公开(公告)号：US20170094808A1

公开(公告)日：2017-03-30

申请号：US14941908

申请日：2015-11-16

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. BRODSKY ,  Silvio DRAGONE ,  Roger S. KRABBENHOFT ,  David C. LONG ,  Stefano S. OGGIONI ,  Michael T. PEETS ,  William SANTIAGO-FERNANDEZ

IPC: H05K3/30 ,  H05K3/32

CPC classification number: G01D5/16 ,  H05K1/0275 ,  H05K1/0298 ,  H05K1/182 ,  H05K3/30 ,  H05K3/32 ,  H05K2201/09263 ,  H05K2201/096 ,  H05K2201/10151 ,  H05K2201/10371

Abstract: Methods of fabricating electronic circuits and electronic packages are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board. In certain embodiments, one or more of the tamper-respondent layers are divided into multiple, separate tamper-respondent circuit zones, with the tamper-respondent layers, including the circuit zones, being electrically connected to monitor circuitry within the secure volume.

公开(公告)号：US20170090532A1

公开(公告)日：2017-03-30

申请号：US15125339

申请日：2015-03-06

Applicant: Kaneka Corporation

Inventor： Aki Koukami ,  Koichi Nishiura ,  Takeshi Nakagaki

IPC: G06F1/20 ,  H05K3/28 ,  H05K1/18 ,  H05K1/02 ,  H05K9/00 ,  H05K7/20

CPC classification number: G06F1/203 ,  G06F1/1656 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/284 ,  H05K3/285 ,  H05K7/20409 ,  H05K7/20463 ,  H05K9/0024 ,  H05K2201/10371 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2924/00

Abstract: The electronic terminal equipment comprising an electronic substrate on which a heat-generating electronic component is mounted and an electromagnetic shield member attached in proximity to the heat-generating electronic component, the electronic substrate being filled with a cured product of a thermally-conductive curable liquid resin between the electromagnetic shield member and the electronic substrate, and a thermally-conductive film being disposed in contact with an upper surface of the electromagnetic shield member or facing the upper surface thereof so as to diffuse heat that came up through the cured thermally-conductive curable liquid resin.

公开(公告)号：US09549481B2

公开(公告)日：2017-01-17

申请号：US13922622

申请日：2013-06-20

Applicant: Seiko Epson Corporation

Inventor： Tomoyuki Kamakura

IPC: H05K1/03 ,  H05K7/00 ,  H05K1/18 ,  H05K3/30 ,  H03H9/10 ,  H05K3/24 ,  H03H9/05 ,  H05K3/32

CPC classification number: H05K7/00 ,  H01L2224/16225 ,  H03H9/0509 ,  H03H9/1021 ,  H05K1/0306 ,  H05K1/18 ,  H05K3/246 ,  H05K3/30 ,  H05K3/321 ,  H05K2201/0347 ,  H05K2201/10083 ,  H05K2201/10371 ,  H05K2203/1131 ,  H05K2203/1147 ,  Y10T29/49117 ,  Y10T29/4913

Abstract: A method for producing a base substrate includes preparing an insulator substrate; forming a first film containing, as a main component, a metal that contains at least one of tungsten and molybdenum and has a melting point of 1000° C. or higher on the insulator substrate; forming a second film containing nickel as a main component and also containing boron on the first film; forming a first metal layer by performing a sintering treatment of the first film and the second film; and forming a second metal layer containing palladium as a main component on the first metal layer.

Abstract translation: 一种制造基底基板的方法包括：制备绝缘体基板; 在所述绝缘体基板上形成含有含有钨和钼中的至少一种且熔点为1000℃以上的金属作为主要成分的第一膜， 在第一膜上形成含有镍作为主要成分并且还含有硼的第二膜; 通过对所述第一膜和所述第二膜进行烧结处理来形成第一金属层; 以及在所述第一金属层上形成含有钯作为主要成分的第二金属层。

公开(公告)号：US20170011839A1

公开(公告)日：2017-01-12

申请号：US15271889

申请日：2016-09-21

Applicant: KYOCERA CORPORATION

Inventor： Masaki NAKAO

IPC: H01F27/28 ,  H05K1/02 ,  H05K1/18 ,  H01F27/245

CPC classification number: H01F27/2804 ,  H01F27/245 ,  H01F27/365 ,  H01F38/14 ,  H04M1/03 ,  H05K1/0216 ,  H05K1/18 ,  H05K2201/10371

Abstract: An electronic device is disclosed. An electronic device comprises a first magnetic sheet, a coil, and a board. The first magnetic sheet has a first surface and a second surface opposite to the first surface. The coil is located on the first surface. The board has a third surface facing the second surface and has a first component on the third surface. The first magnetic sheet has a through hole that penetrates therethrough from the first surface to the second surface in a region of the first surface, the region being surrounded by the coil. The first component has a first portion facing the through hole.

