公开(公告)号：US07652367B2

公开(公告)日：2010-01-26

申请号：US11959557

申请日：2007-12-19

Applicant: Kyung-Lae Jang ,  Kwon-Young Roh

Inventor： Kyung-Lae Jang ,  Kwon-Young Roh

IPC: H01L23/48

CPC classification number: H01L25/105 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85365 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K3/325 ,  H05K2201/10287 ,  H05K2201/209 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package on package includes a tower package, an upper package stacked over the lower package, a plug wire combined to any one of an upper portion of the tower package and a lower portion of the upper package, and a socket wire combined to any one of the upper portion of the lower package and the lower portion of the upper package. The plug wire is plugged into the socket wire to electrically connect the upper and lower packages.

Abstract translation: 封装的半导体封装包括塔式封装，堆叠在下封装上的上封装，组合到塔式封装的上部中的任一个和上封装的下部的插头线，以及组合到任何 下部封装的上部中的一个和上部封装的下部。 插头线插入插座线，以电连接上下包装。

公开(公告)号：US20090233465A1

公开(公告)日：2009-09-17

申请号：US11885262

申请日：2006-10-27

Applicant: Masanori Mizoguchi

Inventor： Masanori Mizoguchi

IPC: H01R12/00

CPC classification number: H01R12/592 ,  H01R12/58 ,  H01R12/613 ,  H01R12/62 ,  H01R12/777 ,  H01R12/778 ,  H01R12/78 ,  H01R12/79 ,  H05K1/118 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/0969 ,  H05K2201/1059 ,  H05K2201/209

Abstract: An electrical connection structure allowing reduction in height and easy disassembly, wherein a first connecting member comprises a flexible substrate comprising a flexible insulating film, at least one conductive pad formed on at least one side thereof, a conductive circuit pattern extending from the rim of the pad, a through-hole formed through the thickness thereof at a planar position within the pad, and a small aperture formed at a planar position within the pad and communicating with the through-hole, and a second connecting member comprises a conductive projection formed at least one side thereof and electrically connected with a conductive circuit pattern formed inside or on the second connecting member, where the electrical connection is formed in the manner such that the conductive projection is inserted in the through-hole, through the small aperture, and mechanically contacts the pad.

Abstract translation: 一种电连接结构，其允许降低高度并易于拆卸，其中第一连接构件包括柔性基底，该柔性基底包括柔性绝缘膜，至少一个导电垫在其至少一侧上形成，导电电路图案从 衬垫，在衬垫内的平面位置处形成通过其厚度的通孔，以及形成在衬垫内的平面位置并与通孔连通的小孔，第二连接构件包括形成在 至少一侧，并与形成在第二连接构件的内部或第二连接构件上的导电电路图形电连接，其中电连接形成为使得导电突起通过小孔插入到通孔中，并机械地 接触垫

公开(公告)号：US20090181557A1

公开(公告)日：2009-07-16

申请号：US12406416

申请日：2009-03-18

Applicant: Thomas Michael Ales ,  Davis-Dang Hoang Nhan

Inventor： Thomas Michael Ales ,  Davis-Dang Hoang Nhan

IPC: H01R12/00

CPC classification number: H01R43/0256 ,  H01R13/03 ,  H05K3/308 ,  H05K3/341 ,  H05K2201/1031 ,  H05K2201/209 ,  Y02P70/611 ,  Y02P70/613

Abstract: The present disclosure is directed to conductive connector attachments for use in electrically connecting printed circuit boards to absorbent products such as diapers, training pants, incontinence products, feminine hygiene products, and the like. Specifically, various configurations and methods of securely attaching conventional conductive hook and loop attachments to printed circuit boards are disclosed.

