公开(公告)号：US20150342055A1

公开(公告)日：2015-11-26

申请号：US14709605

申请日：2015-05-12

Applicant: Infineon Technologies AG

Inventor： Andre Arens

IPC: H05K1/18 ,  H01L23/495

CPC classification number: H05K1/185 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49844 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/072 ,  H01L2924/0002 ,  H05K2201/10507 ,  H01L2924/00

Abstract: A semiconductor module includes a printed circuit board, and first and second embedded semiconductor chips. The first and second semiconductor chips each have a first load connection and a second load connection. The printed circuit board further includes a structured first metalization layer, which has a first section and a second section, and a structured second metalization layer, which has a first section, a second section and a third section. The first section of the second metalization layer and the second section of the first metalization layer have comb shaped structures having first and second protrusions. These first and second sections are electrically conductively connected to one another by a number of first plated-through holes each of which is permanently electrically conductively connected both at first protrusions to the first section of the second metalization layer and at second protrusions to the second section of the first metalization layer.

Abstract translation: 半导体模块包括印刷电路板，以及第一和第二嵌入式半导体芯片。 第一和第二半导体芯片各自具有第一负载连接和第二负载连接。 印刷电路板还包括具有第一部分和第二部分的结构化的第一金属化层和具有第一部分，第二部分和第三部分的结构化的第二金属化层。 第二金属化层的第一部分和第一金属化层的第二部分具有具有第一和第二突起的梳状结构。 这些第一和第二部分通过多个第一电镀通孔彼此导电连接，每个第一电镀通孔在第一突起处与第二金属化层的第一部分永久地导电连接，并且在第二突起处连接到第二部分 的第一金属化层。

公开(公告)号：US20150342053A1

公开(公告)日：2015-11-26

申请号：US14815184

申请日：2015-07-31

Applicant: Cisco Technology, Inc.

Inventor： Jovica Savic ,  Zhiping Yang ,  Jie Xue ,  Li Li

IPC: H05K1/18 ,  H05K1/11 ,  H01L23/498

CPC classification number: H05K1/183 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/095 ,  H05K2201/10492 ,  H05K2201/10507 ,  H01L2924/00

Abstract: An apparatus includes a cavity formed in a support structure, the support structure being operable to support a semiconductor device. A circuit element is disposed in the cavity in the support structure, and the cavity in the support structure is filled with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material. The semiconductor device is electrically connected to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.

Abstract translation: 一种装置包括形成在支撑结构中的空腔，所述支撑结构可操作以支撑半导体器件。 电路元件设置在支撑结构中的空腔中，并且支撑结构中的空腔填充有不导电的填充材料，以便至少部分地围绕电路元件与非导电填充材料。 半导体器件电连接到电路元件。 在示例性实施例中，电路元件可操作以基本上阻挡由半导体器件或另一半导体器件输出的直流电流。

公开(公告)号：US20150245491A1

公开(公告)日：2015-08-27

申请号：US14708755

申请日：2015-05-11

Applicant: International Business Machines Corporation

Inventor： Mark C. Lamorey ,  Janak G. Patel ,  Peter Slota, JR. ,  David B. Stone

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/183 ,  H05K1/0231 ,  H05K1/11 ,  H05K1/181 ,  H05K1/184 ,  H05K2201/09645 ,  H05K2201/10015 ,  H05K2201/10507 ,  Y02P70/611 ,  Y10T29/49135

Abstract: Various embodiments include integrated circuit structures having an off-axis in-hole capacitor. In some embodiments, an integrated circuit (IC) structure includes: a substrate layer having an upper surface; an IC chip at least partially contained within the substrate layer and aligned with a minor axis perpendicular to the upper surface of the substrate layer; an aperture in the substrate layer, the aperture physically separated from the IC chip; and a capacitor in the aperture and at least partially contained within the substrate layer, the capacitor being physically isolated from the IC chip, wherein the capacitor is aligned with an axis perpendicular to the upper surface of the substrate layer and offset from the minor axis of the IC chip.

Abstract translation: 各种实施例包括具有离轴孔内电容器的集成电路结构。 在一些实施例中，集成电路（IC）结构包括：具有上表面的基底层; 至少部分地包含在所述衬底层内并与垂直于所述衬底层的上表面的短轴对准的IC芯片; 所述基板层中的孔，所述孔与所述IC芯片物理分离; 以及孔中的电容器，并且至少部分地包含在所述衬底层内，所述电容器与所述IC芯片物理隔离，其中所述电容器与垂直于所述衬底层的上表面的轴线对准，并且偏离所述衬底层的短轴 IC芯片。

公开(公告)号：US20150043183A1

公开(公告)日：2015-02-12

申请号：US14455012

申请日：2014-08-08

Applicant: IBIDEN CO., LTD.

