公开(公告)号：US20110209909A1

公开(公告)日：2011-09-01

申请号：US13101908

申请日：2011-05-05

Applicant: Robert L. Doneker ,  Kent G. R. Thompson

Inventor： Robert L. Doneker ,  Kent G. R. Thompson

IPC: H05K1/02 ,  H05K3/36

CPC classification number: H05K1/023 ,  H05K1/0216 ,  H05K1/0366 ,  H05K3/308 ,  H05K3/4046 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/0761 ,  H05K2201/10939 ,  H05K2203/1453

Abstract: A noise dampening energy efficient circuit board includes a carbon material layer for dampening electromagnetic interference between surface mount components and trace patterns of the circuit board. One or more ground plane layers are arranged relative to the carbon material layer to cooperatively dampen and repel noise of varying frequencies. The positioning of the carbon material layer with respect to the ground plane layer enhances the ground plane operation. Glass fiber material layers and other insulating dielectric layers are disposed at particular locations within the noise dampening energy efficient circuit board. The carbon material layer and the ground plane layer dampen electromagnetic noise, thereby permitting energy saving design considerations, increasing energy efficiencies and reducing power consumption. Mounting posts of the surface mount components include insulating sleeves to selectively insulate different layers of the circuit board from surface mount components. Methods for constructing and using the circuit board are also disclosed.

Abstract translation: 噪声抑制能效电路板包括用于抑制表面安装部件和电路板的迹线图案之间的电磁干扰的碳材料层。 相对于碳材料层布置一个或多个接地层，以协同地抑制和排斥变化频率的噪声。 碳材料层相对于接地层的定位增强了接地层的操作。 玻璃纤维材料层和其它绝缘电介质层设置在噪声抑制能效电路板内的特定位置。 碳材料层和接地层可抑制电磁噪声，从而节省设计考虑因素，提高能源效率并降低功耗。 表面安装部件的安装柱包括绝缘套管，以选择性地将电路板的不同层与表面安装部件绝缘。 还公开了构造和使用电路板的方法。

公开(公告)号：US06295727B1

公开(公告)日：2001-10-02

申请号：US09227373

申请日：1999-01-08

Applicant: Yao-Kui Huang ,  Cheng-Fan Wang

Inventor： Yao-Kui Huang ,  Cheng-Fan Wang

IPC: H05K330

CPC classification number: H05K1/141 ,  H05K1/145 ,  H05K3/3405 ,  H05K3/368 ,  H05K2201/10037 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10689 ,  H05K2201/10939 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178

Abstract: A device and method for manufacturing an integrated real time clock integrated circuit (RTC IC) package is disclosed, in which the RTC IC and its related components are integrated into a single package. Therefore, the layout area required by the integrated RTC IC package is significantly reduced. Also, only a single manual assembling process is required. Furthermore, various examination steps are built into every process to manufacture the integrated RTC IC package to make sure the completed products are in normal condition. No extra examination and fix-up processes are required for the completed products so that manufacturing cost can be significantly reduced.

Abstract translation: 公开了用于制造集成实时时钟集成电路（RTC IC）封装的器件和方法，其中将RTC IC及其相关部件集成到单个封装中。 因此，集成RTC IC封装所需的布局面积大大减少。 此外，只需要一个手动组装过程。 此外，在制造集成的RTC IC封装的每个过程中都内置了各种检测步骤，以确保完成的产品处于正常状态。 完成的产品不需要额外的检查和修理流程，从而可以显着降低制造成本。

公开(公告)号：US5307241A

公开(公告)日：1994-04-26

申请号：US37150

申请日：1993-03-25

Applicant: Antonio Pistilli

Inventor： Antonio Pistilli

IPC: H05K1/00 ,  H05K1/14 ,  H05K3/22 ,  H05K3/34 ,  H05K1/11

CPC classification number: H05K1/147 ,  H05K1/141 ,  H05K3/225 ,  H05K1/0393 ,  H05K2201/096 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10939 ,  H05K3/3447

Abstract: A electronic circuit board arrangement includes a main circuit board on which components are mounted, with component leads passing through holes in this board. Additional components are provided on an auxiliary circuit board at least part of which is directly against the main board, either on the component side underlying components or on a soldering side of the main board. The additional components are connected to the component leads via conductive tracks on the auxiliary board. The auxiliary board can be flexible to also extend over components on the main board. The arrangement is particularly useful for adding additional components to an original circuit design.

Abstract translation: 电子电路板装置包括主电路板，组件被安装在该主电路板上，组件引线穿过该板中的孔。 附加部件设置在辅助电路板上，其辅助电路板的至少一部分直接靠在主板上，无论是在组件侧下部件上还是在主板的焊接侧。 附加组件通过辅助板上的导电轨迹连接到组件引线。 辅助板可以灵活地延伸到主板上的部件上。 该装置对于将附加组件添加到原始电路设计中特别有用。

公开(公告)号：US5184284A

公开(公告)日：1993-02-02

申请号：US754137

申请日：1991-09-03

Applicant: Brian T. Ashelin ,  Mark A. Bergquist ,  Dennis E. Noltee, Sr.

