公开(公告)号：US08300425B2

公开(公告)日：2012-10-30

申请号：US12184086

申请日：2008-07-31

Applicant: Nader Gamini ,  Joseph C. Fjelstad

Inventor： Nader Gamini ,  Joseph C. Fjelstad

IPC: H05K7/02

CPC classification number: H05K1/185 ,  H01L25/105 ,  H01L25/16 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/3025 ,  H05K1/023 ,  H05K3/284 ,  H05K3/4664 ,  H05K2201/10515 ,  H05K2201/10628 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00

Abstract: An apparatus is disclosed that improves density of electrical components in a circuit assembly. Electrical components 202, 204 are stacked so that they overlap each other and are encapsulated in an electronic insulating material 104. The resulting subassembly may be integrated onto a printed circuit board or into a reverse-interconnection process assembly.

Abstract translation: 公开了一种提高电路组件中的电气部件的密度的装置。 电子部件202,204被堆叠成使得它们彼此重叠并且被封装在电子绝缘材料104中。所得到的子组件可以集成到印刷电路板或反向互连工艺组件中。

公开(公告)号：US20120167998A1

公开(公告)日：2012-07-05

申请号：US13415291

申请日：2012-03-08

Applicant: Dennis A. Briggs

Inventor： Dennis A. Briggs

IPC: F17D3/00

CPC classification number: H05K3/321 ,  F17D3/00 ,  H01L21/4867 ,  H01L23/498 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/225 ,  H05K3/3463 ,  H05K2201/0257 ,  H05K2201/0373 ,  H05K2201/10628 ,  H05K2203/176 ,  Y10T137/0396 ,  Y10T436/25 ,  Y10T436/2575 ,  H01L2924/00

Abstract: This invention describes a method for pumping or delivering fluids utilizing a flexible vessel subject to controlled pressures within another pressure vessel. The pressure vessel can be sourced with positive and/or negative (e.g., vacuum) pressure.

Abstract translation: 本发明描述了一种利用在另一压力容器内经受受控压力的柔性容器来泵送或输送流体的方法。 压力容器可以采用正和/或负（例如，真空）压力。

公开(公告)号：US07878834B2

公开(公告)日：2011-02-01

申请号：US12424341

申请日：2009-04-15

Applicant: Neil S. Sherman ,  Brian H. Steuer

Inventor： Neil S. Sherman ,  Brian H. Steuer

IPC: H01R13/62

CPC classification number: H01R12/57 ,  H01R12/585 ,  H01R12/7023 ,  H01R12/7064 ,  H01R13/2421 ,  H05K3/325 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10598 ,  H05K2201/10628

Abstract: A connector device for maintaining a desired spatial relationship for spatially and securely connecting to a platform, such as a circuit board, in an efficient manner. The connector device generally includes a body portion separated from the secondary device, a plurality of legs extending from the body portion for removably attaching the body portion to the secondary device, wherein the plurality of legs each include a foot member insertable within an opening of the secondary device for grasping the secondary device and at least one contact pin extending from the body portion to contact the secondary device on an opposite surface as the foot member. The contact pin maintains the separation between the body portion and the secondary device and includes a spring for providing a counter force against the secondary device with respect to the foot member.

Abstract translation: 一种连接器装置，用于以有效的方式保持用于空间和牢固地连接到平台（例如电路板）的期望的空间关系。 连接器装置通常包括与次级装置分离的主体部分，从主体部分延伸的多个腿部，用于可拆卸地将主体部分附接到次要装置，其中多个腿部各自包括可插入到第二装置的开口内的脚部件 用于抓握次级装置的次级装置和从主体部分延伸的至少一个接触销，以在与脚部件相反的表面上接触次级装置。 接触销保持主体部分和次要装置之间的分离，并且包括用于相对于脚部构件提供抵抗次级装置的反作用力的弹簧。

公开(公告)号：US07832897B2

公开(公告)日：2010-11-16

申请号：US12110344

申请日：2008-04-27

Applicant: Chin-Long Ku

Inventor： Chin-Long Ku

IPC: F21S2/00

CPC classification number: F21S2/005 ,  F21V21/005 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K2201/10106 ,  H05K2201/1053 ,  H05K2201/10628 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED unit includes a plurality of LEDs, each of which includes a base, an LED die mounted on the base, a pair of leads penetrating the base to electrically connect with the LED die, a plurality of legs extending radially from a periphery of the base, a plurality of cutouts defined in the base and an encapsulant enveloping the LED die. The pair of leads of each LED are joined to corresponding leads of adjacent LEDs to realize electrical connections of the LEDs, while the legs of each LED are fitted into corresponding cutouts of the bases of adjacent LEDs to realize mechanical connections of the LEDs.