Abstract translation: 公开了一种电子设备。 电子设备包括第一磁性片，线圈和板。 第一磁性片具有与第一表面相对的第一表面和第二表面。 线圈位于第一表面。 板具有面向第二表面的第三表面，并且在第三表面上具有第一部件。 第一磁性片具有在第一表面的区域中从第一表面穿过其穿过第二表面的通孔，该区域被线圈包围。 第一部件具有面向通孔的第一部分。

公开(公告)号：US20170006697A1

公开(公告)日：2017-01-05

申请号：US15195510

申请日：2016-06-28

Applicant: KYOCERA Document Solutions Inc.

Inventor： Shogo YONEDA

IPC: H05K1/02 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K7/20154 ,  H05K1/0209 ,  H05K1/0216 ,  H05K7/20145 ,  H05K9/0022 ,  H05K2201/066 ,  H05K2201/10371

Abstract: A heatsink to be mounted on a circuit board including a plurality of electronic parts is constituted of a conductive and rectangular plate-shaped member, and mounted on the circuit board such that a main surface of the heatsink blocks an airflow generated on the circuit board, the heatsink being electrically grounded. The main surface includes a contacting portion disposed in contact with the circuit board and an isolated portion separated from the circuit board, the isolated portion being cut into two parts along a straight line extending in a direction away from the circuit board. The two parts are each bent such that an end portion on a side of the straight line is oriented to a downstream side of the airflow, so that an opening is defined between the respective end portions of the two parts on the side of the straight line.

Abstract translation: 安装在包括多个电子部件的电路板上的散热片由导电和矩形板状部件构成，并且安装在电路板上，使得散热片的主表面阻挡在电路板上产生的气流， 散热片电接地。 主表面包括与电路板接触设置的接触部分和与电路板分离的隔离部分，隔离部分沿着沿远离电路板的方向延伸的直线被切割成两部分。 这两个部分各自弯曲成使得直线侧的端部被定向到气流的下游侧，使得在直线侧的两个部分的相应端部之间限定开口 。

公开(公告)号：US09521741B1

公开(公告)日：2016-12-13

申请号：US14295855

申请日：2014-06-04

Applicant: Amazon Technologies, Inc.

Inventor： Libo Wang ,  Jasmin B. Farshi ,  Andrew Frederick Skipor

IPC: H05K7/18 ,  H05K9/00 ,  H05K1/02

CPC classification number: H05K1/0216 ,  H05K1/117 ,  H05K9/0015 ,  H05K9/0016 ,  H05K9/0024 ,  H05K9/0033 ,  H05K9/0052 ,  H05K9/0075 ,  H05K9/0081 ,  H05K2201/10371

Abstract: A circuit board assembly includes a first shield positioned over a top surface of a printed circuit board and a second shield positioned over a bottom surface. The first and second shields include conductive tabs which are coupled to a first side surface of the circuit board, wherein the tabs of the first shield are generally interposed or staggered with the tabs of the second shield.

Abstract translation: 电路板组件包括位于印刷电路板的顶表面上的第一屏蔽和位于底表面上的第二屏蔽。 第一和第二屏蔽包括耦合到电路板的第一侧表面的导电突出部，其中第一屏蔽的突出部通常与第二屏蔽的突出部插入或交错。

公开(公告)号：US20160309577A1

公开(公告)日：2016-10-20

申请号：US14704115

申请日：2015-05-05

Applicant: Laird Technologies, Inc.

Inventor： John Song ,  George William Rhyne

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H05K1/0296 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K9/0024 ,  H05K2201/0183 ,  H05K2201/0715 ,  H05K2201/0999 ,  H05K2201/10371

Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.

Abstract translation: 在示例性实施例中，电路组件可以设置在诸如板级屏蔽，中板，支架，精密金属部件等的导电结构上和/或由其支撑。例如，可以提供电路组件 在板级屏蔽的外顶表面上和/或支撑。 在示例性实施例中，组件通常包括被配置用于电子设备中的第一功能的导电结构。 导电层至少部分在导电结构上。 第一电气部件至少部分地在非导电层上并且被配置为限定用于与电子设备的一个或多个第二电气部件电连接的电路组件的至少一部分。 因此，导电结构可以被配置用于电子设备中的第二功能。

公开(公告)号：US20160301442A1

公开(公告)日：2016-10-13

申请号：US15090772

申请日：2016-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongryul SOHN ,  Cheolwoong PARK ,  Hosoo SEO

IPC: H04B1/3888 ,  H05K9/00 ,  H05K1/18 ,  H05K7/20

CPC classification number: H04B1/3888 ,  H04M1/19 ,  H05K1/0216 ,  H05K7/20445 ,  H05K9/0032 ,  H05K2201/10371

Abstract: An electronic device may include a noise shielding device that may include: a substrate including at least one heat generating component; a metallic shield cover that is disposed on the substrate to enclose the at least one heat generating component; a metal housing disposed around the shield cover; and a heat transfer member that is configured to transfer heat emitted from the heat generating component through an opening formed at a position corresponding to the heat generating component to the metal housing, wherein the metallic shield cover includes a plurality of tension fingers that protrude at predetermined intervals and contact a bottom face of the metal housing, and noise emitted from the heat generating component is shielded by a shielding region that is formed by the tension fingers and the metal housing.

