

Applicant: Flextronics Automotive GmbH & Co. KG

Inventor： Peter Lutz ,  Kevin Buermann

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/189 ,  H05K3/288 ,  H05K3/305 ,  H05K3/328 ,  H05K2201/05 ,  H05K2201/0929 ,  H05K2201/10037 ,  H05K2201/10227 ,  H05K2201/1031 ,  H05K2201/10931 ,  H05K2203/0278 ,  H05K2203/04 ,  H05K2203/16

Abstract: The invention is related to an electrical circuitry assembly as well as a method for manufacturing such an electrical circuitry assembly, wherein the assembly basically but not exclusively comprising of an electrically conductive metal plate and a circuit including a conductive layer and wherein both the metal plate and the circuit shall be electrically connected to each other.

公开(公告)号：US20170303427A1

公开(公告)日：2017-10-19

申请号：US15297458

申请日：2016-10-19

Applicant: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED ,  LITE-ON TECHNOLOGY CORP.

Inventor： CHIEN-HSIUNG TSAO ,  YAN-NING CHEN

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K7/209 ,  H05K1/0203 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10227

Abstract: The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.

公开(公告)号：US11963300B2

公开(公告)日：2024-04-16

申请号：US17371135

申请日：2021-07-09

Applicant: Au Optronics Corporation

Inventor： Chun-Yueh Hou ,  Hao-An Chuang ,  Fan-Yu Chen ,  Hsi-Hung Chen ,  Yun Cheng ,  Wen-Chang Hsieh ,  Chih-Wen Lu

IPC: H05K1/11 ,  H05K3/22 ,  H05K3/46

CPC classification number: H05K1/111 ,  H05K3/22 ,  H05K3/4644 ,  H05K2201/10227

Abstract: A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.

公开(公告)号：US11915995B2

公开(公告)日：2024-02-27

申请号：US17677357

申请日：2022-02-22

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Shun Fukuchi

IPC: H01L23/40 ,  H05K1/02 ,  H05K7/20

CPC classification number: H01L23/40 ,  H05K1/0212 ,  H05K7/20927 ,  H05K2201/10227

Abstract: A power converter includes a housing including a convex radiator that radiates heat from a heater element and protrudes toward a board, in which the board and the heater element are arranged, and an urging member that is arranged between the board and a bottom surface of the housing and urges the heater element toward a first side surface of the convex radiator of the housing.

公开(公告)号：US10080289B2

公开(公告)日：2018-09-18

申请号：US15491921

申请日：2017-04-19

Applicant: MACOM Technology Solutions Holdings, Inc.

Inventor： Jessica Aldrich ,  Paul Hogan

IPC: H05K1/18 ,  H05K3/30 ,  H05K1/11 ,  H05K3/32

CPC classification number: H05K1/181 ,  H05K1/11 ,  H05K3/301 ,  H05K3/32 ,  H05K2201/1003 ,  H05K2201/10227 ,  H05K2201/10265 ,  H05K2201/10484 ,  Y02P70/611

Abstract: A system and method for placing an inductor on a circuit board. This method includes providing a circuit board, a pedestal, and an inductor, the pedestal has a top surface and a bottom surface and the circuit board has one or more electrical conductors, the inductor having a first inductor terminal and a second inductor terminal. Adhesive is placed on the circuit board and the bottom surface of the pedestal is placed on the adhesive located on the circuit board to secure the pedestal to the circuit board. Next, adhesive is placed on the top surface of the pedestal and the inductor is placed on the adhesive located on the top surface of the pedestal to secure the inductor to the pedestal. The inductor is electrically connected to the circuit board.

公开(公告)号：US20180063984A1

公开(公告)日：2018-03-01

申请号：US15244001

申请日：2016-08-23

Applicant: Microsoft Technology Licensing, LLC

Inventor： Bradley E. CLEMENTS ,  Gabriel J. PIRIE ,  Perry H. PIERCE

IPC: H05K7/14 ,  H05K3/30 ,  H05K1/18 ,  H01M2/10

CPC classification number: H01M2/1055 ,  H01M10/425 ,  H01M2220/30 ,  H05K1/181 ,  H05K3/303 ,  H05K3/32 ,  H05K2201/0311 ,  H05K2201/09063 ,  H05K2201/10037 ,  H05K2201/10227

Abstract: A device and a method for manufacturing of a printed circuit board for installing in a battery-powered device, the method including mounting on a printed circuit board (PCB) a PCB surface mount component comprising a planar mount configured to be mounted on the PCB and a kinetic energy absorption element with a battery contact on a distal end of the energy absorption element, and trimming the PCB out of a panel comprising the PCB and a border around the PCB, the border connected integrally with the PCB, wherein the border comprises supports configured to support corresponding ear extensions in the absorption element in order to align the battery contact with a PCB plane.

公开(公告)号：US20180031854A1

公开(公告)日：2018-02-01

申请号：US15658869

申请日：2017-07-25

Applicant: TDK TAIWAN CORP.

Inventor： Chao-Chang HU ,  Chen-Chi KUO

IPC: G02B27/64 ,  H05K1/18 ,  G03B5/04 ,  G02B7/09 ,  G03B13/36

CPC classification number: G02B27/646 ,  G02B7/08 ,  G02B7/09 ,  G02B13/001 ,  G03B3/10 ,  G03B5/02 ,  G03B5/04 ,  G03B13/36 ,  G03B29/00 ,  G03B2205/0007 ,  G03B2205/0015 ,  G03B2205/0076 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10227

Abstract: A lens driving device is provided, including a base, a holder, a first driving mechanism disposed on the first side of the base, a second driving mechanism disposed on the second side of the base opposite the first side, and a conductive member disposed on the base. The holder is configured to sustain a lens. The first driving mechanism is configured to force the holder to move along the optical axis of the lens. The second driving mechanism includes a circuit board assembly and a shape memory alloy (SMA) wire assembly configured to force the base to move in the plane perpendicular to the optical axis. The conductive member and the circuit board assembly are connected at an electrical connection point, and the SMA wire assembly is closer to the light-incident end of the lens with respect to the electrical connection point.