Abstract translation: LED单元包括多个LED，每个LED包括基座，安装在基座上的LED管芯，穿过基座的一对引线以与LED管芯电连接;多个引脚， 基座，限定在基座中的多个切口和封装LED管芯的密封剂。 每个LED的一对引线被连接到相邻LED的相应引线，以实现LED的电连接，而每个LED的腿被装配到相邻LED的基座的相应切口中，以实现LED的机械连接。

公开(公告)号：US20080311704A1

公开(公告)日：2008-12-18

申请号：US12187143

申请日：2008-08-06

Applicant: Robert R. Oberle

Inventor： Robert R. Oberle

IPC: H01L21/50 ,  B29C65/02

CPC classification number: H01L23/3164 ,  G06K19/07749 ,  H01L23/49855 ,  H01L24/86 ,  H01L2924/0102 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/3484 ,  H05K2201/10628 ,  H05K2203/1311 ,  Y02P80/30 ,  H01L2924/00

Abstract: A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.

Abstract translation: 构造RFID单元的方法可以包括使用保护层来将导电粘合剂尚未完全设定的状态下将集成电路芯片模块保持在具有天线单元的基板层上。

公开(公告)号：US07161282B2

公开(公告)日：2007-01-09

申请号：US10735704

申请日：2003-12-16

Applicant: Masato Koike ,  Katsumi Fujimoto

Inventor： Masato Koike ,  Katsumi Fujimoto

IPC: H01L41/053

CPC classification number: G01C19/5663 ,  H01L41/053 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/10083 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/2045 ,  Y02P70/613

Abstract: In a vibrator support structure, a vibrator is supported on a substrate through support pins, substrate connection portions of the support pins and pin connection portions of the substrate are joined through conductive adhesive which is made of a resin including conductive filler and has a pencil hardness of about 4H or less, and the conductive adhesive has a thickness which can buffer vibrations and impacts propagated through the support pins.

Abstract translation: 在振动器支撑结构中，振动器通过支撑销支撑在基板上，支撑销的基板连接部分和基板的引脚连接部分通过由包括导电填料的树脂制成并具有铅笔硬度的导电粘合剂 约4H或更小，并且导电粘合剂具有可以缓冲通过支撑销传播的振动和冲击的厚度。

公开(公告)号：US06575611B2

公开(公告)日：2003-06-10

申请号：US09133364

申请日：1998-08-12

Applicant: Achim Kugler ,  Christine Weber

Inventor： Achim Kugler ,  Christine Weber

IPC: H05K100

CPC classification number: H05K3/328 ,  B60Q1/2696 ,  F21S43/14 ,  F21S43/195 ,  F21V19/001 ,  H05K2201/10628 ,  H05K2203/107 ,  Y10S362/80

Abstract: A support for a taillight of a motor vehicle has a support member and electric leads connected thereto. Electronic components are connected by welding seams produced by laser welding to the electric leads.

Abstract translation: 对于机动车辆的尾灯的支撑件具有与其连接的支撑构件和电线。 电子元件通过激光焊接产生的焊缝连接到电引线上。

公开(公告)号：US20020067621A1

公开(公告)日：2002-06-06

申请号：US09133364

申请日：1998-08-12

Inventor： ACHIM KUGLER ,  CHRISTINE WEBER

IPC: B60Q003/04

CPC classification number: H05K3/328 ,  B60Q1/2696 ,  F21S43/14 ,  F21S43/195 ,  F21V19/001 ,  H05K2201/10628 ,  H05K2203/107 ,  Y10S362/80

Abstract: A support for a taillight of a motor vehicle has a support member and electric leads connected thereto. Electronic components are connected by welding seams produced by laser welding to the electric leads.

Abstract translation: 对于机动车辆的尾灯的支撑件具有与其连接的支撑构件和电线。 电子元件通过激光焊接产生的焊缝连接到电引线上。

公开(公告)号：US3344316A

公开(公告)日：1967-09-26

申请号：US48044065

申请日：1965-08-17

Applicant: STELMAK JOHN P

Inventor： STELMAK JOHN P

IPC: H05K3/32

CPC classification number: H05K3/328 ,  H05K3/325 ,  H05K2201/10628 ,  H05K2201/10977 ,  H05K2203/0495

公开(公告)号：US12094725B2

公开(公告)日：2024-09-17

申请号：US17546960

申请日：2021-12-09

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Frederick Ray Gomez

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/54 ,  H01L21/78 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L21/4842 ,  H01L21/4825 ,  H01L21/54 ,  H01L21/78 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/83 ,  H05K1/111 ,  H05K1/181 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/8385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/181 ,  H05K2201/10628 ,  H05K2201/10992 ,  H01L2224/97 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/83439 ,  H01L2924/00014 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2224/83444 ,  H01L2924/01047 ,  H01L2224/85444 ,  H01L2924/01047 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/48105 ,  H01L2924/00014 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2224/48465 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/48465 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.