公开(公告)号：US07768796B2

公开(公告)日：2010-08-03

申请号：US12147218

申请日：2008-06-26

Applicant: James W. Cady ,  Paul Goodwin

Inventor： James W. Cady ,  Paul Goodwin

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/189 ,  G11C5/04 ,  H01L23/5387 ,  H01L25/0652 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.

Abstract translation: 柔性电路用多个集成电路管芯填充在一侧或两侧。 在优选的模式中，柔性电路装有倒装芯片。 柔性电路的一侧具有在具有边缘连接器触点的优选模式中实现的连接设备。 柔性电路围绕基板设置以形成电路模块，该电路模块可以插入诸如通常在计算机板上找到的边缘连接器。

公开(公告)号：US07762819B2

公开(公告)日：2010-07-27

申请号：US11918121

申请日：2006-07-06

Applicant: Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

Inventor： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

IPC: H01R12/00

CPC classification number: H05K3/368 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2201/2018

Abstract: A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

Abstract translation: 衬底连接构件连接两个连接在一起的电路板，同时保持其自身和电路板之间的接合部的高可靠性，即使电路板由于冲击负载的温度变化而翘曲。 基板连接构件包括由绝缘树脂制成的框架构件; 狭缝槽形成在构成框架构件的框架侧部的至少一个内表面和外表面中，狭缝槽沿与框架侧部的厚度方向垂直的方向在框架侧部分的整个长度上形成; 以及连接导体部分，其具有分别设置在厚度方向上的框架侧部分的顶表面和底表面上的连接端子和连接连接端子的连接导体。

公开(公告)号：US20100184309A1

公开(公告)日：2010-07-22

申请号：US12597130

申请日：2008-04-28

Applicant: Tan Duc Huynh

Inventor： Tan Duc Huynh

IPC: H01R13/24 ,  G01R27/02

CPC classification number: H01R13/641 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2428 ,  H01R2201/20 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/10128 ,  H05K2201/2018

Abstract: An electronic device includes least two electronic components linked electrically to one another using a flexible connector. The flexible connector includes multiple conducting blades, and is interposed between the two electrical components such that longitudinal edges of the flexible connector are held in contact against respective connection pads of each of the electronic components. The flexible connector is ultimately compressed, respectively, against both electronic components. The electronic device is equipped with two additional conducting blades for checking the state of compression of the flexible connector. The two additional conducting blades include an electrical circuit for determining the state of compression of the flexible connector by a resistive measurement and integrating at least one additional conducting blade of the flexible connector.

Abstract translation: 电子设备包括使用柔性连接器彼此电连接的至少两个电子部件。 柔性连接器包括多个导电叶片，并且插入在两个电气部件之间，使得柔性连接器的纵向边缘保持与每个电子部件的相应连接焊盘接触。 柔性连接器最终分别压缩到两个电子部件上。 电子设备配有两个附加的导电叶片，用于检查柔性连接器的压缩状态。 两个额外的导电叶片包括用于通过电阻测量来确定柔性连接器的压缩状态并集成柔性连接器的至少一个附加导电叶片的电路。

公开(公告)号：US20100110642A1

公开(公告)日：2010-05-06

申请号：US12606136

申请日：2009-10-26

Applicant: Robert S. Pauley ,  Jayesh R. Bhakta ,  William M. Gervasi ,  Chi She Chen ,  Jose Delvalle

Inventor： Robert S. Pauley ,  Jayesh R. Bhakta ,  William M. Gervasi ,  Chi She Chen ,  Jose Delvalle

IPC: H05K7/20 ,  F28F13/00 ,  H01L23/34

CPC classification number: H05K1/0203 ,  H05K1/144 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/2018 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913

Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the first surface. The first plurality of circuits is in electrical communication with the electrical contacts. The module further includes a second surface and a second plurality of circuits coupled to the second surface. The second plurality of circuits is in electrical communication with the electrical contacts. The second surface faces the first surface. The module further includes at least one thermally conductive layer positioned between the first surface and the second surface. The at least one thermally conductive layer is in thermal communication with the first plurality of circuits, the second plurality of circuits, and a first set of the plurality of electrical contacts.

Abstract translation: 模块可电连接到计算机系统。 模块包括可电连接到计算机系统的多个电触点。 模块还包括耦合到第一表面的第一表面和第一多个电路。 第一组多个电路与电触点电连通。 模块还包括耦合到第二表面的第二表面和第二多个电路。 第二组电路与电触点电连通。 第二表面面向第一表面。 模块还包括位于第一表面和第二表面之间的至少一个导热层。 所述至少一个导热层与所述第一多个电路，所述第二多个电路和所述多个电触头的第一组热连通。