Abstract translation: 电子设备可以包括噪声屏蔽装置，其可以包括：包括至少一个发热部件的基板; 金属屏蔽罩，其设置在所述基板上以封闭所述至少一个发热部件; 设置在所述屏蔽罩周围的金属壳体; 以及传热构件，其被构造成将从所述发热部件发出的热量通过形成在与所述发热部件相对应的位置的开口传递到所述金属壳体，其中所述金属屏蔽罩包括多个张紧指状物， 间隔并接触金属壳体的底面，并且由发热部件发出的噪声被由张紧指和金属壳体形成的屏蔽区域屏蔽。

公开(公告)号：US09460376B2

公开(公告)日：2016-10-04

申请号：US12688072

申请日：2010-01-15

Applicant: Noboru Kato ,  Satoshi Ishino ,  Takeshi Kataya ,  Ikuhei Kimura ,  Nobuo Ikemoto ,  Yuya Dokai

Inventor： Noboru Kato ,  Satoshi Ishino ,  Takeshi Kataya ,  Ikuhei Kimura ,  Nobuo Ikemoto ,  Yuya Dokai

IPC: H01Q1/22 ,  H01Q1/24 ,  G06K19/06 ,  G06K19/077 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q1/44 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q13/10 ,  H05K1/14 ,  H05K1/02 ,  H05K1/16

CPC classification number: G06K19/07749 ,  G06K19/06187 ,  G06K19/0723 ,  G06K19/07756 ,  G06K19/07773 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  G06K19/07786 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q1/44 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q13/10 ,  H05K1/0216 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/16 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10371 ,  H05K2201/10522 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.

Abstract translation: 无线IC器件包括：电磁耦合模块，包括布置成处理发送和接收信号的无线IC芯片和包括电感元件的馈电电路板。 馈电电路板包括电磁耦合到馈电电路的外部电极，并且外部电极电连接到屏蔽壳体或布线电缆。 屏蔽壳或接线电缆用作辐射板。 无线IC芯片由屏蔽壳或布线接收到的信号进行操作，来自无线IC芯片的应答信号从屏蔽壳或布线电缆向外部辐射。 金属部件用作辐射板，并且金属部件可以是布置在印刷线路板上的接地电极。

公开(公告)号：US20160242331A1

公开(公告)日：2016-08-18

申请号：US15045841

申请日：2016-02-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Sik PARK ,  Seung-Ki CHOI ,  Joon HEO ,  Hyun-Ju HONG

IPC: H05K9/00 ,  H05K5/00

CPC classification number: H05K9/002 ,  H01L2224/16225 ,  H05K1/0218 ,  H05K1/0259 ,  H05K5/0004 ,  H05K5/0017 ,  H05K9/0024 ,  H05K9/0039 ,  H05K2201/0919 ,  H05K2201/09354 ,  H05K2201/10371

Abstract: An electronic device is provided that includes a PCB including a first surface, a second surface, and a side surface; an electronic component arranged on the first surface, adjacent to a portion of the side surface; a shield structure including a cap that covers the electronic component and a sidewall extending from a periphery of the cap toward the first surface of the PCB, wherein the sidewall extends in a first direction that is non-parallel to the first surface of the PCB; a first conductive structure that is formed on a portion of the side surface of the PCB; and a second conductive structure that is formed on a portion of the first surface to be connected to the first conductive structure. The sidewall contacts with the first surface of the PCB and overlaps with the second conductive structure, when viewed from above the first surface of the PCB.

Abstract translation: 提供一种电子设备，其包括：PCB，其包括第一表面，第二表面和侧表面; 布置在所述第一表面上的与所述侧表面的一部分相邻的电子部件; 屏蔽结构，其包括覆盖电子部件的盖和从盖的周边延伸到PCB的第一表面的侧壁，其中侧壁沿不平行于PCB的第一表面的第一方向延伸; 第一导电结构，其形成在所述PCB的侧表面的一部分上; 以及形成在所述第一表面的要连接到所述第一导电结构的部分上的第二导电结构。 当从PCB的第一表面上方观察时，侧壁与PCB的第一表面接触并与第二导电结构重叠。