Abstract translation: 本公开涉及用于将印刷电路板电连接到诸如尿布，训练裤，失禁产品，女性卫生产品等吸收产品的导电连接器附件。 具体地，公开了将常规导电钩和环附接件牢固地连接到印刷电路板的各种配置和方法。

公开(公告)号：US20090017670A1

公开(公告)日：2009-01-15

申请号：US12171856

申请日：2008-07-11

Applicant: ATSUO HATTORI

Inventor： ATSUO HATTORI

IPC: H01R13/627 ,  H01R43/16

CPC classification number: H05K3/365 ,  H01L2924/0002 ,  H01R12/52 ,  H01R12/718 ,  H01R13/11 ,  H01R13/20 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/209 ,  Y10T29/49204 ,  H01L2924/00

Abstract: An electronic component includes a substrate, an interconnection element, and a connector. The interconnection element has conductivity. The interconnection element is present over the substrate. The connector is present on the interconnection element. The connector may further include, but is not limited to, a base, at least one stopper, and at least one sloped guiding surface. The base projects from the interconnection element in a first direction that is vertical to the surface of the substrate. At least one stopper projects from the base in a second direction that is parallel to the surface of the substrate. The one stopper has a stopper surface.

Abstract translation: 电子部件包括基板，互连元件和连接器。 互连元件具有导电性。 互连元件存在于衬底上。 连接器存在于互连元件上。 连接器还可以包括但不限于底座，至少一个止动器和至少一个倾斜的引导表面。 基底从垂直于基底表面的第一方向突出互连元件。 至少一个止动件在与基板的表面平行的第二方向从基座突出。 一个止动器具有止动器表面。

公开(公告)号：US07442053B2

公开(公告)日：2008-10-28

申请号：US12031156

申请日：2008-02-14

Applicant: William L. Brodsky ,  Mark G. Clark ,  Amanda E. E. Mikhail ,  Arvind K. Sinha ,  Scott A. Shurson ,  Jason T. Stoll

Inventor： William L. Brodsky ,  Mark G. Clark ,  Amanda E. E. Mikhail ,  Arvind K. Sinha ,  Scott A. Shurson ,  Jason T. Stoll

IPC: H01R9/22

CPC classification number: H01R12/7011 ,  H01R12/716 ,  H01R12/721 ,  H01R13/514 ,  H05K1/181 ,  H05K2201/10189 ,  H05K2201/10537 ,  H05K2201/209 ,  Y02P70/611

Abstract: An electrical connector includes a first connector body having an interlocking feature extending therefrom. The interlocking feature interlocks the first connector body with a complimentary interlocking feature extending from an adjacent second connector body to distribute a lateral force on either the first or second connector bodies across the adjacent connector body thereby reducing a rotational moment at a base of each electrical connector connected to a printed circuit board (PCB).

Abstract translation: 电连接器包括具有从其延伸的互锁特征的第一连接器主体。 互锁特征将第一连接器主体与相邻的第二连接器主体相互延伸的互补互锁特征互锁，以将第二或第二连接器主体上的横向力分布在相邻的连接器本体上，从而减小每个电连接器的基座处的旋转力矩 连接到印刷电路板（PCB）。

公开(公告)号：US20080191944A1

公开(公告)日：2008-08-14

申请号：US11885907

申请日：2006-03-08

Applicant: Volker Brod

Inventor： Volker Brod

IPC: H01L21/50 ,  H01Q1/38

CPC classification number: H05K3/325 ,  H01L23/49811 ,  H01L23/49855 ,  H01L24/05 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/81897 ,  H01L2224/83897 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01R4/26 ,  H05K2201/10674 ,  H05K2201/209 ,  H01L2224/45099

Abstract: The invention relates to a method for establishing an electrical and mechanical connection between chip contact surfaces of an RFID chip and contact surfaces arranged on a strip-like substrate, wherein the chip contact surfaces which have on their surfaces a plurality of thread-like hooks and/or thread-like eyes are hooked together, under the effect of pressure, with the associated contact surfaces which have on their surfaces a plurality of thread-like eyes and/or thread-like hooks. A transponder is shown.

