公开(公告)号：US06228685B1

公开(公告)日：2001-05-08

申请号：US09174074

申请日：1998-10-16

Applicant: Masud Beroz ,  Thomas H. DiStefano ,  John W. Smith

Inventor： Masud Beroz ,  Thomas H. DiStefano ,  John W. Smith

IPC: H01L4400

CPC classification number: H01L23/544 ,  H01L21/4839 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/50 ,  H01L24/72 ,  H01L24/86 ,  H01L2221/68327 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063

Abstract: A microelectronic component is fabricated by bonding a flexible sheet in tension on a rigid frame so that the sheet spans an aperture in the frame, and performing one or more operations on features on the flexible sheet which will be incorporated into the finished component. The fame maintains dimensional stability of the sheet and aids in regsitration of the sheet with external elements such as processing tools or other parts which are to be assembled with the sheet. Desirably, the frame has a coefficient of thermal expansion different from that of the sheet so that when the sheet is brought from the bonding temperature to the temperature used in processing, differential thermal expansion or contraction will cause increased tension in the sheet.

Abstract translation: 通过将刚性框架上的张力柔性片粘合在刚性框架上来制造微电子部件，使得片材跨越框架中的孔，并对将被并入成品部件的柔性片材上的特征进行一个或多个操作。 名气维持片材的尺寸稳定性，并有助于片材的外部元件如加工工具或与片材组装的其他部件的注册。 理想地，框架具有与片材不同的热膨胀系数，使得当片材从接合温度提高到加工中使用的温度时，差分热膨胀或收缩将导致片材的张力增加。

公开(公告)号：US5830782A

公开(公告)日：1998-11-03

申请号：US678808

申请日：1996-07-12

Applicant: John W. Smith ,  Thomas H. Distefano

Inventor： John W. Smith ,  Thomas H. Distefano

IPC: H01L21/20 ,  H01L21/60 ,  H01L23/12 ,  H01L23/36 ,  H01L23/48

CPC classification number: H01L21/4839 ,  H01L21/561 ,  H01L21/6836 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/544 ,  H01L23/642 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H05K3/4084 ,  H01L2221/68327 ,  H01L2223/54426 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/13016 ,  H01L2224/13018 ,  H01L2224/13026 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13611 ,  H01L2224/13617 ,  H01L2224/13638 ,  H01L2224/13644 ,  H01L2224/1412 ,  H01L2224/16057 ,  H01L2224/16225 ,  H01L2224/17104 ,  H01L2224/29191 ,  H01L2224/45124 ,  H01L2224/48744 ,  H01L2224/73204 ,  H01L2224/7525 ,  H01L2224/753 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/75822 ,  H01L2224/75824 ,  H01L2224/81007 ,  H01L2224/81091 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81207 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81457 ,  H01L2224/81464 ,  H01L2224/81469 ,  H01L2224/81825 ,  H01L2224/8183 ,  H01L2224/819 ,  H01L2224/83005 ,  H01L2224/83104 ,  H01L2224/8385 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L24/05 ,  H01L24/29 ,  H01L24/75 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01066 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361

Abstract: A method of making a microelectronic assembly includes bonding a plurality of lead connection sections arranged in a row to contacts of a microelectronic element such as a semiconductor chip having contacts in rows at the periphery of the chip. The leads have terminal sections secured to a dielectric support structure, and horizontally curved sections between the terminal regions and bond regions. After bonding, the dielectric support structure is lifted upwardly relative to the chip, so as to bend the leads into a vertically-extensive orientation. Partial straightening of the original horizontal curvature allows each lead to stretch and accommodate the vertical movement.

