公开(公告)号：US20080239621A1

公开(公告)日：2008-10-02

申请号：US11729688

申请日：2007-03-29

Applicant: Azizuddin Tajuddin ,  Michael S. Randall ,  Roy Grace ,  Mark R. Laps

Inventor： Azizuddin Tajuddin ,  Michael S. Randall ,  Roy Grace ,  Mark R. Laps

IPC: H01G4/228 ,  B23P19/00

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/248 ,  H01G4/30 ,  H05K3/3426 ,  H05K2201/10946 ,  Y02P70/613 ,  Y10T29/53174

Abstract: A capacitor with a multiplicity of first plates and second plates in parallel relationship wherein the first plates terminate at a first face and the second plates terminate at a second face. A dielectric is between the first plates and the second plates. A first external termination is in electrical contact with the first plates and a second external termination is in electrical contact with the second plates. A first lead terminal is in electrical contact with the first external termination and the first lead terminal has a first foot below the first external termination and a first solder stop coated on the first foot between the first foot and the first external termination. A second lead terminal is in electrical contact with the second external termination wherein the second lead terminal comprises a second foot below the second external termination and a second solder stop is coated on the second foot between the second foot and the second external termination.

Abstract translation: 一种具有多个第一板和第二板的并联关系的电容器，其中第一板终止于第一面，而第二板在第二面终止。 电介质位于第一板和第二板之间。 第一外部端接件与第一板电接触，第二外部端接件与第二板电接触。 第一引线端子与第一外部端子电接触，并且第一引线端子具有位于第一外部端子下方的第一脚和在第一脚和第一外部端子之间涂覆在第一脚上的第一焊料停止。 第二引线端子与第二外部端子电接触，其中第二引线端子包括在第二外部端子下方的第二脚，并且在第二脚和第二外部端子之间的第二脚上涂覆第二焊料停止。

公开(公告)号：US20080231305A1

公开(公告)日：2008-09-25

申请号：US12054289

申请日：2008-03-24

Applicant: Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

IPC: G01R31/02

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48

Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Abstract translation: 一种互连装置和形成互连装置的方法。 接触结构附着在第一基底上或形成在第一基底上。 第一衬底附接到比第一衬底大的第二衬底。 可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。 每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

公开(公告)号：US20080207018A1

公开(公告)日：2008-08-28

申请号：US11679177

申请日：2007-02-26

Applicant: Cheng-Lien Chiang

Inventor： Cheng-Lien Chiang

IPC: H05K1/00

CPC classification number: H05K3/32 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3421 ,  H05K3/4015 ,  H05K2201/10265 ,  H05K2201/10318 ,  H05K2201/1059 ,  H05K2201/10946 ,  H05K2201/10962 ,  H05K2201/2036

Abstract: A contact lead for engaging with an aperture lead of a circuit carrier, including a substrate contact portion electrically connected to a pad on a substrate a chip contact portion extending from the substrate contact portion and forming an angle with the substrate contact portion raising from the substrate. The contact lead chip contact portion may also be of a cylindrical shape vertically extending from the substrate contact portion. The present invention also provides a module including a printed circuit board having a plurality of pad thereon, the contact lead electrically connected to the pad, an integrated circuit carrier having a plurality of aperture leads, the aperture leads passing through the contact leads and contacting respectively thereof, and a housing structure for housing the module and providing access for the user to assemble the integrated circuit carrier.

Abstract translation: 一种用于与电路载体的孔径引线接合的接触引线，包括基板接触部分，电连接到基板上的焊盘，该芯片接触部分从基板接触部分延伸并与基板接触部分形成一角度， 。 接触引线芯片接触部分也可以是从基板接触部分垂直延伸的圆柱形形状。 本发明还提供了一种模块，其包括其上具有多个焊盘的印刷电路板，所述触点引线电连接到所述焊盘，集成电路载体，具有多个孔径引线，所述孔引线通过所述接触引线并分别接触 以及用于容纳模块并提供用于组装集成电路载体的接口的壳体结构。

公开(公告)号：US20080054437A1

公开(公告)日：2008-03-06

申请号：US11851284

申请日：2007-09-06

Applicant: Sung-Wook HWANG

Inventor： Sung-Wook HWANG

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H05K1/181 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/10946 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package-on-package (POP) package in which semiconductor packages are stacked using lead lines rather than conventional solder balls, and a fabricating method thereof are provided. According to the POP package and the fabricating method thereof of the present invention, the POP package is prevented from being short-circuited even when an underlying semiconductor package gets thicker and the POP package can sufficiently withstand deformation caused by post-fabrication warpage.

