公开(公告)号：US20090206481A1

公开(公告)日：2009-08-20

申请号：US12430216

申请日：2009-04-27

Applicant: Cheng-Lien Chiang

Inventor： Cheng-Lien Chiang

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H05K3/368 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K3/244 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/10234 ,  H05K2201/10666 ,  H05K2203/041 ,  H05K2203/0455 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An interconnection mechanism between plated through holes is disclosed, a first embodiment includes a first substrate having a first plated through hole; a second substrate having a second plated through hole; a metal core is configured in between the two plated through holes; the metal ball has a diameter larger than a diameter of the plated through holes; and melted solder binds the first plated through hole, metal core, and the second plated through hole. A second embodiment includes stacked substrate having a gold plated only on ring pads of the plated through holes; melted solder binds the two gold ring pads.

Abstract translation: 公开了电镀通孔之间的互连机构，第一实施例包括具有第一电镀通孔的第一基板; 具有第二电镀通孔的第二基板; 金属芯构造在两个电镀通孔之间; 金属球的直径大于电镀通孔的直径; 并且熔化的焊料结合第一电镀通孔，金属芯和第二电镀通孔。 第二实施例包括具有仅在电镀通孔的环形垫上镀金的堆叠衬底; 熔化的焊料结合两个金环垫。

公开(公告)号：US07532485B2

公开(公告)日：2009-05-12

申请号：US11435716

申请日：2006-05-18

Applicant: Junichi Kimura ,  Kazuhiko Honjo ,  Eiji Kawamoto ,  Shinji Harada ,  Motoyoshi Kitagawa

Inventor： Junichi Kimura ,  Kazuhiko Honjo ,  Eiji Kawamoto ,  Shinji Harada ,  Motoyoshi Kitagawa

IPC: H05K1/14

CPC classification number: H05K1/144 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0237 ,  H05K1/185 ,  H05K3/0052 ,  H05K3/3436 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/09181 ,  H05K2201/10371 ,  H05K2201/10666 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: A multilayer module includes a parts-containing module whose circuit board has been mounted at one surface with an electronic component and the electronic component is covered with a resin layer. Connection terminals are provided either at the resin layer or at the other surface of the circuit board, and a through hole is provided for connection between the two surfaces of the module. Also included is a module, which is provided with connection terminals at a place corresponding to the connection terminal, and the through hole for connection between the connection terminals and electronic component. An insulation layer is disposed between conductor layers, the insulation layer having a conductive bond for connection between connection terminals, respectively. Locations of a through hole and an electronic component in the module are not restricted by a location of the through hole.

Abstract translation: 多层模块包括其电路板已经在一个表面上安装有电子部件并且电子部件被树脂层覆盖的部件容纳模块。 连接端子设置在电路板的树脂层或另一表面处，并且设置用于在模块的两个表面之间连接的通孔。 还包括在与连接端子相对应的位置处设置有连接端子的模块和用于连接端子和电子部件之间的连接的通孔。 绝缘层设置在导体层之间，绝缘层分别具有用于连接端子之间连接的导电接合。 模块中的通孔和电子部件的位置不受通孔的位置的限制。

公开(公告)号：US20090102037A1

公开(公告)日：2009-04-23

申请号：US12251534

申请日：2008-10-15

Applicant: Hye-jin KIM

Inventor： Hye-jin KIM

IPC: H01L23/488 ,  H01L21/56

CPC classification number: H01L23/49816 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/09572 ,  H05K2201/10666 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2224/05099 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package structure having a solder ball coupled to a chip pad and a manufacturing method thereof, a semiconductor package module, and a system. A circuit board includes a through hole therein, and a conductor is formed on a sidewall of the through hole. A first semiconductor chip including a first chip pad is mounted on the circuit board. A solder ball is disposed in the through hole and is bonded to the conductor and the first chip pad. Therefore, an underfill can be removed from a semiconductor package, and thus, the semiconductor package can be reduced in thickness.

Abstract translation: 一种具有耦合到芯片焊盘的焊球的半导体封装结构及其制造方法，半导体封装模块和系统。 电路板在其中包括通孔，并且导体形成在通孔的侧壁上。 包括第一芯片焊盘的第一半导体芯片安装在电路板上。 焊球设置在通孔中并且接合到导体和第一芯片焊盘。 因此，可以从半导体封装中去除底部填充物，因此可以减小半导体封装的厚度。

公开(公告)号：US20080277145A1

公开(公告)日：2008-11-13

申请号：US12150265

申请日：2008-04-25

Applicant: Wen-Bin Lin ,  Chih-Hung Chang

Inventor： Wen-Bin Lin ,  Chih-Hung Chang

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H05K1/028 ,  H05K1/117 ,  H05K3/363 ,  H05K2201/0949 ,  H05K2201/10666 ,  H05K2203/0191 ,  H05K2203/1572

Abstract: A flexible printed circuit includes a flexible substrate, a plurality of first conductive wires, and a plurality of second conductive wires. The flexible substrate includes a first surface and a second surface facing the first surface. The first conductive wires are provided on the first surface. The first conductive wires extend from an edge of the flexible substrate to another edge of the flexible substrate. The second conductive wires are provided on the second surface. The second conductive wires extend from an end of the flexible substrate to a predetermined portion of the flexible substrate. A part of each second conductive wire at the predetermined portion of the flexible substrate is electrically connected with the first conductive wire via a conductive structure.