Abstract translation: 制造微电子组件的方法包括将布置成行的多个引线连接部分接合到微电子元件的触点，例如在芯片周边具有行的触点的半导体芯片。 引线具有固定到电介质支撑结构的端子部分，以及端子区域和接合区域之间的水平弯曲部分。 在接合之后，电介质支撑结构相对于芯片向上提升，以便将引线弯曲成垂直方向。 原始水平曲率的部分矫直允许每个导线拉伸并适应垂直运动。

公开(公告)号：US5659952A

公开(公告)日：1997-08-26

申请号：US365699

申请日：1994-12-29

Applicant: Zlata Kovac ,  Craig Mitchell ,  Thomas H. Distefano ,  John W. Smith

Inventor： Zlata Kovac ,  Craig Mitchell ,  Thomas H. Distefano ,  John W. Smith

IPC: H01L23/12 ,  H01L21/56 ,  H01L21/60 ,  H01L23/28 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174

Abstract: A method and an apparatus for providing a planar and compliant interface between a semiconductor chip and its supporting substrate to accommodate for the thermal coefficient of expansion mismatch therebetween. The compliant interface is comprised of a plurality of compliant pads defining channels between adjacent pads. The pads are typically compressed between a flexible film chip carrier and the chip. A compliant filler is further disposed within the channels to form a uniform encapsulation layer having a controlled thickness.

Abstract translation: 一种用于在半导体芯片和其支撑衬底之间提供平面和兼容接口以适应其间的热膨胀失配的方法和装置。 兼容接口包括限定相邻焊盘之间的通道的多个柔性焊盘。 垫通常在柔性膜芯片载体和芯片之间被压缩。 在通道内进一步布置柔顺填料以形成具有受控厚度的均匀包封层。

公开(公告)号：US5654528A

公开(公告)日：1997-08-05

申请号：US560932

申请日：1995-11-20

Applicant: Kazuhisa Tanaka

Inventor： Kazuhisa Tanaka

IPC: H05K1/11 ,  G01R31/28 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/28

CPC classification number: H05K3/0008 ,  G01R31/2805 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/0393 ,  H05K1/11 ,  H05K1/118 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/096 ,  H05K2203/167 ,  H05K3/0064 ,  H05K3/281

Abstract: A cover layer of a flexible printed circuit includes a first hole and a plurality of openings. The first hole has substantially the same diameter as that of a positioning piece of an inspection machine. A distance between the first hole and each of the openings is predetermined. After the cover layer is adhered to the base member, a second hole is formed on the base member inside the first hole. A diameter of the second hole is smaller than that of the first hole. At the time of a continuity test, the second hole is deformed by a insertion of the portioning piece, so that the positioning piece is inserted into the first hole. As a result, the flexible printed circuit is positioned on the basis of the first hole.

Abstract translation: 柔性印刷电路的覆盖层包括第一孔和多个开口。 第一孔具有与检查机的定位件的直径基本相同的直径。 第一孔和每个开口之间的距离是预定的。 在覆盖层粘附到基底构件之后，在第一孔内部的基底构件上形成第二孔。 第二孔的直径小于第一孔的直径。 在连续性试验时，通过分割片的插入使第二孔变形，使定位片插入第一孔。 结果，柔性印刷电路位于第一孔的基础上。

公开(公告)号：US5608434A

公开(公告)日：1997-03-04

申请号：US321947

申请日：1994-10-12

Applicant: Arthur K. Wilson ,  Patricia S. Brown ,  Jason R. Arbeiter

Inventor： Arthur K. Wilson ,  Patricia S. Brown ,  Jason R. Arbeiter

IPC: H01R4/48 ,  B41J2/175 ,  H01R11/01 ,  H01R12/62 ,  H01R43/00 ,  H05K1/00 ,  H05K1/14 ,  H05K3/36 ,  H05K3/40 ,  B41J2/14 ,  H01R9/09

CPC classification number: B41J2/17526 ,  B41J2/1752 ,  H01R12/62 ,  H05K3/365 ,  H05K1/0393 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/091 ,  H05K2203/167 ,  H05K3/4007

