公开(公告)号：US08971053B2

公开(公告)日：2015-03-03

申请号：US14160766

申请日：2014-01-22

Applicant: Ibiden Co., Ltd.

Inventor： Takashi Kariya ,  Toshiki Furutani

IPC: H05K1/18 ,  H05K1/02 ,  H01L23/538 ,  H05K3/00 ,  H05K3/46 ,  H01L23/498

CPC classification number: H05K1/0298 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2924/15151 ,  H01L2924/15311 ,  H05K1/181 ,  H05K1/182 ,  H05K3/0047 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4644 ,  H05K2201/10159 ,  H05K2201/10363 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10674 ,  Y02P70/611 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A wiring board includes a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on a surface of the first substrate and including interlayer resin insulation layers and wiring layers, the built-up layer having an opening portion communicated with the penetrating hole of the first substrate and opened to the outermost surface of the built-up layer, an interposer accommodated in the opening portion of the built-up layer and including a second substrate and a wiring layer formed on the second substrate, the wiring layer of the interposer including conductive circuits for being connected to semiconductor elements, a filler filling the opening portion such that the interposer is held in the opening portion of the built-up layer, and mounting pads formed on the first substrate and positioned to mount the semiconductor elements. The mounting pads are positioned to form a matrix on the first substrate.

Abstract translation: 布线基板包括具有穿透第一基板的穿透孔的第一基板，形成在第一基板的表面上并且包括层间树脂绝缘层和布线层的积层，所述积层具有连通的开口部 所述第一基板的贯通孔向所述积层的最外表面开口，插入到所述积层的开口部，并且包括形成在所述第二基板上的第二基板和布线层， 所述插入器的布线层包括用于连接到半导体元件的导电电路，填充所述开口部的填充物，使得所述插入件保持在所述积层的开口部中，以及安装焊盘，其形成在所述第一基板上并且被定位成安装 半导体元件 定位安装垫以在第一基板上形成矩阵。

公开(公告)号：US20140376224A1

公开(公告)日：2014-12-25

申请号：US14480684

申请日：2014-09-09

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ellen O. Aeling ,  John R. David ,  Michael A. Meis ,  Ronald S. Steelman

IPC: F21K99/00

CPC classification number: F21V19/0015 ,  F21K9/00 ,  F21K9/60 ,  F21K9/68 ,  F21K9/90 ,  F21V19/0025 ,  F21Y2115/10 ,  H01L33/60 ,  H05K1/0287 ,  H05K1/11 ,  H05K1/189 ,  H05K3/222 ,  H05K3/4611 ,  H05K2201/09681 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/063 ,  Y10T156/10

Abstract: The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

公开(公告)号：US20140293602A1

公开(公告)日：2014-10-02

申请号：US14306337

申请日：2014-06-17

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ellen O. Aeling ,  John R. David ,  Michael A. Meis ,  Ronald S. Steelman

IPC: F21K99/00

CPC classification number: F21V19/0015 ,  F21K9/00 ,  F21K9/60 ,  F21K9/68 ,  F21K9/90 ,  F21V19/0025 ,  F21Y2115/10 ,  H01L33/60 ,  H05K1/0287 ,  H05K1/11 ,  H05K1/189 ,  H05K3/222 ,  H05K3/4611 ,  H05K2201/09681 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/063 ,  Y10T156/10

Abstract: The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

Abstract translation: 本公开一般涉及照明装置及其制造方法。 该器件特别地包括第一导体层，第一绝缘体层，设置在第一导体层上并且具有通过第一绝缘体层限定在其中的至少一个第一孔;第二导体层，设置在第一绝缘体层上并具有 通过所述第二导体层限定的至少一个第二孔，并且定位成与所述至少一个第一孔对准，以及光操纵层，其设置在所述第二导体层上并且具有通过所述光操纵层限定在其中的至少一对孔，包括 第三孔和第四孔，其中所述第三孔被定位成与所述至少一个第二孔和第一孔对准。

公开(公告)号：US20140254107A1

公开(公告)日：2014-09-11

申请号：US14285710

申请日：2014-05-23

Applicant: Petteri Palm ,  Tuomas Waris ,  Antti Iihola

Inventor： Petteri Palm ,  Tuomas Waris ,  Antti Iihola

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/111 ,  H01L23/49833 ,  H01L23/5381 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/25 ,  H01L2223/6677 ,  H01L2224/24195 ,  H01L2924/01029 ,  H05K1/14 ,  H05K1/181 ,  H05K1/185 ,  H05K3/207 ,  H05K2201/10363

Abstract: The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the present invention to provide an electronic module with an embedded jumper element having reliable high quality connections and contacts. To achieve at least some of the aspects of the present invention, an embedded pre-fabricated jumper module is placed inside a printed circuit board which allows the crossing of conducting lines within the module without manufacturing additional layers over the whole PCB board. The resultant PCB will have improved contacts and will not have surface deformation.

