公开(公告)号：US20130109317A1

公开(公告)日：2013-05-02

申请号：US13697210

申请日：2011-05-11

Applicant: Hidekazu Kikuchi ,  Takayuki Mogi ,  Yoshiyuki Akiyama ,  Hirofumi Kawamura

Inventor： Hidekazu Kikuchi ,  Takayuki Mogi ,  Yoshiyuki Akiyama ,  Hirofumi Kawamura

IPC: H04B7/24

CPC classification number: H01P5/02 ,  H01P1/208 ,  H01P3/12 ,  H01P3/121 ,  H01P3/165 ,  H01P5/024 ,  H01P5/082 ,  H01P5/087 ,  H01P5/1022 ,  H01P5/107 ,  H01P5/18 ,  H01P5/182 ,  H01P5/188 ,  H01R13/6461 ,  H01R13/665 ,  H01R24/28 ,  H01R24/76 ,  H01R2103/00 ,  H04B3/56 ,  H04B7/24 ,  H05K1/0225 ,  H05K1/0239 ,  H05K2201/093 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2201/09754

Abstract: A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.

Abstract translation: 一种信号传输系统，包括：第一连接器装置和与第一连接器装置耦合的第二连接器装置。 第一连接器装置和第二连接器装置耦合在一起以形成电磁场耦合单元，并且传输对象信号被转换成无线电信号，然后通过电磁场耦合单元在第一连接器装置和 第二连接器装置。

公开(公告)号：US20130057372A1

公开(公告)日：2013-03-07

申请号：US13604110

申请日：2012-09-05

Applicant: Philippe Klein

Inventor： Philippe Klein

IPC: H01F5/02

CPC classification number: H05K1/165 ,  G01R33/0052 ,  H01F27/2804 ,  H01F2027/2809 ,  H05K3/46 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/097

Abstract: This magnetic ring is formed by an upper U-shaped part and a lower U-shaped part, each upper and lower part comprising two vertical arms each introduced into a respective hole of the printed circuit board, each arm of the upper part being superimposed, within the respective hole and in a horizontal direction, on the corresponding arm of the lower part to set up magnetic continuity between these two parts of the magnetic ring.

Abstract translation: 该磁环由上部U形部分和下部U形部分形成，每个上部和下部部分包括两个垂直臂，每个引导到印刷电路板的相应孔中，上部的每个臂都叠加着， 在相应的孔中并且在水平方向上在下部的相应臂上，以在磁环的这两个部分之间建立磁性连续性。

公开(公告)号：US08357014B2

公开(公告)日：2013-01-22

申请号：US13356127

申请日：2012-01-23

Applicant: David Patrick Murray ,  Bernard Harold Hammond, Jr.

Inventor： David Patrick Murray ,  Bernard Harold Hammond, Jr.

IPC: H01R24/00

CPC classification number: H01R13/6466 ,  H01R13/6461 ,  H01R13/6464 ,  H01R13/6658 ,  H01R13/6691 ,  H01R24/64 ,  H05K1/0228 ,  H05K1/162 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/10189 ,  Y10S439/941 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/53209

Abstract: Methods and systems for providing crosstalk compensation in a jack are disclosed. According to one method, the crosstalk compensation is adapted to compensate for undesired crosstalk generated at a capacitive coupling located at a plug inserted within the jack. The method includes positioning a first capacitive coupling a first time delay away from the capacitive coupling of the plug, the first capacitive coupling having a greater magnitude and an opposite polarity as compared to the capacitive coupling of the plug. The method also includes positioning a second capacitive coupling at a second time delay from the first capacitive coupling, the second time delay corresponding to an average time delay that optimizes near end crosstalk. The second capacitive coupling has generally the same overall magnitude but an opposite polarity as compared to the first capacitive coupling, and includes two capacitive elements spaced at different time delays from the first capacitive coupling.