Abstract: An improved electrical interconnect system for a flexible circuit which includes: a flexible first layer; at least one protrusion on the flexible first layer that has an electrical contact; a second layer having at least one electrical contact; and a spring apparatus coupled to the flexible first layer and to the second layer for pressing the electrical contact on a protrusion on the flexible first layer to the electrical contact on the second layer to electrically connect the electrical contact on the protrusion to the electrical contact on the second layer. In a specific embodiment the spring apparatus for pressing the electrical contact on the protrusion of the flexible first layer to the electrical contact on the second layer includes relief for allowing the flexible first layer to deform during assembly of the improved electrical interconnect system for a flexible circuit. In an alternate specific embodiment the electrical contacts on the protrusions on the flexible first layer and the corresponding electrical contacts on the second layer are coated with gold. In another alternate specific embodiment the improved electrical interconnect system includes an alignment apparatus coupled to the flexible first layer and the second layer and the spring apparatus for aligning the flexible first layer with the second layer and the spring apparatus. The improved electrical interconnect system for a flexible circuit provides higher interconnect density, reduced cost and increased reliability compared to conventional interconnect systems.

Abstract translation: 一种用于柔性电路的改进的电互连系统，包括：柔性第一层; 柔性第一层上的至少一个具有电接触的突起; 具有至少一个电接触的第二层; 以及弹簧装置，其耦合到柔性第一层和第二层，用于将柔性第一层上的突起上的电接触压到第二层上的电触点上，以将突起上的电接触电连接到电接触上 第二层。 在具体实施例中，用于将柔性第一层的突起上的电接触压到第二层上的电触点的弹簧装置包括用于允许柔性第一层在用于柔性电路的改进的电互连系统的组装期间变形的浮雕 。 在替代的具体实施例中，柔性第一层上的突起上的电接触和第二层上的对应的电触点涂覆有金。 在另一个可选的具体实施例中，改进的电互连系统包括耦合到柔性第一层和第二层的对准装置和用于使柔性第一层与第二层和弹簧装置对准的弹簧装置。 与常规互连系统相比，用于柔性电路的改进的电互连系统提供更高的互连密度，降低的成本和增加的可靠性。

公开(公告)号：US5533904A

公开(公告)日：1996-07-09

申请号：US234810

申请日：1994-04-28

Applicant: Gary M. Nobel ,  Arthur K. Wilson ,  Patricia S. Brown ,  Jason R. Arbeiter

Inventor： Gary M. Nobel ,  Arthur K. Wilson ,  Patricia S. Brown ,  Jason R. Arbeiter

IPC: H01R4/48 ,  B41J2/175 ,  H01R11/01 ,  H01R12/62 ,  H01R43/00 ,  H05K1/00 ,  H05K1/14 ,  H05K3/36 ,  H05K3/40 ,  H01R9/09

CPC classification number: B41J2/17526 ,  B41J2/1752 ,  H01R12/62 ,  H05K3/365 ,  H05K1/0393 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/091 ,  H05K2203/167 ,  H05K3/4007

Abstract: An improved interconnect system for an inkjet printer. The inventive interconnect system includes first and second unitary flexible circuits having first and second sets of contacts, respectively, for providing first and second electrical interconnections, respectively. The first and second flexible circuits are aligned and retained so that contacts thereon engage corresponding contacts disposed on a rigid support. In a specific implementation, the first flexible circuit is aligned by a first set of pins arranged along a first axis and the flexible circuit is aligned by a second set of pins arranged along a second axis, perpendicular to the first axis. This arrangement allows for the alignment and mounting of two flexible circuits on a single printer carriage without a substantial increase in the width thereof. The first flexible circuit may be used to connect the inkjet pens to the electronic drive circuit and the second flexible circuit may be used to connect a paper sensor or other device to the electronic circuit.

Abstract translation: 一种用于喷墨打印机的改进的互连系统。 本发明的互连系统包括分别具有第一和第二组触点的第一和第二单一柔性电路，用于分别提供第一和第二电互连。 第一和第二柔性电路对准和保持，使得其上的触点接合设置在刚性支撑件上的对应触点。 在具体实现中，第一柔性电路通过沿着第一轴布置的第一组引脚对准，并且柔性电路由垂直于第一轴线的第二轴线布置的第二组引脚对准。 这种布置允许在单个打印机托架上对准和安装两个柔性电路，而不会使其宽度基本上增加。 第一柔性电路可以用于将喷墨笔连接到电子驱动电路，并且第二柔性电路可以用于将纸传感器或其他装置连接到电子电路。