Abstract translation: 一种封装封装（POP）封装，其中使用引线而不是常规焊球堆叠半导体封装，并提供其制造方法。 根据本发明的POP封装及其制造方法，即使下面的半导体封装变厚并且POP封装能够充分地承受由后制造翘曲引起的变形，也可以防止POP封装短路。

公开(公告)号：US20070218710A1

公开(公告)日：2007-09-20

申请号：US11525755

申请日：2006-09-22

Applicant: Dirk Brown ,  John Williams ,  William Long

Inventor： Dirk Brown ,  John Williams ,  William Long

IPC: H01R12/00

CPC classification number: H01R13/2407 ,  H05K3/326 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/10719 ,  H05K2201/10924 ,  H05K2201/10946

Abstract: An elastic contact array circuitized substrate includes a circuitized substrate provided with circuit traces, and an array of three dimensional contact elements joined to the circuitized substrate and electrically coupled to the circuit traces. In one configuration, the array of three dimensional contacts are formed in a spring sheet material having anisotropic grains whose long direction is selected with respect to the longitudinal direction of elastic contact arms, in accordance with desired properties. In another configuration of the invention, the circuit traces are formed integrally within the spring sheet material.

Abstract translation: 弹性接触阵列电路化衬底包括设置有电路迹线的电路化衬底和连接到电路化衬底并电耦合到电路迹线的三维接触元件的阵列。 在一种结构中，根据所需的性质，三维触点阵列形成为具有相对于弹性接触臂的纵向方向选择长方向的各向异性颗粒的弹簧片材料。 在本发明的另一种结构中，电路迹线一体形成在弹簧片材料内。

公开(公告)号：US07202677B2

公开(公告)日：2007-04-10

申请号：US10749028

申请日：2003-12-30

Applicant: David V. Pedersen ,  Benjamin N. Eldridge ,  Igor Y. Khandros

Inventor： David V. Pedersen ,  Benjamin N. Eldridge ,  Igor Y. Khandros

IPC: G01R31/02

CPC classification number: H01L25/16 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0408 ,  G01R1/0433 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/01 ,  G01R31/2863 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19043 ,  H05K1/141 ,  H05K3/20 ,  H05K3/325 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/09472 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48

Abstract: Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

Abstract translation: 提供产品和组件用于可插拔地接收从电子部件（例如半导体器件）延伸的细长互连元件，例如弹簧接触元件。 插座基板设置有用于接收从电子部件延伸的细长互连元件的端部的捕获垫。 公开了各种捕获垫结构。 通过邻近插座基板表面的导电迹线提供与外部设备的连接。 插座基板可以由支撑基板支撑。 在特别优选的实施例中，捕获垫直接形成在诸如印刷电路板的主要基底上。

公开(公告)号：US07185821B1

公开(公告)日：2007-03-06

申请号：US10614905

申请日：2003-07-07

Applicant: Sergio Camerlo ,  Yida Zou ,  Luca Cafiero ,  Gary L. Myers ,  Bobby Parizi ,  Hsing-Sheng Liang

Inventor： Sergio Camerlo ,  Yida Zou ,  Luca Cafiero ,  Gary L. Myers ,  Bobby Parizi ,  Hsing-Sheng Liang

IPC: G06K19/02

CPC classification number: H01L23/49816 ,  H01L23/49805 ,  H01L23/49861 ,  H01L23/50 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0263 ,  H05K3/222 ,  H05K3/325 ,  H05K3/3415 ,  H05K3/3421 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/1053 ,  H05K2201/10659 ,  H05K2201/10734 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic interconnection system for delivering high-current power and ground voltages using a non-bottom side of a chip package substrate. The system includes a printed wiring board (PWB), a chip package, and a bridge lead. The PWB has at least a first and a second contact pad. The chip package includes a chip and a package substrate. The chip is mounted onto the package substrate and the package substrate has a bottom surface having at least a first contact pad and a second surface having at least a second contact pad. The first contact pad of the PWB and the first contact pad of the package substrate are coupled together. The bridge lead couples the second contact pad of the PWB with the second contact pad of the package substrate. The bridge lead may be selected from styles including flying lead, edge wiping, top wiping, and double wiping.