Abstract translation: 柔性印刷电路包括柔性基板，多个第一导电线和多个第二导线。 柔性基板包括第一表面和面向第一表面的第二表面。 第一导电线设置在第一表面上。 第一导线从柔性基板的边缘延伸到柔性基板的另一边缘。 第二导线设置在第二表面上。 第二导线从柔性基板的端部延伸到柔性基板的预定部分。 在柔性基板的预定部分处的每个第二导线的一部分经由导电结构与第一导线电连接。

公开(公告)号：US20080099537A1

公开(公告)日：2008-05-01

申请号：US11555090

申请日：2006-10-31

Applicant: Premjeet Chahal ,  Billy D. Ables ,  Sankerlingam Rajendran ,  Francis J. Morris

Inventor： Premjeet Chahal ,  Billy D. Ables ,  Sankerlingam Rajendran ,  Francis J. Morris

IPC: B23K35/12

CPC classification number: H05K3/3457 ,  H01L21/486 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2201/2081 ,  H05K2203/0278 ,  H05K2203/043 ,  H01L2924/00

Abstract: According to one embodiment of the invention, a method for sealing one or more vias comprises providing a first substrate having vias, forming an adhesion layer on an inner surface of the vias, sandwiching a solder layer between the first substrate and a second substrate, and elevating of the first substrate, second substrate, and solder layer to a temperature above a eutectic point and below a melting point of the solder layer. The act of elevating the solder layer to a temperature above the eutectic point and below the melting point causes the solder layer to flow into the vias in a generally consistent manner.

Abstract translation: 根据本发明的一个实施例，用于密封一个或多个通孔的方法包括提供具有通孔的第一基板，在通孔的内表面上形成粘合层，将焊料层夹在第一基板和第二基板之间，以及 将第一基板，第二基板和焊料层升高到高于共晶点且低于焊料层的熔点的温度。 将焊料层升高到高于共熔点并低于熔点的温度的作用导致焊料层以大致一致的方式流入通孔。

公开(公告)号：US07210942B2

公开(公告)日：2007-05-01

申请号：US10554692

申请日：2004-04-23

Applicant: Shinji Uchida ,  Hiroshi Yamane ,  Wataru Sugihara

Inventor： Shinji Uchida ,  Hiroshi Yamane ,  Wataru Sugihara

IPC: H01R12/00

CPC classification number: H05K3/363 ,  H05K2201/09163 ,  H05K2201/10666

Abstract: The present invention relates to a connection structure for a printed wiring board to be electrically connected to a FPC. The FPC comprises a long substrate, a plurality of conductors laminated on the surface of the substrate and extending along an axial direction of the substrate. The printed wiring board comprises a planar main wiring board, an insertion opening, and a plurality of the through-hole terminals. Each of the conductors of the FPC abuts the through-hole terminal upon the insertion of the FPC into the insertion opening of the printed wiring board. According to the invention, a connector structure to be connected to FPC is provided inside the printed wiring board in order to mount circuit element in high density, and thus improve degree of freedom in designing wiring pattern.

Abstract translation: 本发明涉及一种与FPC电连接的印刷电路板的连接结构。 FPC包括长基板，层叠在基板的表面上并沿着基板的轴向延伸的多个导体。 印刷电路板包括平面主配线板，插入开口和多个通孔端子。 在将FPC插入印刷电路板的插入口中时，FPC的每个导体与通孔端子抵接。 根据本发明，为了安装高密度的电路元件，在印刷电路板的内部设置有连接到FPC的连接器结构，从而提高了布线图案的设计自由度。

公开(公告)号：US20060189205A1

公开(公告)日：2006-08-24

申请号：US11353604

申请日：2006-02-14

Applicant: Eriko Noguchi

Inventor： Eriko Noguchi

IPC: H01R3/00

CPC classification number: H01M2/10 ,  H01M2/0222 ,  H01M2/0421 ,  H01M2/20 ,  H01M2/30 ,  H05K3/301 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2201/10606 ,  H05K2201/10666

Abstract: To prevent harmful glass fiber powders from being produced by abrasing and wearing a circuit board and to dispense with a change in a battery minus terminal when changed to a circuit board having a different thickness. Tongue shape locking spring portions formed at both ends of a minus battery terminal comprising an elastic thin plate are inserted into locking holes of a circuit board and the minus terminal is fixed to the circuit board by a contact pressure produced by bringing the tongue shape locking spring portions into contact with inner walls of the locking holes to be elastically deformed thereby. The tongue shape locking spring portion is constituted by a pair of tongue pieces symmetrical in a left and right direction, and each tongue piece includes a horizontal extended portion and a locking hole inserting portion. The locking hole inserting portion is formed with a projection in a semicircular shape brought into contact with the inner wall of the locking hole.