公开(公告)号：US5456616A

公开(公告)日：1995-10-10

申请号：US192086

申请日：1994-02-04

Applicant: Robert M. Fuerst ,  Paul Krebaum ,  Fred L. Krehbiel

Inventor： Robert M. Fuerst ,  Paul Krebaum ,  Fred L. Krehbiel

IPC: C09J9/02 ,  C09J11/04 ,  H01R4/04 ,  H01R13/658 ,  H01R13/7195 ,  H05K1/09 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40 ,  H01R13/66

CPC classification number: H01R13/65802 ,  H01R4/04 ,  H05K3/321 ,  H05K3/326 ,  H01R13/7195 ,  H05K1/0215 ,  H05K1/09 ,  H05K1/118 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/091 ,  H05K2201/1003 ,  H05K2201/1059 ,  H05K2203/0425 ,  H05K3/306 ,  H05K3/4007

Abstract: An electrical connector assembly includes a housing fabricated of a first metal material and having at least one integral pin projecting from a face thereof. A flat flexible circuit is mounted against the face of the housing and includes a ground plane on a side thereof facing the housing. The circuit has a hole for receiving the integral pin of the housing. The ground plane is of a second metal material different from that of the housing. An omni-directional conductive adhesive is deposited on the ground plane over the area of the hole to expand the conductive interface between the metal housing and the metal ground plane. Preferably, the conductive adhesive includes abrasive grain-like particles.

Abstract translation: 电连接器组件包括由第一金属材料制成并具有从其表面突出的至少一个整体销的壳体。 平面柔性电路安装在壳体的表面上，并且在其面向壳体的一侧上包括接地平面。 电路具有用于接收壳体的整体销的孔。 地平面是与壳体不同的第二金属材料。 在孔的区域上的接地平面上沉积全向导电粘合剂，以扩展金属壳体和金属接地平面之间的导电界面。 优选地，导电粘合剂包括磨粒状颗粒。

公开(公告)号：US5434749A

公开(公告)日：1995-07-18

申请号：US208113

申请日：1994-03-09

Applicant: Yoshiaki Nakayama

Inventor： Yoshiaki Nakayama

IPC: H05K1/11 ,  H01R43/02 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/00 ,  H05K3/20 ,  H05K3/32 ,  H05K3/40 ,  H05K7/02 ,  H05K7/06 ,  H01R9/00

CPC classification number: H01R12/62 ,  H01R12/523 ,  H05K1/0263 ,  H05K3/202 ,  H05K1/0393 ,  H05K1/144 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/096 ,  H05K2201/10272 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/2072 ,  H05K2203/167 ,  H05K3/0064 ,  H05K3/326 ,  H05K3/4084 ,  H05K3/4092 ,  Y10S439/949

Abstract: This invention concerns a hybrid printed circuit board which permits easy and reliable connection between small-current circuit conductors and large-current circuit conductors. The hybrid printed circuit board of this invention comprises: an insulating substrate of synthetic resin having fixing bosses erected thereon; a flexible printed circuit sheet having small-current circuit conductors; and busbars as large-current circuit conductors; wherein the flexible printed circuit sheet is stacked and arranged on the insulating substrate so that the fixing bosses erected on the insulating substrate pass through and above the flexible printed circuit sheet, the busbars as large-current circuit conductors are put in contact with the small-current circuit conductors, and the fixing bosses are heated and deformed to fix the busbars in place.

Abstract translation: 本发明涉及一种混合印刷电路板，其允许小电流电路导体和大电流电路导体之间的容易且可靠的连接。 本发明的混合印刷电路板包括：合成树脂的绝缘基板，其上竖立有固定凸台; 具有小电流电路导体的柔性印刷电路板; 和母线作为大电流电路导体; 其中柔性印刷电路板堆叠并布置在绝缘基板上，使得竖立在绝缘基板上的固定凸台通过柔性印刷电路板上方并且在柔性印刷电路板上方，作为大电流电路导体的汇流条与小电流导体接触， 电流电路导体和固定凸台被加热和变形以将母线固定到位。