Inventor： Naohito ISHIGURO ,  Yasushi Inagaki

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/185 ,  H01L2224/16227 ,  H01L2924/15311 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/10 ,  H05K2201/10015 ,  H05K2201/10507 ,  H05K2203/0156

Abstract: A wiring board with a built-in electronic component includes a core substrate, an electronic component in the substrate, a first upper-layer structure on first surface of the substrate, a second upper-layer structure on second surface of the substrate, and via conductors in the substrate and first upper-layer structure such that the via conductors are connected to an electrode of the component. The substrate has an accommodating layer, a first connection layer on first surface of the accommodating layer, and a second connection layer on second surface of the accommodating layer, the accommodating layer includes inner wiring and insulation layers and has cavity accommodating the component, the first connection layer includes inner wiring and insulation layers, and the second connection layer includes inner wiring and insulation layers such that the second connection layer includes greater number of inner wiring and insulation layers than the first connection layer.

Abstract translation: 具有内置电子部件的布线基板包括芯基板，基板中的电子部件，基板第一面上的第一上层结构，基板的第二面上的第二上层结构以及基板的第二表面的通路 衬底中的导体和第一上层结构，使得通孔导体连接到部件的电极。 所述基板具有容纳层，在所述容纳层的第一表面上的第一连接层和在所述容纳层的第二表面上的第二连接层，所述容纳层包括内部布线和绝缘层，并且具有容纳所述部件的空腔，所述第一 连接层包括内部布线和绝缘层，并且第二连接层包括内部布线和绝缘层，使得第二连接层包括比第一连接层更多数量的内部布线和绝缘层。

公开(公告)号：US08885356B2

公开(公告)日：2014-11-11

申请号：US13278514

申请日：2011-10-21

Applicant: Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H05K7/00 ,  H01L25/065 ,  H01L23/50 ,  H01L23/498 ,  H01L23/13 ,  H05K1/14 ,  H05K7/02 ,  H01L23/00 ,  H01L23/31

CPC classification number: H05K1/11 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10507 ,  H05K2201/10628 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element, first and second microelectronic elements, signal leads, and one or more jumper leads. The dielectric element has oppositely-facing first and second surfaces and first and second apertures extend between the surfaces. A plurality of electrically conductive elements are positioned thereon. Signal leads are connected to one or more of the microelectronic elements and extend through one or more of the first or second apertures to some of the conductive elements on the dielectric element. One or more jumper leads extend through the first aperture and are connected to a contact of the first microelectronic element. The one or more jumper leads span over the second aperture and are connected to a conductive element on the dielectric element.

Abstract translation: 微电子组件包括介电元件，第一和第二微电子元件，信号引线和一个或多个跳线。 电介质元件具有相对的第一和第二表面，并且第一和第二孔在表面之间延伸。 多个导电元件位于其上。 信号引线连接到一个或多个微电子元件并且延伸通过第一或第二孔中的一个或多个到介电元件上的一些导电元件。 一个或多个跳线引线延伸穿过第一孔并且连接到第一微电子元件的触点。 一个或多个跨接线跨越第二孔并且连接到电介质元件上的导电元件。

公开(公告)号：US20140307403A1

公开(公告)日：2014-10-16

申请号：US14314163

申请日：2014-06-25

Applicant: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

Inventor： Günther Weichslberger ,  Arno Kriechbaum ,  Mike Morianz ,  Nikolai Haslebner ,  Johannes Stahr ,  Fritz Haring ,  Gerhard Freydl ,  Andrea Koertvelyessy ,  Mark Beesley ,  Andreas Zluc ,  Wolfgang Schrittwieser

IPC: H05K1/18

CPC classification number: H05K1/183 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09845 ,  H05K2201/10507 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).

Abstract translation: 该出版物公开了一种电路板结构和电子模块的制造方法，其中至少一个部件（6）嵌入在绝缘材料层（1）的内部，触点（14）被连接到组件 6）电连接到包含在电子模块中的导体结构（14,19）。 根据本发明，在组件（6）附近的绝缘材料层（1）中制造至少一个将组件（6）的热传导加热的热通孔（22）。

公开(公告)号：US20120155042A1

公开(公告)日：2012-06-21

申请号：US13278514

申请日：2011-10-21

Applicant: Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H05K7/00

CPC classification number: H05K1/11 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10507 ,  H05K2201/10628 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element, first and second microelectronic elements, signal leads, and one or more jumper leads. The dielectric element has oppositely-facing first and second surfaces and first and second apertures extend between the surfaces. A plurality of electrically conductive elements are positioned thereon. Signal leads are connected to one or more of the microelectronic elements and extend through one or more of the first or second apertures to some of the conductive elements on the dielectric element. One or more jumper leads extend through the first aperture and are connected to a contact of the first microelectronic element. The one or more jumper leads span over the second aperture and are connected to a conductive element on the dielectric element.