Inventor： Brian T. Ashelin ,  Mark A. Bergquist ,  Dennis E. Noltee, Sr.

IPC: H01L23/52 ,  H01L23/538 ,  H01L25/16 ,  H05K1/14 ,  H05K3/22 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01L25/162 ,  H01L23/5382 ,  H05K1/141 ,  H05K3/225 ,  H01L2924/0002 ,  H05K2201/10287 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2201/10689 ,  H05K2201/10939 ,  H05K3/3421 ,  H05K3/368

Abstract: Engineering changes (EC) for an integrated-circuit (IC) module or circuits connected to an IC module sometimes require the addition of discrete electrical components or circuit chips. Such engineering changes are implemented herein on a small printed circuit card or board that may be physically attached to the top of the IC module. The EC pads on the printed circuit EC card are juxtaposed with the IC module input/output (I/O) pins that require the engineering change. A short fly wire is then soldered between each juxtaposed EC pad and the I/O pin to make the electrical connection between the EC card and the module. In this way, no additional surface area is consumed on the printed circuit board on which the module is mounted.

Abstract translation: 集成电路（IC）模块或连接到IC模块的电路的工程变更（EC）有时需要添加分立的电气元件或电路芯片。 这样的工程变更在本文中可以在可以物理地附接到IC模块的顶部的小型印刷电路卡或板上实现。 印刷电路EC卡上的EC焊盘与需要工程更换的IC模块输入/输出（I / O）引脚并置。 然后，在每个并置的EC焊盘和I / O引脚之间焊接一根短导线，以使EC卡和模块之间的电气连接。 以这种方式，在安装模块的印刷电路板上没有消耗额外的表面积。

公开(公告)号：US4082394A

公开(公告)日：1978-04-04

申请号：US756227

申请日：1977-01-03

Applicant: Ronald Walker Gedney ,  Robert Richard Rodite

Inventor： Ronald Walker Gedney ,  Robert Richard Rodite

IPC: H01L23/32 ,  H01L23/50 ,  H01L23/52 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36 ,  H05K1/12

CPC classification number: H01R12/58 ,  H05K1/141 ,  H01L2224/16225 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/10303 ,  H05K2201/10659 ,  H05K2201/10704 ,  H05K2201/10939 ,  H05K3/3447 ,  H05K3/368

Abstract: A package assembly which combines metallized ceramic technology and printed circuit board multilayer technology. A plurality of modules on a metallized ceramic substrate have closely spaced pins, for example, on 50 mil centers or grid, are plugged into a complex high precision multilayer printed circuit carrier. The pins are staggered in height with the longer pins having a relatively wide spacing, for example, on 100 mil centers or grid. The longer pins protrude through the high precision carrier and plug into a normal relatively simple and low cost printed circuit card or planar package.

公开(公告)号：US20180331447A1

公开(公告)日：2018-11-15

申请号：US15774412

申请日：2016-11-10

Applicant: Phoenix Contact GmbH & Co. KG

Inventor： Ralf Geske

IPC: H01R13/05 ,  H01R43/16 ,  H01R12/71 ,  H05K1/18

CPC classification number: H01R13/052 ,  H01R12/585 ,  H01R12/71 ,  H01R43/16 ,  H05K1/184 ,  H05K2201/10863 ,  H05K2201/10878 ,  H05K2201/10901 ,  H05K2201/10939

Abstract: A plug contact for electrically contacting a circuit board by inserting the plug contact into a via hole in the circuit board, the plug contact having two flat contact arms that are resilient relative to each other, and a connecting region, from which the two contact arms extend in the plug-in direction of the plug contact, the plug contact being punched as a single piece from a flat metallic material. In the connection region, adjacent to the two contact arms, a recess is formed in the plug contact, the distance between the two contact arms increases from the recess towards the free ends of the contact arms, the two contact arms being spread apart relative to each other and the two contact arms together having a width which is the same as or only slightly smaller than the diameter of the corresponding via hole in the circuit board.

公开(公告)号：US20180288873A1

公开(公告)日：2018-10-04

申请号：US15920806

申请日：2018-03-14

Applicant: Delphi International Operations Luxembourg, S.A.R.L.