Abstract translation: 公开了一种用于在千斤顶中提供串扰补偿的方法和系统。 根据一种方法，串扰补偿适于补偿位于插入插座内的插头处的电容耦合处产生的不期望的串扰。 该方法包括将第一时间延迟定位成离开插头的电容耦合的第一电容耦合，与插头的电容耦合相比，第一电容耦合具有更大的幅度和相反的极性。 该方法还包括在第一时间延迟从第一电容耦合定位第二电容耦合，第二时间延迟对应于优化近端串扰的平均时间延迟。 第二电容耦合具有与第一电容耦合相比具有相同的总体幅度但具有相反的极性，并且包括以与第一电容耦合不同的时间延迟隔开的两个电容元件。

公开(公告)号：US08350637B2

公开(公告)日：2013-01-08

申请号：US12760557

申请日：2010-04-15

Applicant: Ting-Hao Yeh

Inventor： Ting-Hao Yeh

IPC: H01P3/08

CPC classification number: H05K1/025 ,  H05K2201/09354 ,  H05K2201/09672 ,  H05K2201/0979

Abstract: A circuit substrate includes a first pair of ground lines, a second pair of ground lines, a plurality of first connection lines, a plurality of second connection lines and a plurality of conductive pillars. The first and second pairs of ground lines are located on first and second surfaces of the substrate, respectively. The pillars are located in the substrate and vertically conducted between the first pair of ground lines and the second connection lines and between the second pair of ground lines and the first connection lines, and the first and second pairs of ground lines are conducted, so that a 3-D grounding circuit loop is formed. Moreover, a first pair of signal lines is disposed between the first connection lines for grounding and a second pair of signal lines is disposed between the second connection lines for grounding to get a better signal integrity.

Abstract translation: 电路基板包括第一对接地线，第二对接地线，多个第一连接线，多个第二连接线和多个导电柱。 第一和第二对接地线分别位于基板的第一和第二表面上。 支柱位于基板中，并且在第一对接地线与第二连接线之间以及第二对接地线与第一连接线之间垂直传导，并且第一和第二对接地线被导通，使得 形成3-D接地电路回路。 此外，第一对信号线设置在用于接地的第一连接线之间，并且第二对信号线设置在第二连接线之间用于接地以获得更好的信号完整性。

公开(公告)号：US20120306608A1

公开(公告)日：2012-12-06

申请号：US13414861

申请日：2012-03-08

Applicant: Yoshinori TAKENAKA

Inventor： Yoshinori TAKENAKA

IPC: H01F5/00 ,  H05K3/30

CPC classification number: H05K3/30 ,  H05K1/0233 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/09527 ,  H05K2201/09672 ,  Y10T29/49021 ,  Y10T29/4913

Abstract: A wiring board includes a core structure having a first surface and a second surface on the opposite side of the first surface, a first buildup structure formed on the first surface of the core structure and including insulation layers, and a second buildup structure formed on the second surface of the core structure and including insulation layers and an inductor device. The insulation layers in the second buildup structure have the thicknesses which are thinner than the thicknesses of the insulation layers in the first buildup structure, and the inductor device in the second buildup structure is position on the second surface of the core structure and includes at least a portion of a conductive pattern formed in the core structure.

Abstract translation: 布线基板包括具有在第一表面的相对侧的第一表面和第二表面的芯结构，形成在芯结构的第一表面上并且包括绝缘层的第一堆积结构，以及形成在第一堆积结构上的第二堆积结构 芯结构的第二表面并包括绝缘层和电感器件。 第二堆积结构中的绝缘层具有比第一堆积结构中的绝缘层的厚度薄的厚度，并且第二堆叠结构中的电感器件位于芯结构的第二表面上并且至少包括 形成在芯结构中的导电图案的一部分。

公开(公告)号：US08325490B2

公开(公告)日：2012-12-04

申请号：US12823316

申请日：2010-06-25

Applicant: Sungjun Chun ,  Anand Haridass ,  Roger D. Weekly

Inventor： Sungjun Chun ,  Anand Haridass ,  Roger D. Weekly

IPC: H05K1/11

CPC classification number: G06F17/5077 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/0253 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/09536 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2201/09718 ,  Y10T29/49117 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24322