公开(公告)号：US08654538B2

公开(公告)日：2014-02-18

申请号：US13050217

申请日：2011-03-17

Applicant: Takashi Kariya ,  Toshiki Furutani

Inventor： Takashi Kariya ,  Toshiki Furutani

IPC: H05K1/18

CPC classification number: H05K1/0298 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2924/15151 ,  H01L2924/15311 ,  H05K1/181 ,  H05K1/182 ,  H05K3/0047 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4644 ,  H05K2201/10159 ,  H05K2201/10363 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10674 ,  Y02P70/611 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A wiring board including a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on one surface of the first substrate and including multiple interlayer resin insulation layers and wiring layers, the built-up layer having an opening portion communicated with the penetrating hole of the first substrate and opened to the outermost surface of the built-up layer, an interposer accommodated in the opening portion of the built-up layer and including a second substrate and a wiring layer formed on the second substrate, the wiring layer of the interposer including multiple conductive circuits for being connected to multiple semiconductor elements, and a filler filling the opening portion of the built-up layer such that the interposer is held in the opening portion of the built-up layer. The opening portion of the built-up layer has a tapered portion tapering toward the outermost surface of the built-up layer.

Abstract translation: 一种布线基板，包括具有穿透所述第一基板的穿透孔的第一基板，形成在所述第一基板的一个表面上并且包括多个层间树脂绝缘层和布线层的积层，所述积层具有开口部 与第一基板的贯通孔相通并且向组合层的最外表面开口，插入物容纳在积层的开口部分中，并且包括形成在第二基板上的第二基板和布线层， 插入器的布线层包括用于连接到多个半导体元件的多个导电电路，以及填充积层的开口部分的填充物，使得插入器被保持在积层的开口部分中。 积层的开口部分具有朝向堆积层的最外表面渐缩的锥形部分。

公开(公告)号：US20130313601A1

公开(公告)日：2013-11-28

申请号：US13955455

申请日：2013-07-31

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ellen O. Aeling ,  John R. David ,  Michael A. Meis ,  Ronald S. Steelman

IPC: H01L33/60

CPC classification number: F21V19/0015 ,  F21K9/00 ,  F21K9/60 ,  F21K9/68 ,  F21K9/90 ,  F21V19/0025 ,  F21Y2115/10 ,  H01L33/60 ,  H05K1/0287 ,  H05K1/11 ,  H05K1/189 ,  H05K3/222 ,  H05K3/4611 ,  H05K2201/09681 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/063 ,  Y10T156/10

Abstract: The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

Abstract translation: 本公开一般涉及照明装置及其制造方法。 该器件特别地包括第一导体层，第一绝缘体层，设置在第一导体层上并且具有通过第一绝缘体层限定在其中的至少一个第一孔;第二导体层，设置在第一绝缘体层上并具有 通过所述第二导体层限定的至少一个第二孔，并且定位成与所述至少一个第一孔对准，以及光操纵层，其设置在所述第二导体层上并且具有通过所述光操纵层限定在其中的至少一对孔，包括 第三孔和第四孔，其中所述第三孔被定位成与所述至少一个第二孔和第一孔对准。

公开(公告)号：US20130215610A1

公开(公告)日：2013-08-22

申请号：US13688983

申请日：2012-11-29

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Ming-Hua TSAI ,  Chen-I LU

IPC: F21V21/00

CPC classification number: F21V21/00 ,  F21K9/00 ,  F21V23/06 ,  F21V31/00 ,  F21Y2103/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  H05K1/117 ,  H05K1/142 ,  H05K3/3405 ,  H05K2201/09709 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10363 ,  Y10S362/80

Abstract: A first substrate of a light bar assembly includes a first edge and a second edge parallel to each other along a first direction. A first connecting end includes a first connecting portion protruding further outward than a second connecting portion. A first bonding pad and a second bonding pad are disposed on the first substrate. First solid-state semiconductor light sources are disposed along the first edge and the second edge. A second substrate, disposed corresponding to the first substrate, includes a third edge, a fourth edge, a second connecting portion, a third bonding pad, a fourth bonding pad, and second solid-state semiconductor light sources. A first connecting device is electrically connected to the first bonding pad and the fourth bonding pad; a second connecting device is electrically connected to the second bonding pad and the third bonding pad to fix the first substrate and the second substrate.