Abstract translation: 微电子组件包括介电元件，第一和第二微电子元件，信号引线和一个或多个跳线。 电介质元件具有相对的第一和第二表面，并且第一和第二孔在表面之间延伸。 多个导电元件位于其上。 信号引线连接到一个或多个微电子元件，并且延伸通过第一或第二孔中的一个或多个到介电元件上的一些导电元件。 一个或多个跳线引线延伸穿过第一孔并且连接到第一微电子元件的触点。 一个或多个跨接线跨越第二孔并且连接到电介质元件上的导电元件。

公开(公告)号：US20120153435A1

公开(公告)日：2012-06-21

申请号：US13278506

申请日：2011-10-21

Applicant: Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H01L29/02 ,  H01L23/538

CPC classification number: H05K1/11 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10507 ,  H05K2201/10628 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element having at least one aperture and electrically conductive elements thereon including terminals exposed at the second surface of the dielectric element; a first microelectronic element having a rear surface and a front surface facing the dielectric element, the first microelectronic element having a plurality of contacts exposed at the front surface thereof; a second microelectronic element having a rear surface and a front surface facing the rear surface of the first microelectronic element, the second microelectronic element having a plurality of contacts exposed at the front surface and projecting beyond an edge of the first microelectronic element; and an electrically conductive plane attached to the dielectric element and at least partially positioned between the first and second apertures, the electrically conductive plane being electrically connected with one or more of the contacts of at least one of the first or second microelectronic elements.

Abstract translation: 微电子组件包括具有至少一个孔的电介质元件和其上的导电元件，其中包括在电介质元件的第二表面处暴露的端子; 第一微电子元件，其具有后表面和面向介电元件的前表面，所述第一微电子元件具有在其前表面处暴露的多个触点; 第二微电子元件，其具有背表面和面向第一微电子元件的后表面的前表面，第二微电子元件具有暴露在前表面处并突出超过第一微电子元件的边缘的多个触点; 以及连接到电介质元件并且至少部分地定位在第一和第二孔之间的导电平面，导电平面与第一或第二微电子元件中的至少一个的一个或多个触点电连接。

公开(公告)号：US20070210427A1

公开(公告)日：2007-09-13

申请号：US11372666

申请日：2006-03-10

Applicant: William Lytle ,  Scott Hayes ,  George Leal

Inventor： William Lytle ,  Scott Hayes ,  George Leal

IPC: H01L23/02

CPC classification number: H05K1/0271 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2223/5442 ,  H01L2223/5446 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/115 ,  H05K2201/10507

Abstract: Methods and apparatus are provided for an electronic panel assembly (EPA) (82, 83), comprising: providing one or more electronic devices (30) with primary faces (31) having electrical contacts (36), opposed rear faces (33) and edges (32) therebetween. The devices (30) are mounted primary faces (31) down on a temporary support (60) in openings (44) in a warp control sheet (WCS) (40) attached to the support (60). Plastic encapsulation (50) is formed at least between lateral edges (32, 43) of the devices (30) and WCS openings (44). Undesirable panel warping (76) during encapsulation is mitigated by choosing the WCS coefficient of thermal expansion (CTE) to be less than the encapsulation CTE. After encapsulation cure, the EPA (82) containing the devices (30) and the WCS (40) is separated from the temporary support (60) and, optionally, mounted on another carrier (70) with electrical contacts (36) exposed. Thin film insulators (85) and conductors (87) are desirably applied to couple electrical contacts (36) on various devices (30) to each other and to external terminals (88), thereby forming an integrated multi-device EPA (84).

Abstract translation: 提供了一种用于电子面板组件（EPA）（82,83）的方法和装置，包括：为一个或多个电子设备（30）提供具有电触头（36），相对的后表面（33）和 其间的边缘（32）。 装置（30）在连接到支撑件（60）的经纱控制片（WCS）（40））的开口（44）中的主要面（31）向下安装在临时支撑件（60）上。 至少在装置（30）的横向边缘（32,43）和WCS开口（44）之间形成塑料封装（50）。 通过选择WCS热膨胀系数（CTE）小于封装CTE来减轻封装期间的不希望的面板翘曲（76）。 在封装固化之后，含有装置（30）和WCS（40）的EPA（82）与临时支撑件（60）分离，并且可选地安装在具有暴露的电触点（36）的另一个载体（70）上。 期望施加薄膜绝缘体（85）和导体（87）以将各种装置（30）上的电触头（36）彼此耦合到外部端子（88），从而形成集成的多装置EPA（84）。

公开(公告)号：US20240138066A1

公开(公告)日：2024-04-25

申请号：US18483929

申请日：2023-10-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Hideo NAKAGOSHI ,  Hiroki YOSHIMORI

IPC: H05K1/14 ,  H05K1/02

CPC classification number: H05K1/144 ,  H05K1/0203 ,  H05K2201/0379 ,  H05K2201/10507 ,  H05K2201/10977

Abstract: An upper circuit board body has a first upper main surface and a first lower main surface. A lower circuit board body has a second upper main surface and a second lower main surface. A lower circuit board first mounting electrode and one or more lower circuit board second mounting electrodes are disposed on the second upper main surface. A first component is mounted on the one or more lower circuit board second mounting electrodes. A first conductor member is mounted on the lower circuit board first mounting electrode and is disposed on the left of the first component. A second conductor member is disposed on the first lower main surface, is connected to the upper end of the first conductor member, and overlaps at least a part of the first component as viewed in the downward direction.