Abstract: Manufacturing circuits with reference plane voids over vias with a strip segment interconnect permits routing critical signal paths over vias, while increasing via insertion capacitance only slightly. The transmission line reference plane defines voids above (or below) signal-bearing plated-through holes (PTHs) that pass through a rigid substrate core, so that the signals are not degraded by an impedance mismatch that would otherwise be caused by shunt capacitance from the top (or bottom) of the signal-bearing PTHs to the transmission line reference plane. In order to provide increased routing density, signal paths are routed over the voids, but disruption of the signal paths by the voids is prevented by including a conductive strip through the voids that reduces the coupling to the signal-bearing PTHs and maintains the impedance of the signal path conductor.

Abstract translation: 具有带状段互连的通孔上的参考平面空隙的制造电路允许在通孔上路由关键信号路径，同时仅通过插入电容略微增加。 传输线参考平面定义了通过刚性衬底芯的信号承载电镀通孔（PTH）上方（或下方）的空隙，使得信号不会被阻抗失配降级，否则会由分流电容引起 信号承载PTH的顶部（或底部）到传输线参考平面。 为了提供增加的布线密度，信号路径被布置在空隙上，但是通过将导电条包括通过空隙来防止由空隙引起的信号路径的破坏，从而减小与信号承载PTH的耦合并维持 信号路径导体。

公开(公告)号：US20120243184A1

公开(公告)日：2012-09-27

申请号：US13275320

申请日：2011-10-18

Applicant: Sheng-Yuan Lee

Inventor： Sheng-Yuan Lee

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0245 ,  H05K1/0248 ,  H05K1/0251 ,  H05K2201/09618 ,  H05K2201/09672

Abstract: A differential signal pair transmission structure adapted to a wiring board and including a first signal path and a second signal path is provided. The first signal path includes a first upper trace, a first lower trace and a first conductive through via. The second signal path includes a second upper trace, a second lower trace and a second conductive through via. A portion of the first signal path and a portion of the second signal path overlaps in the normal projection onto the upper or lower surface of the wiring board. Normal projections of the first and the second signal path projecting onto the upper surface of the wiring board are substantially symmetric with respect to a line which is perpendicular to a segment connecting normal projections of axes of the first and the second through via onto the upper surface and passes through the midpoint of the segment.

Abstract translation: 提供一种适用于布线板并包括第一信号路径和第二信号路径的差分信号对传输结构。 第一信号路径包括第一上迹线，第一下迹线和第一导通通孔。 第二信号路径包括第二上轨道，第二下轨道和第二导通通道。 第一信号路径的一部分和第二信号路径的一部分在正常投影中与布线板的上表面或下表面重叠。 突出到布线板的上表面上的第一和第二信号路径的正常投影相对于与将第一和第二通孔的轴线的正常突起连接到上表面的线垂直的线基本对称 并通过该段的中点。

公开(公告)号：US08242380B2

公开(公告)日：2012-08-14

申请号：US12148017

申请日：2008-04-16

Applicant: Karl Joseph Bois ,  Timothy L. Michalka

Inventor： Karl Joseph Bois ,  Timothy L. Michalka

IPC: H05K1/11

CPC classification number: H05K3/4688 ,  H05K1/024 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0715 ,  H05K2201/09672 ,  H05K2201/09881 ,  Y10T29/49124

Abstract: A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A first signal path layer is embedded in the first dielectric material and a second signal path layer is embedded in the second dielectric material, wherein the first and second signal path layers are substantially parallel to each other in a stack-up arrangement. An adhesive layer is interposed between the first dielectric material and the second dielectric material.