Abstract translation: 为了防止由于磨损和磨损电路板而产生有害的玻璃纤维粉末，并且当改变为具有不同厚度的电路板时，减少电池减去端子的变化。 在包括弹性薄板的负电池端子的两端形成的舌形锁定弹簧部分插入到电路板的锁定孔中，并且负端子通过使舌形锁定弹簧产生的接触压力固定到电路板 与锁定孔的内壁接触的部分由此弹性变形。 舌形锁定弹簧部分由在左右方向上对称的一对舌片构成，每个舌片包括水平延伸部分和锁定孔插入部分。 锁定孔插入部形成有与锁定孔的内壁接触的半圆形的突起。

公开(公告)号：US06954987B2

公开(公告)日：2005-10-18

申请号：US10849478

申请日：2004-05-19

Applicant: Kenneth Daryl Wong ,  Sean L. Bell

Inventor： Kenneth Daryl Wong ,  Sean L. Bell

IPC: H05K3/00 ,  H05K3/34 ,  H05K3/44 ,  H01K3/10

CPC classification number: H05K3/44 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/09063 ,  H05K2201/09554 ,  H05K2201/10666 ,  H05K2203/1178 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed circuit board assembly employing a solder vent hole adjacent solder filled interconnect vias connecting to a conductive pallet, is disclosed. The solder vent hole allows gases to escape from an otherwise sealed cavity during solder reflow, relieving positive pressure and thereby allowing solder to flow into it. By providing an escape path for trapped air and gases generated during solder paste reflow, the out-gassing pressure and weight of the molten solder is sufficient to allow the solder paste to flow into the cavity.

Abstract translation: 公开了一种印刷电路板组件，其采用与连接到导电托盘的焊料填充的互连通孔相邻的焊剂通气孔。 焊锡通气孔允许气体在回流焊接过程中从另一个密封的空腔中逸出，减轻正压，从而允许焊料流入其中。 通过为焊膏回流期间产生的被捕获的空气和气体提供逃生路径，熔融焊料的排气压力和重量足以使焊膏流入空腔。

公开(公告)号：US20050207114A1

公开(公告)日：2005-09-22

申请号：US10801515

申请日：2004-03-16

Applicant: Thomas Gall ,  Michael Pfeifer ,  Anthony Polak ,  Michael Pomeroy

Inventor： Thomas Gall ,  Michael Pfeifer ,  Anthony Polak ,  Michael Pomeroy

IPC: H05K1/02 ,  H05K3/42 ,  H05K5/00 ,  H05K5/02 ,  H05K7/20

CPC classification number: H05K5/0047 ,  H05K1/0215 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/42 ,  H05K5/0213 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/0999 ,  H05K2201/10666 ,  H05K2203/0191 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: A vent assembly (50) for an electronic control module (28) is provided. The vent assembly (50) may be adheringly coupled to a printed circuit board (38). The vent assembly (50) being adapted to prevent the ingress of moisture and permit the egress of certain gases.

Abstract translation: 提供了一种用于电子控制模块（28）的排气组件（50）。 通气组件（50）可以附着地联接到印刷电路板（38）。 排气组件（50）适于防止湿气进入并允许某些气体流出。

公开(公告)号：US20050122700A1

公开(公告)日：2005-06-09

申请号：US10790310

申请日：2004-03-01

Applicant: Deok-heung Kim ,  Bong-hui Lee

Inventor： Deok-heung Kim ,  Bong-hui Lee

IPC: H05K1/02 ,  H05K1/00 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36 ,  H01R11/09 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/028 ,  H05K3/28 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09627 ,  H05K2201/0979 ,  H05K2201/10666

Abstract: A flexible printed circuit board (FPCB) which prevents a short circuit due to a crack in a bending portion is provided. The FPCB includes an end portion, a bending portion extended from the end portion, and a circuit portion extended from the bending portion. The improved FPCB includes a base film which is flexible and comprises a first via-hole formed adjacent to the end portion and the bending portion and a second via-hole formed adjacent to the bending portion and the circuit portion, a first conductive layer formed on an outer surface of at least the end portion and the bending portion, a cover layer formed on the first conductive layer, a second conductive layer which is formed on an inner surface of the end portion and is electrically connected to the first conductive layer through the first via-hole, and a third conductive layer which is formed on an inner surface of the extension circuit portion and is electrically connected to the first conductive layer through the second via-hole.

Abstract translation: 提供一种柔性印刷电路板（FPCB），其防止由于弯曲部分的裂纹引起的短路。 FPCB包括端部，从端部延伸的弯曲部和从弯曲部延伸的电路部。 改进的FPCB包括柔性的基膜，包括邻近端部和弯曲部分形成的第一通孔和邻近弯曲部分和电路部分形成的第二通孔，形成在第一导电层上的第一导电层 至少所述端部和所述弯曲部的外表面，形成在所述第一导电层上的覆盖层，形成在所述端部的内表面上并通过所述第一导电层电连接到所述第一导电层的第二导电层 第一导电孔和第三导电层，其形成在延伸电路部分的内表面上，并通过第二通孔与第一导电层电连接。