公开(公告)号：US11744021B2

公开(公告)日：2023-08-29

申请号：US17581824

申请日：2022-01-21

Applicant: Analog Devices, Inc.

Inventor： Hien Minh Pham

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/181 ,  H05K1/115 ,  H05K3/303 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10954

Abstract: In one embodiment, an electronic assembly can include: a first electronic device package configured to be mounted on and electrically connected with a system substrate; a second electronic device package electrically connected to the system substrate; and an electrical pathway configured to extend from the system substrate through the first electronic device package and connected to an input terminal of the second electronic device package, the electrical pathway bypassing processing circuitry of the first electronic device package.

公开(公告)号：US09832874B2

公开(公告)日：2017-11-28

申请号：US14745526

申请日：2015-06-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Andreas C. Doering ,  Ralph Heller ,  Ronald P. Luijten ,  Martin L. Schmatz

IPC: H05K3/20 ,  H05K1/11 ,  H01R12/73 ,  H05K1/14 ,  H01R43/26 ,  H01R12/52 ,  H01R13/24 ,  H05K3/36

CPC classification number: H05K1/117 ,  H01R12/52 ,  H01R12/73 ,  H01R13/2414 ,  H01R43/26 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10954 ,  Y10T29/49128

Abstract: A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.

公开(公告)号：US09414493B2

公开(公告)日：2016-08-09

申请号：US14715943

申请日：2015-05-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Andreas C. Doering ,  Ralph Heller ,  Ronald P. Luijten ,  Martin L. Schmatz

IPC: H05K1/11 ,  H01R12/52 ,  H01R13/24 ,  H05K1/14 ,  H01R12/73 ,  H01R43/26 ,  H05K3/36

CPC classification number: H05K1/117 ,  H01R12/52 ,  H01R12/73 ,  H01R13/2414 ,  H01R43/26 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10954 ,  Y10T29/49128

Abstract: A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.

Abstract translation: 印刷电路板（PCB）组件包括基本上平行且彼此相对设置的第一PCB和第二PCB，使得第一PCB的第二面与第二PCB的第一侧相对; 其中所述第二PCB在其第一侧上具有第一组侧连接器，在其第二侧上具有第二组侧连接器，其被配置用于与所述第二PCB的电力供应和信号通信; 第二PCB经由第一弹性体连接器电连接和机械地连接到第一PCB的第二侧; 并且所述第二PCB经由其第二组侧连接器电连接到所述第一PCB，以及电连接到所述第二组侧连接器和所述第一PCB的柔性电连接器。

公开(公告)号：US20150351242A1

公开(公告)日：2015-12-03

申请号：US14715943

申请日：2015-05-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： ANDREAS C. DOERING ,  RALPH HELLER ,  RONALD P. LUIJTEN ,  MARTIN L. SCHMATZ

IPC: H05K1/11 ,  H05K1/14 ,  H01R12/73

CPC classification number: H05K1/117 ,  H01R12/52 ,  H01R12/73 ,  H01R13/2414 ,  H01R43/26 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10954 ,  Y10T29/49128

Abstract: A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.

Abstract translation: 印刷电路板（PCB）组件包括基本上平行且彼此相对设置的第一PCB和第二PCB，使得第一PCB的第二面与第二PCB的第一侧相对; 其中所述第二PCB在其第一侧上具有第一组侧连接器，在其第二侧上具有第二组侧连接器，其被配置用于与所述第二PCB的电力供应和信号通信; 第二PCB经由第一弹性体连接器电连接和机械地连接到第一PCB的第二侧; 并且所述第二PCB经由其第二组侧连接器电连接到所述第一PCB，以及电连接到所述第二组侧连接器和所述第一PCB的柔性电连接器。

公开(公告)号：US20150208508A1

公开(公告)日：2015-07-23

申请号：US14420730

申请日：2013-08-09

Applicant: SMARTRAC TECHNOLOGY GMBH

Inventor： Carsten Nieland ,  Frank Kriebel

IPC: H05K1/18 ,  H05K3/30 ,  H01L23/00

CPC classification number: H05K1/18 ,  H01L21/76885 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/11462 ,  H01L2224/11622 ,  H01L2224/13006 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13019 ,  H01L2224/13022 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/81206 ,  H01L2224/81345 ,  H01L2224/81898 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/00014 ,  H05K3/301 ,  H05K3/3431 ,  H05K2201/1059 ,  H05K2201/10674 ,  H05K2201/10954 ,  H05K2203/0415 ,  Y10T29/49018 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05552