Abstract translation: 印刷电路板（PCB）基板及其构造方法。 在一个实施例中，第一电介质材料与第一电​​流返回层相关联，并且第二电介质材料与第二电流返回层相关联。 第一信号通路层被嵌入在第一电介质材料中，第二信号路径层被嵌入在第二电介质材料中，其中第一和第二信号通路层以叠层布置基本上彼此平行。 在第一电介质材料和第二电介质材料之间插入粘合剂层。

公开(公告)号：US08179695B2

公开(公告)日：2012-05-15

申请号：US12783478

申请日：2010-05-19

Applicant: Uei-Ming Jow ,  Chin-Sun Shyu ,  Chang-Sheng Chen ,  Min-Lin Lee ,  Shinn-Juh Lai

Inventor： Uei-Ming Jow ,  Chin-Sun Shyu ,  Chang-Sheng Chen ,  Min-Lin Lee ,  Shinn-Juh Lai

IPC: H05K9/00

CPC classification number: H05K1/0218 ,  H05K1/0224 ,  H05K1/0237 ,  H05K1/025 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K2201/0792 ,  H05K2201/09672

Abstract: A mirror image shielding structure is provided, which includes an electronic element and a ground shielding plane below the electronic element. The shape of the ground shielding plane is identical to the projection shape of the electronic element, and the horizontal size of the ground shielding plane is greater than or equal to that of the electronic element. Thus, the parasitic effect between the electronic element and the ground shielding plane is effectively reduced, and the vertical coupling effect between electronic elements is also reduced. Furthermore, the vertical impact on the signal integrity of the embedded elements caused by the layout of the transmission lines is prevented.

Abstract translation: 提供一种镜像屏蔽结构，其包括电子元件和电子元件下方的接地屏蔽平面。 接地屏蔽面的形状与电子元件的突出形状相同，接地屏蔽面的水平尺寸大于或等于电子元件的尺寸。 因此，有效地减小了电子元件与接地屏蔽层之间的寄生效应，并且电子元件之间的垂直耦合效应也降低。 此外，防止了由传输线的布局引起的对嵌入元件的信号完整性的垂直影响。

公开(公告)号：US08154162B2

公开(公告)日：2012-04-10

申请号：US12392449

申请日：2009-02-25

Applicant: Takahiro Suginohara ,  Haruhiko Ito ,  Toshihide Sonoda ,  Takuya Yamane

Inventor： Takahiro Suginohara ,  Haruhiko Ito ,  Toshihide Sonoda ,  Takuya Yamane

IPC: H02K11/00

CPC classification number: H02K3/522 ,  G11B19/2009 ,  H02K5/225 ,  H02K21/22 ,  H02K2211/03 ,  H05K1/0265 ,  H05K1/0393 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/09381 ,  H05K2201/09672 ,  H05K2201/09727 ,  H05K2201/1003

Abstract: A motor for holding a disk with a mounting opening in place includes a rotor unit including a rotor magnet rotatable about a central axis and a stator unit including a stator arranged opposite to the rotor magnet and a circuit board electrically connected to the stator. Wiring lines of the circuit board include output-side land portions electrically connected to first ends of coils of the stator, a connection-side land portion electrically connected to second ends of the coils forming a neutral point, a connection portion electrically connected to an external power source, output-side wiring portions arranged to electrically interconnect the output-side land portions and the connection portion, and a connection-side wiring portion arranged to electrically interconnect the connection-side land portion and the connection portion. Each of the output-side wiring portions has a width greater than a width of the connection-side wiring portion.

Abstract translation: 用于将具有安装开口的盘保持在适当位置的电动机包括：转子单元，其包括可围绕中心轴线旋转的转子磁体和包括与转子磁体相对布置的定子的定子单元和与该定子电连接的电路板。 电路板的布线包括电连接到定子的线圈的第一端的输出侧接地部分，与形成中性点的线圈的第二端电连接的连接侧接地部，与外部电连接的连接部 电源，布置成电连接输出侧接地部分和连接部分的输出侧布线部分和布置成电连接连接侧接地部分和连接部分的连接侧布线部分。 每个输出侧布线部分的宽度大于连接侧布线部分的宽度。