Abstract translation: 本发明涉及一种用于在RFID芯片的芯片接触表面和布置在条状基板上的接触表面之间建立电气和机械连接的方法，其中芯片接触表面在其表面上具有多个线状钩子， /或线状眼睛在压力作用下被钩在一起，与相关联的接触表面在表面上具有多个线状眼睛和/或线状钩。 显示应答器。

公开(公告)号：US20080150116A1

公开(公告)日：2008-06-26

申请号：US11959557

申请日：2007-12-19

Applicant: Kyung-Lae JANG ,  Kwon-Young ROH

Inventor： Kyung-Lae JANG ,  Kwon-Young ROH

IPC: H01L23/48

CPC classification number: H01L25/105 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85365 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K3/325 ,  H05K2201/10287 ,  H05K2201/209 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package on package includes a tower package, an upper package stacked over the lower package, a plug wire combined to any one of an upper portion of the tower package and a lower portion of the upper package, and a socket wire combined to any one of the upper portion of the lower package and the lower portion of the upper package. The plug wire is plugged into the socket wire to electrically connect the upper and lower packages.

Abstract translation: 封装的半导体封装包括塔式封装，堆叠在下封装上的上封装，组合到塔式封装的上部中的任一个和上封装的下部的插头线，以及组合到任何 下部封装的上部中的一个和上部封装的下部。 插头线插入插座线，以电连接上下包装。

公开(公告)号：US20060205273A1

公开(公告)日：2006-09-14

申请号：US10906810

申请日：2005-03-08

Applicant: William Brodsky ,  James Busby ,  Bruce Chamberlin ,  Mitchell Ferrill ,  Robin Susko ,  James Wilcox

Inventor： William Brodsky ,  James Busby ,  Bruce Chamberlin ,  Mitchell Ferrill ,  Robin Susko ,  James Wilcox

IPC: H01R13/40

CPC classification number: H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0501 ,  H01L2224/05011 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R4/01 ,  H01R12/52 ,  H05K3/325 ,  H05K2201/068 ,  H05K2201/209 ,  H05K2203/1105 ,  H01L2224/05099

Abstract: A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.

Abstract translation: 公开了一种用于形成用于半导体封装的可移除互连的方法和结构，其中连接器适于在经受温度变化时从第一形状重复地变为第二形状，并且在不受影响时重复地返回到第一形状 到温度变化。 当连接器处于其第二形状时，连接器可以断开，并且当连接器处于其第一形状时连接器不能断开。

公开(公告)号：US20060103641A1

公开(公告)日：2006-05-18

申请号：US11273454

申请日：2005-11-14

Applicant: Duane Marhefka

Inventor： Duane Marhefka

IPC: G09G5/00

CPC classification number: H05K3/365 ,  G02F1/1345 ,  H01H2001/125 ,  H05K2201/209

Abstract: A display device includes an electronic display adapted to produce images, an electronic device that electrically communicates with the display and a zipper interconnect adapted to enable electrical connection between the display and the electronic device. The electronic display can be a reflective display such as a liquid crystal display or an emissive display such as one containing light emitting diodes. The electronic device that communicates with the display can be drive electronics adapted to electrically address the display so as to produce the images. In particular, the display is a cholesteric liquid crystal display that can be bistable and in the form of a passive matrix, active matrix or direct drive display. The zipper interconnect can include two rows of conductive teeth that are each electrically connected to one or more of: display electrodes, drive electronics, controller or associated electronics supported on one or more substrate portions. One set of traces can be connected to the display device (or to devices permanently connected thereto) on one substrate portion while the other set of traces can be connected to associated electronics on another substrate portion. When the zipper interconnect is moved so as to engage the teeth of the first and second rows together an electrical connection is made between the display device (or to devices permanently connected thereto) and associated electronics. Electrically insulative teeth can alternate with conductive teeth in the rows of teeth.