Abstract translation: 一种用于使用芯片封装衬底的非底侧提供大电流电源和接地电压的电子互连系统。 该系统包括印刷电路板（PWB），芯片封装和桥接引线。 PWB至少具有第一和第二接触垫。 芯片封装包括芯片和封装衬底。 芯片安装在封装衬底上，封装衬底具有至少第一接触焊盘和至少具有第二接触焊盘的第二表面的底表面。 PWB的第一接触焊盘和封装衬底的第一接触焊盘耦合在一起。 桥引线将PWB的第二接触焊盘与封装衬底的第二接触焊盘耦合。 桥引线可以从包括飞铅，边缘擦拭，顶部擦拭和双重擦拭的样式中选择。

公开(公告)号：US07064566B2

公开(公告)日：2006-06-20

申请号：US09042606

申请日：1998-03-16

Applicant: Igor Y. Khandros ,  A. Nicholas Sporck ,  Benjamin N. Eldridge

Inventor： Igor Y. Khandros ,  A. Nicholas Sporck ,  Benjamin N. Eldridge

IPC: G01R31/02

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07364 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599

Abstract: In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

公开(公告)号：US20060033517A1

公开(公告)日：2006-02-16

申请号：US11256514

申请日：2005-10-19

Applicant: Igor Khandros ,  Gaetan Mathieu

Inventor： Igor Khandros ,  Gaetan Mathieu

IPC: G01R31/02

CPC classification number: B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07378 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/04042 ,  H01L2224/1134 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/328 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/049 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49179 ,  Y10T29/49204 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/72

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract translation: 一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。 接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。 提供导电外壳，并且由至少一层导电材料形成，该导电材料层包围细长构件，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合。

公开(公告)号：US06936921B2

公开(公告)日：2005-08-30

申请号：US10706307

申请日：2003-11-12

Applicant: Katsuyuki Yoshida

Inventor： Katsuyuki Yoshida

IPC: H01L23/053 ,  H01L23/12 ,  H01L23/34 ,  H01L23/498 ,  H01L23/66 ,  H01L29/00 ,  H01P1/04 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0243 ,  H01L23/49805 ,  H01L23/66 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15313 ,  H01L2924/16195 ,  H01L2924/1903 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P1/047 ,  H05K3/3421 ,  H05K2201/10689 ,  H05K2201/10946 ,  H05K2201/10969 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A high-frequency package comprises a dielectric substrate, on an upper face of which a mounting portion of a high-frequency circuit component is formed, a first line conductor formed on the upper face for transmitting high-frequency signals, a first coplanar grounding conductor, a second line conductor formed on a lower face, a second coplanar grounding conductor, a through conductor formed inside for connecting the first and second line conductors, a grounding through conductor connecting the first and second coplanar grounding conductors, a metal terminal bonded to the second line conductor, and grounding metal terminals bonded to the second coplanar grounding conductor, wherein a gap between the grounding metal terminals is equal to or less than ½ of a wavelength of high-frequency signals.

Abstract translation: 高频组件包括介电衬底，其上表面上形成有高频电路部件的安装部分，形成在上表面上用于传输高频信号的第一线导体，第一共面接地导体 ，形成在下表面上的第二线导体，第二共面接地导体，形成在内部用于连接第一和第二线导体的通孔导体，连接第一和第二共面接地导体的接地导体， 第二线路导体和接地金属端子接合到第二共面接地导体，其中接地金属端子之间的间隙等于或小于高频信号波长的1/2。