公开(公告)号：US20100084738A1

公开(公告)日：2010-04-08

申请号：US12530388

申请日：2008-03-04

Applicant: Koichiro Masuda

Inventor： Koichiro Masuda

IPC: H01L27/04 ,  H01G4/005 ,  H01G4/008 ,  H05K1/16

CPC classification number: H01G4/33 ,  H01G4/01 ,  H01G4/35 ,  H01G9/04 ,  H01G9/15 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0231 ,  H05K1/186 ,  H05K2201/10689 ,  H05K2201/2018 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/01033

Abstract: A capacitive element that can efficiently reduce high-frequency noise generated in a circuit is provided. A capacitive element 1 includes a capacitive formation portion 100, which is formed in the shape of a loop to separate the inside from the outside. The capacitive formation portion 100 includes an electrode 110, an opposite electrode 111, and a dielectric layer 120. One or more outgoing terminals (one or more outer circumference outgoing terminals 140, and one or more internal circumference outgoing terminals 130) are provided at the outer and inner circumferences of the electrode 110, respectively. A printed wiring board is made by mounting the capacitive element inside the board or on the surface of the board. A semiconductor package is made by putting the capacitive element 1 on a target semiconductor circuit portion. Moreover, a semiconductor circuit is made by placing the capacitive element on a target functional circuit portion 301.

Abstract translation: 提供了可有效降低电路中产生的高频噪声的电容元件。 电容元件1包括电容形成部分100，该电容形成部分100形成为将内部与外部分开的环形。 电容形成部分100包括电极110，相对电极111和电介质层120.一个或多个输出端子（一个或多个外圆周出射端子140和一个或多个内圆周输出端子130）设置在 电极110的外周和内周。 通过将电容元件安装在板内或板的表面上来制造印刷线路板。 通过将电容元件1放置在目标半导体电路部分上来制造半导体封装。 此外，通过将电容元件放置在目标功能电路部分301上来制造半导体电路。

公开(公告)号：US20100061065A1

公开(公告)日：2010-03-11

申请号：US12413261

申请日：2009-03-27

Applicant: Shinya HAYASHIYAMA

Inventor： Shinya HAYASHIYAMA

IPC: H05K5/00

CPC classification number: G06F1/1616 ,  G06F1/1658 ,  H05K1/0271 ,  H05K1/181 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2201/2018

Abstract: According to one embodiment, an electronic device includes a housing, a circuit board in the housing, a plurality of surface-mountable electronic components, and a reinforcing frame. The circuit board has a first surface and a second surface on a reverse side of the first surface. The surface-mountable electronic components, each having a surface on which bumps are arranged, are mounted on the first surface via the bumps. The reinforcing frame is arranged on the second surface such that it passes through portions corresponding to positions of bumps located at at least four corners of the bumps arranged on the surface of each of the surface-mountable electronic components mounted on the first surface.

Abstract translation: 根据一个实施例，电子设备包括壳体，壳体中的电路板，多个可表面安装的电子部件和加强框架。 电路板具有在第一表面的相反侧上的第一表面和第二表面。 每个具有布置凸块的表面的可表面安装的电子部件通过凸块安装在第一表面上。 加强框架布置在第二表面上，使得其穿过对应于位于安装在安装在第一表面上的每个可表面安装的电子部件的表面上的凸起的至少四个角的凸起位置的部分。

公开(公告)号：US07656650B2

公开(公告)日：2010-02-02

申请号：US11207884

申请日：2005-08-22

Applicant: Yeung-Ki Kim

Inventor： Yeung-Ki Kim

IPC: G06F1/16

CPC classification number: H05K7/1422 ,  H05K1/142 ,  H05K3/0058 ,  H05K2201/2018

Abstract: In a modular printed board assembly, a plasma display apparatus including the modular printed board assembly, and a method of fabricating the modular printed board assembly, the modular printed board includes: a frame of plate shape fixed on a chassis base; and a plurality of printed board assemblies, on which a plurality of electronic elements are mounted, installed on the frame.

Abstract translation: 在模块化印刷电路板组件中，包括模块化印刷电路板组件的等离子体显示装置和制造模块化印刷电路板组件的方法，所述模块化印刷电路板包括：固定在底架上的板状框架; 以及安装有多个电子元件的多个印刷电路板组件。

公开(公告)号：US20100014267A1

公开(公告)日：2010-01-21

申请号：US12374358

申请日：2007-07-18

Applicant: Akihito Kubota

Inventor： Akihito Kubota

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/141 ,  H05K1/0218 ,  H05K1/148 ,  H05K9/0049 ,  H05K2201/10371 ,  H05K2201/2018 ,  Y10T29/49126

Abstract: Provided is a circuit board device, wherein degrees of freedom are provided for a GND connecting position among plural printed boards, and noise shield and/or heat sink effects are provided. An electronic device provided with the circuit board device and a GND connecting method are also provided. Circuit board device (100) includes a pair of printed boards (110, 120), noise generating component (112) and/or heat generating component (122), and metal plate (140). Printed boards (110, 120) include mounting surfaces and GND connecting terminals (111, 121) arranged on the respective mounting surfaces, and the mounting surfaces are arranged to face each other. Noise generating component (112) and/or heat generating component (122) is mounted on the mounting surface of at least one of a pair of printed boards (110, 120). Metal plate (140) is arranged between the mounting surfaces of the pair of printed boards (110, 120), and is located at a distance from at least one of noise generating component (112) and heat generating component (122) so as to overlap with the noise generating component and/or the heat generating component. Furthermore, metal plate (140) is in contact with each of GND connecting terminals (111, 121) so that GND connecting terminals (111, 121) are electrically connected to each other.