Abstract translation: 光棒组件的第一基板包括沿着第一方向彼此平行的第一边缘和第二边缘。 第一连接端包括比第二连接部更向外突出的第一连接部。 第一接合焊盘和第二接合焊盘设置在第一基板上。 第一固态半导体光源沿着第一边缘和第二边缘设置。 对应于第一基板设置的第二基板包括第三边缘，第四边缘，第二连接部分，第三焊盘，第四焊盘和第二固态半导体光源。 第一连接装置电连接到第一焊盘和第四接合焊盘; 第二连接装置电连接到第二接合焊盘和第三接合焊盘以固定第一基板和第二基板。

公开(公告)号：US08450202B1

公开(公告)日：2013-05-28

申请号：US12874319

申请日：2010-09-02

Applicant: Keith Daniel Humfeld

Inventor： Keith Daniel Humfeld

IPC: H01L23/532 ,  H01L21/768

CPC classification number: H05K3/222 ,  B82Y30/00 ,  H01L21/76838 ,  H01L23/53276 ,  H01L2221/1094 ,  H01L2924/0002 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0367 ,  H05K2201/10363 ,  H01L2924/00

Abstract: A fabricated substrate has at least one plurality of posts. The plurality is fabricated such that the two posts are located at a predetermined distance from one another. The substrate is exposed to a fluid matrix containing functionalized carbon nanotubes. The functionalized carbon nanotubes preferentially adhere to the plurality of posts rather than the remainder of the substrate. A connection between posts of the at least one plurality of posts is induced by adhering one end of the functionalized nanotube to one post and a second end of the functionalized carbon nanotube to a second post.

公开(公告)号：US08354686B2

公开(公告)日：2013-01-15

申请号：US13107071

申请日：2011-05-13

Applicant: HongBoem Jin ,  HanCheol Kim

Inventor： HongBoem Jin ,  HanCheol Kim

IPC: H01L33/00

CPC classification number: H05K1/0295 ,  F21K9/00 ,  F21K9/27 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05B33/0803 ,  H05K1/0209 ,  H05K1/05 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/173

Abstract: A light emitting device array is provided comprising a printed circuit board on which a plurality of electrode patterns having the same width is formed, a light emitting device package disposed on a predetermined number of electrode patterns and a power supply line disposed on at least one of the remaining electrode pattern except for the predetermined number of electrode patterns.

Abstract translation: 提供了一种发光器件阵列，其包括印刷电路板，其上形成有相同宽度的多个电极图案，设置在预定数量的电极图案上的发光器件封装和设置在至少一个电极图案上的电源线 除了预定数量的电极图案之外的剩余电极图案。

公开(公告)号：US20120275156A1

公开(公告)日：2012-11-01

申请号：US13548214

申请日：2012-07-13

Applicant: SHENG-HSIUNG CHENG

Inventor： SHENG-HSIUNG CHENG

IPC: F21V29/00

CPC classification number: H05K1/0203 ,  F21K9/00 ,  F21V29/70 ,  F21V29/763 ,  F21V29/80 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/10363

Abstract: The heat dissipation device for a LED lamp contains an upper piece, at least a lower piece, and a number of heat dissipation elements. The upper piece has a number of first, second, and third plug holes. The second plug holes are aligned with some first plug holes, and they are connected by conductive layers. The other first plug holes are connected by separate conductive layers. The third plug holes are configured on individual conductive layers. A number of LEDs have their leads threaded through the first plug holes, respectively. The heat dissipation elements have their two ends threaded through a second plug hole and a third plug hole, respectively. The leads and the heat dissipation elements are then soldered to their respective conductive layers. A number of tubular sleeves are sandwiched between the upper and lower pieces and the leads of the LEDs are threaded through the tubular sleeves.

Abstract translation: 用于LED灯的散热装置包括上部件，至少一个下部件和多个散热元件。 上部件具有多个第一，第二和第三塞孔。 第二插孔与一些第一插孔对齐，并且它们通过导电层连接。 其他第一个插孔通过单独的导电层连接。 第三个插头孔配置在各个导电层​​上。 许多LED的引线分别穿过第一个插孔。 散热元件的两端分别穿过第二插孔和第三插孔。 然后将引线和散热元件焊接到它们各自的导电层上。 多个管状套管夹在上部和下部之间，并且LED的引线穿过管状套筒。