Inventor： Matthias Rieke ,  Volker Klink ,  Florin Badarau-Trescovan

IPC: H05K1/14 ,  H05K7/20 ,  H05K5/02 ,  H05K1/02 ,  H05K7/14

CPC classification number: H05K1/147 ,  H05K1/0203 ,  H05K1/184 ,  H05K5/0204 ,  H05K5/0213 ,  H05K7/1427 ,  H05K7/1434 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20854 ,  H05K7/20863 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/10189 ,  H05K2201/10901 ,  H05K2201/10939

Abstract: An electronic device for a motor vehicle includes a metal tubular casing extending longitudinally and opening at its two ends, and a wall having a curved profile with cooling fins on its outer surface. The electronic device includes an assembly of printed circuit boards comprising a first plurality of printed circuit boards that include heat-generating electronic components. The printed circuit boards of the assembly are connected together by flexible conductive elements. The device further comprises a first heat sink arranged inside the tubular casing comprising a curved wall generally extending parallel to the curved wall of the tubular casing. The first plurality of printed circuit boards is interposed between the curved inner surface of the wall of the casing and the curved wall of the first heat sink so heat is dissipated through the first heat sink and through the curved wall equipped with cooling fins of the tubular casing.

公开(公告)号：US09519018B2

公开(公告)日：2016-12-13

申请号：US14284451

申请日：2014-05-22

Applicant: Dell Products L.P.

Inventor： James Lewis Petivan ,  Alan R. Dellinger

IPC: G01R31/04 ,  H05K3/42 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34

CPC classification number: G01R31/041 ,  G01R31/04 ,  G01R31/2813 ,  G01R31/2818 ,  H05K1/0268 ,  H05K1/0275 ,  H05K1/113 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/10022 ,  H05K2201/10151 ,  H05K2201/10651 ,  H05K2201/10939 ,  Y10T29/49156 ,  Y10T29/49167

Abstract: In accordance with embodiments of the present disclosure, a circuit board may include a connector configured to electrically couple a device to the circuit board. The connector may include a conductive element configured to be electrically coupled to a first voltage and a detection pad configured to be electrically coupled to a second voltage via a resistor, such that when a device pin of a device is electrically coupled to the conductive element, the detection pad is electrically coupled to the conductive element via the device pin.

Abstract translation: 根据本公开的实施例，电路板可以包括被配置为将设备电耦合到电路板的连接器。 连接器可以包括被配置为电耦合到第一电压的导电元件和被配置为经由电阻器电耦合到第二电压的检测焊盘，使得当器件的器件引脚电耦合到导电元件时， 检测焊盘通过器件引脚电耦合到导电元件。

公开(公告)号：US20120195009A1

公开(公告)日：2012-08-02

申请号：US13392102

申请日：2010-07-29

Applicant: Martin Brueckel ,  Haixiang He ,  Wanchun Jiang

Inventor： Martin Brueckel ,  Haixiang He ,  Wanchun Jiang

IPC: H05K7/14 ,  H05K3/34

CPC classification number: H05K1/144 ,  H01F27/06 ,  H01F2027/065 ,  H05K3/284 ,  H05K3/3447 ,  H05K7/1418 ,  H05K2201/049 ,  H05K2201/1003 ,  H05K2201/10303 ,  H05K2201/10939 ,  Y10T29/49144

Abstract: An electronic product having a double-PCB sandwich structure includes a PCB assembly, and a casing having an open side. The electronic product is configured such that a protuberance is respectively formed on the inner sides of two side walls of the casing in the longitudinal direction, the PCB assembly comprises an electronic component, a base PCB and a main PCB, the length of the base PCB and the length of the main PCB in the longitudinal direction of the casing are substantially equal to each other and slightly smaller than the length of the casing so that the PCB assembly can be installed into the casing by mating with the protuberances.

Abstract translation: 具有双PCB夹层结构的电子产品包括PCB组件和具有开口侧的壳体。 电子产品被构造成使得在纵向方向上分别在壳体的两个侧壁的内侧上形成突起，PCB组件包括电子部件，基底PCB和主PCB，基底PCB的长度 并且主PCB在壳体的纵向方向上的长度基本上彼此相等并且略小于壳体的长度，使得PCB组件可以通过与突起配合而安装到壳体中。

公开(公告)号：US06697215B2

公开(公告)日：2004-02-24

申请号：US09858108

申请日：2001-05-15

Applicant: Mikio Sekine

Inventor： Mikio Sekine

IPC: G11B1702

CPC classification number: H05K1/141 ,  H02K11/215 ,  H02K11/33 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/1003 ,  H05K2201/10651 ,  H05K2201/10939

Abstract: An index signal output device where a magnetic flux detector is moved in the direction of a relevant tangent to the circumference of a rotor yoke so that the phase difference between an index signal detected by the magnetic flux detector and an index reference signal previously recorded on a floppy disk is within a prescribed range. The lead terminals of the magnetic flux detector are connected to detection signal output terminals on a printed circuit board, and the magnetic flux detector is moved for adjustment in the direction of the tangent by flexing the lead terminals using a tool.

Abstract translation: 一种索引信号输出装置，其中磁通检测器沿与转子轭的圆周相切的切线的方向移动，使得由磁通检测器检测到的指标信号和先前记录在转子轭上的指标参考信号之间的相位差 软盘在规定范围内。 磁通检测器的引线端子连接到印刷电路板上的检测信号输出端子，并且通过使用工具使引线端子弯曲来使磁通量检测器沿切线方向移动。