Abstract: The invention relates to a contact bump connection (24) and to a method for producing a contact bump connection between an electronic component being provided with at least one terminal face (11) and a contact substrate (26) being contacted with the component and having at least one second terminal face (25), wherein the first terminal face is provided with a contact bump (10), which has a raised edge (15) and has at least one displacement pin (16) in a displacement compartment (18) being surrounded by the raised edge and being open towards a head end of the contact bump, and wherein, in a contact region (31) with the first terminal face, the second terminal face has a contact bead (30), which is formed by displacement of a contact material (29) of the second terminal face into the displacement compartment and which surrounds the displacement pin, said contact bead having a bead crown (33) which is oriented to a bottom (17) of the displacement compartment and is raised relative to a level contact surface (32) of the second terminal face surrounding the contact region.

Abstract translation: 本发明涉及一种接触凸块连接（24）以及一种在电子部件之间产生接触凸块连接的方法，该电子部件设置有至少一个端面（11）和与部件接触的接触基板（26），并具有 至少一个第二端面（25），其中所述第一端面设置有接触凸块（10），所述接触凸块具有凸起边缘（15），并且在位移室（18）中具有至少一个位移销（16） 被凸起边缘包围并且朝向接触凸块的头端开口，并且其中，在具有第一端子面的接触区域（31）中，第二端子面具有接触凸缘（30），其形成为接触凸起 第二端面的接触材料（29）移动到位移室中并且围绕位移销，所述接触凸珠具有朝向位移室的底部（17）的凸缘（33），并且升高 相对于le 围绕接触区域的第二端面的vel接触表面（32）。

公开(公告)号：US20150049443A1

公开(公告)日：2015-02-19

申请号：US13965246

申请日：2013-08-13

Applicant: Infineon Technologies AG

Inventor： Georg Meyer-Berg

IPC: H05K1/18

CPC classification number: H05K1/189 ,  H01L23/49833 ,  H01L23/4985 ,  H01L23/5383 ,  H01L23/5387 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/0209 ,  H05K1/0271 ,  H05K1/141 ,  H05K1/145 ,  H05K3/32 ,  H05K3/361 ,  H05K2201/05 ,  H05K2201/10378 ,  H05K2201/105 ,  H05K2201/1053 ,  H05K2201/10659 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10954 ,  H05K2201/10962 ,  H01L2924/00

Abstract: According to various embodiments, a chip arrangement may be provided, the chip arrangement may include: a first carrier; at least one chip arranged over the first carrier; a flexible structure including a wiring layer structure; and a contact structure arranged between the first carrier and the wiring layer structure, wherein the at least one chip is electrically coupled to the first carrier via the wiring layer structure and the contact structure.

Abstract translation: 根据各种实施例，可以提供芯片布置，芯片布置可以包括：第一载体; 布置在所述第一载体上的至少一个芯片; 包括布线层结构的柔性结构; 以及布置在所述第一载体和所述布线层结构之间的接触结构，其中所述至少一个芯片经由所述布线层结构和所述接触结构电耦合到所述第一载体。

公开(公告)号：US20140346680A1

公开(公告)日：2014-11-27

申请号：US14365535

申请日：2012-12-13

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT

Inventor： Roland Gers

IPC: H05K1/11 ,  H01L23/498

CPC classification number: H05K1/115 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/06181 ,  H01L2224/11462 ,  H01L2224/13009 ,  H01L2224/13021 ,  H01L2224/13025 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/16146 ,  H01L2224/16147 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2924/00014 ,  H01L2924/1461 ,  H05K2201/10954 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A method and an electronic component including: a substrate including at least a hole at least partially going through a thickness of the substrate; an electrically conducting element positioned in the hole and configured to form an electric connection through the hole, wherein the electrically conducting element includes an electrically conducting and self-supporting pillar with a height oriented according to the thickness of the substrate; and a space between at least a part of the wall of the hole and a part of a peripheral wall of the pillar.

Abstract translation: 一种方法和电子部件，包括：至少包括至少部分穿过所述基板的厚度的孔的基板; 定位在所述孔中并被构造成通过所述孔形成电连接的导电元件，其中所述导电元件包括​​导电和自支撑柱，所述导电和自支撑柱的高度根据所述基板的厚度取向; 以及孔的壁的至少一部分与柱的周壁的一部分之间的空间。