Abstract translation: 提供了一种电路板装置，其中为多个印刷电路板之间的GND连接位置提供了自由度，并且提供了噪声屏蔽和/或散热器效应。 还提供了具有电路板装置的电子装置和GND连接方法。 电路板装置（100）包括一对印刷电路板（110,120），噪声发生部件（112）和/或发热部件（122）和金属板（140）。 印刷电路板（110,120）包括布置在各个安装表面上的安装表面和GND连接端子（111,121），并且安装表面被布置成彼此面对。 噪声发生部件（112）和/或发热部件（122）安装在一对印刷电路板（110,120）中的至少一个的安装面上。 金属板（140）布置在一对印刷电路板（110,120）的安装表面之间，并且位于与噪声产生部件（112）和发热部件（122）中的至少一个的距离处，以便 与噪声产生部件和/或发热部件重叠。 此外，金属板（140）与每个GND连接端子（111,121）接触，使得GND连接端子（111,121）彼此电连接。

公开(公告)号：US20100002455A1

公开(公告)日：2010-01-07

申请号：US12085462

申请日：2006-11-22

Applicant: Yoichi Matsuoka ,  Naoya Yanase

Inventor： Yoichi Matsuoka ,  Naoya Yanase

IPC: F21V21/00 ,  H05K7/20 ,  H01B13/00

CPC classification number: H01L33/642 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K3/243 ,  H05K2201/0347 ,  H05K2201/09736 ,  H05K2201/10106 ,  H05K2201/2018 ,  H05K2203/0384 ,  H05K2203/0542 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In conventional electronic component mounting boards, a leg section of a metal frame manufactured of a metal block attached to a circuit board is firmly adhered to a board with a solder and the like, and heat due to light emission of a LED element is dissipated through the leg section of the metal frame, and heat dissipation performance is improved. In the conventional electronic component mounting boards, however, high heat conductance of the metal frame is not efficiently exhibited due to existence of an adhesive layer and the like having a lower heat conductance. In order to improve a certain limit existed in luminance and lifetime due to temperature increase of the LED element, a frame having heat conductance is attached on an upper plane of a circuit board whereupon a plurality of conductors are formed, and the frame and one of the conductors of the circuit board are heat-conductively connected. Thus, heat from the semiconductor element (LED element) is efficiently dissipated directly or indirectly to the external air, through the conductor heat-conductively connected with the frame.

Abstract translation: 在传统的电子部件安装板中，由附接到电路板的金属块制成的金属框架的腿部牢固地粘附到具有焊料等的板上，并且由于LED元件的发光引起的热量通过 金属框架的腿部，散热性能提高。 然而，在传统的电子元件安装板中，由于存在具有较低导热性的粘合剂层等，所以不能有效地发挥金属框架的高导热性。 为了提高由于LED元件的温度升高而存在的亮度和寿命的一定限度，具有导热性的框架被附着在电路板的上平面上，由此形成多个导体，并且框架和 电路板的导体被导热连接。 因此，通过与框架导热连接的导体，来自半导体元件（LED元件）的热量被直接或间接地有效地耗散到外部空气。

公开(公告)号：US20090321914A1

公开(公告)日：2009-12-31

申请号：US12164447

申请日：2008-06-30

Applicant: Stephen P. Ayotte ,  Jeffrey D. Gilbert ,  David J. Hill ,  Ronald L. Mendelson ,  Timothy M. Sullivan

Inventor： Stephen P. Ayotte ,  Jeffrey D. Gilbert ,  David J. Hill ,  Ronald L. Mendelson ,  Timothy M. Sullivan

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H05K3/303 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/10175 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/2018 ,  H05K2201/2036 ,  Y02P70/613

Abstract: Methods for making, and structures so made for producing integrated circuit (IC) chip packages without forming micro solder balls. In one embodiment, a method may include placing a solid grid made from an organic material between the IC chip and the substrate. The grid provides a physical barrier between each of a plurality of Controlled Collapse Chip Connections, and thereby prevents the formation of micro solder balls between them, thus improving chip performance and reliability.

Abstract translation: 制造方法和如此制造的结构，用于制造集成电路（IC）芯片封装而不形成微焊球。 在一个实施例中，一种方法可以包括将由有机材料制成的固体栅格放置在IC芯片和衬底之间。 栅格在多个受控崩溃芯片连接中的每一个之间提供物理屏障，从而防止在它们之间形成微焊球，从而提高芯片性能和可靠性。