公开(公告)号：US5401688A

公开(公告)日：1995-03-28

申请号：US118786

申请日：1993-09-09

Applicant: Yasuhiro Yamaji ,  Yoichi Hiruta ,  Tsutomu Nakazawa ,  Katsuto Katoh ,  Yoshihiro Atsumi ,  Naohiko Hirano ,  Akihiro Mase

Inventor： Yasuhiro Yamaji ,  Yoichi Hiruta ,  Tsutomu Nakazawa ,  Katsuto Katoh ,  Yoshihiro Atsumi ,  Naohiko Hirano ,  Akihiro Mase

IPC: H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/522 ,  H01L23/538 ,  H01L25/065 ,  H05K1/18

CPC classification number: H01L24/18 ,  H01L23/3164 ,  H01L23/5387 ,  H01L24/82 ,  H01L25/0655 ,  H05K1/186 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K2201/091 ,  H05K2201/10674 ,  H05K3/4614 ,  H05K3/4632 ,  Y10T156/1002 ,  Y10T29/4913

Abstract: A semiconductor chip is packaged within film carriers which serve as the enclosure of the semiconductor chip. The finished semiconductor device is flexible, bendable, and very thin. In manufacturing this semiconductor device, the process of laminating film carriers, the process of electrically connecting the semiconductor chip and film carriers, and the process of sealing the semiconductor chip, can be performed at the same time, shortening the manufacturing time and reducing manufacturing cost.

Abstract translation: 将半导体芯片封装在用作半导体芯片外壳的薄膜载体内。 成品半导体器件灵活，可弯曲，非常薄。 在制造该半导体器件时，可以同时进行层压薄膜载体的工艺，电连接半导体芯片和薄膜载体的工艺以及密封半导体芯片的工艺，缩短制造时间并降低制造成本 。

公开(公告)号：US5397239A

公开(公告)日：1995-03-14

申请号：US168944

申请日：1993-12-17

Applicant: Victor Zaderej ,  Michael P. Coletta ,  Howard Kell ,  Daniel F. Sheldon

Inventor： Victor Zaderej ,  Michael P. Coletta ,  Howard Kell ,  Daniel F. Sheldon

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32

CPC classification number: H05K1/028 ,  H05K1/0278 ,  H05K1/119 ,  H05K3/326 ,  H05K1/0284 ,  H05K1/118 ,  H05K1/184 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09118 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K3/4691 ,  Y10S439/931

Abstract: A molded circuit board has an aperture wherein a contact member is flexibly carried by a living hinge. Conductor traces are plated upon the contact member, the living hinge, and the circuit board. The conductor traces form contacts on the contact member which are electrically connected to the conductor traces on the circuit board. A mating connector, having resilient contacts, is inserted into the aperture, folding back the contact member. The resilient contacts engage the contacts on the contact member. Another embodiment includes dual contact members hinged on opposing sides of an aperture. A further embodiment has a contact member which is folded up and inserted into a mating connector. In the above embodiments the contact members are molded with thin breakable portions of material holding the contact members in planes of the circuit boards. The present invention is formed from a polymeric material including one of polypropylene, polyethylene, and nylon. The polymeric material includes fillers including at least one of calcium carbonate, glass, and talc for heat stability. The polymeric material is pretreated in an organic solvent, such as turpentine, before etching during the plating process.

Abstract translation: 模制电路板具有孔，其中接触构件由活动铰链灵活地承载。 导体迹线电镀在接触构件，活动铰链和电路板上。 导体迹线在接触构件上形成电连接到电路板上的导体迹线的触点。 具有弹性触点的配合连接器插入孔中，使接触构件折回。 弹性触点接合接触构件上的触点。 另一实施例包括铰接在孔的相对侧上的双接触构件。 另一实施例具有折叠并插入到配合连接器中的接触构件。 在上述实施例中，接触构件被模制成具有在电路板的平面中保持接触构件的材料的薄的可断裂部分。 本发明由包括聚丙烯，聚乙烯和尼龙之一的聚合材料形成。 聚合物材料包括填充剂，其包括碳酸钙，玻璃和滑石中的至少一种以获得热稳定性。 聚合物材料在电镀过程中蚀刻之前，在有机溶剂如松节油中进行预处理。