Abstract translation: 显示设备包括适于产生图像的电子显示器，与显示器电通信的电子设备以及适于实现显示器和电子设备之间的电连接的拉链互连。 电子显示器可以是反射显示器，例如液晶显示器或诸如包含发光二极管的发射显示器。 与显示器通信的电子设备可以是适于电地寻址显示器以便产生图像的驱动电路。 特别地，显示器是胆甾型液晶显示器，其可以是双稳态的，并且是无源矩阵，有源矩阵或直接驱动显示器的形式。 拉链互连可以包括两排导电齿，每排导电齿电连接到支撑在一个或多个衬底部分上的显示电极，驱动电路，控制器或相关联的电子器件中的一个或多个。 一组迹线可以连接到一个基板部分上的显示装置（或永久连接到其上的装置），而另一组迹线可以连接到另一基板部分上的相关电子装置。 当拉链互连被移动以便将第一和第二列的齿接合在一起时，在显示装置（或与其永久连接的装置）和相关的电子装置之间形成电连接。 电绝缘齿可与齿排中的导电齿交替。

公开(公告)号：US06977055B2

公开(公告)日：2005-12-20

申请号：US10423816

申请日：2003-04-25

Applicant: Christopher M. Gallant ,  Michel Labrecque ,  Mark A. Clarner ,  John DeMain

Inventor： Christopher M. Gallant ,  Michel Labrecque ,  Mark A. Clarner ,  John DeMain

IPC: H05K7/00 ,  B29C43/22 ,  B60R16/02 ,  H01B7/00 ,  H01B7/08 ,  H01B7/40 ,  H01B13/00 ,  H02G3/30 ,  H02G3/38 ,  H05K1/00 ,  H05K3/00 ,  H05K3/20 ,  H05K3/32 ,  H05K3/36 ,  H05K7/14 ,  B29C47/02 ,  B29C47/06

CPC classification number: B29C43/28 ,  B29C43/222 ,  B29C2043/465 ,  B29L2031/729 ,  B60R16/0207 ,  B60R16/0215 ,  H01B7/08 ,  H01B7/40 ,  H05K1/0393 ,  H05K3/0014 ,  H05K3/0058 ,  H05K3/202 ,  H05K3/326 ,  H05K3/365 ,  H05K2201/09118 ,  H05K2201/209 ,  H05K2203/0113 ,  H05K2203/0143 ,  H05K2203/1545 ,  Y10T428/2933

Abstract: An elongated electrical cable or flexible circuit board includes an electrically conductive path and an insulating body encompassing and electrically isolating the conductive path, the insulating body including an exposed surface having an array of fastener elements extending therefrom, the fastener elements arranged and constructed to engage mating fastener elements associated with a supporting surface to selectively secure the cable or flexible circuit board to the supporting surface. The fastener elements can be loop-engageable fasteners and/or loops. Such a cable or flexible circuit board is continuously formed by introducing an electrical insulating material including a thermoplastic resin into a gap formed adjacent a peripheral surface of a rotating mold roll, the mold roll defining an array of cavities therein, the insulating material being introduced under pressure and temperature conditions selected to cause the insulating material to at least partially fill the cavities to form fastener element stems integrally with and extending from one broad side of a strip of said insulation material; while introducing conductive wires and/or a conductive path formed on or within a substrate to the gap so as to cause the insulating material to envelop and electrically isolate the conductive path and/or to cause the conductive path to become an integral part of the strip of insulation material from which the fastener element stems extend.

Abstract translation: 细长的电缆或柔性电路板包括导电路径和绝缘体，其包围并电绝缘导电路径，绝缘体包括具有从其延伸的紧固件元件阵列的暴露表面，所述紧固件元件被布置和构造成接合配合 与支撑表面相关联的紧固元件以选择性地将电缆或柔性电路板固定到支撑表面。 紧固件元件可以是可与圈接合的紧固件和/或环。 这种电缆或柔性电路板通过将包括热塑性树脂的电绝缘材料引入到邻近旋转模具辊的周边表面形成的间隙中而连续地形成，模具辊在其中限定一系列空腔，绝缘材料被引入到 选择的压力和温度条件使得绝缘材料至少部分地填充空腔以与所述绝缘材料的条带的一个宽侧一体地形成并从其延伸; 同时将导电线和/或形成在衬底上或衬底内的导电路径引入间隙，以便使绝缘材料包封并电绝缘导电路径和/或使导电路径成为带的整体部分 的绝缘材料，紧固件元件从其延伸。