公开(公告)号：US07733664B2

公开(公告)日：2010-06-08

申请号：US12155947

申请日：2008-06-12

Applicant: Atsushi Ito ,  Takayoshi Honda ,  Hidehiro Mikura ,  Tadashi Tsuruzawa ,  Takuya Sakuta

Inventor： Atsushi Ito ,  Takayoshi Honda ,  Hidehiro Mikura ,  Tadashi Tsuruzawa ,  Takuya Sakuta

IPC: H05K1/11

CPC classification number: H05K3/3421 ,  H05K1/111 ,  H05K3/3426 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2201/10787 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.

Abstract translation: 电子部件安装结构包括安装在板的表面上的板和电子部件。 董事会包括土地。 电子部件包括主体和从主体延伸的端子。 每个端子电连接到板的对应的一个焊盘。 端子具有沿着板的表面延伸的第一端子部分和朝向板的表面延伸的第二端子部分。 每个焊盘包括电焊接到第一端子部分的焊盘部分和用于接收第二端子部分的盲孔。 在第二端子部分插入盲孔的条件下，第一端子部分在回流工艺中焊接到焊盘部分。

公开(公告)号：US20100108372A1

公开(公告)日：2010-05-06

申请号：US12585509

申请日：2009-09-16

Applicant: Myung-Sam Kang

Inventor： Myung-Sam Kang

IPC: H05K1/18

CPC classification number: H01L23/3114 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/007 ,  H05K3/20 ,  H05K3/284 ,  H05K3/4007 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2203/0361 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic component package and a manufacturing method thereof. The electronic component package includes: an insulation layer; a single layer of circuit pattern buried in the insulation layer and having a surface exposed at one side of the insulation layer, the circuit pattern comprising a bonding pad and a solder ball pad; and an electronic component mounted on one side of the insulation layer and electrically connected with the bonding pad. In addition, the electronic component package includes a portion of the insulation layer being removed in correspondence with the position of the solder ball pad such that the solder ball pad is exposed at the other side of the insulation layer.

Abstract translation: 一种电子元件封装及其制造方法。 电子部件封装包括：绝缘层; 埋在绝缘层中并具有在绝缘层的一侧露出的表面的单层电路图案，电路图案包括接合焊盘和焊球垫; 以及安装在所述绝缘层的一侧上并与所述接合焊盘电连接的电子部件。 此外，电子部件封装包括与焊球垫的位置对应地去除绝缘层的一部分，使得焊球垫在绝缘层的另一侧露出。

公开(公告)号：USRE41242E1

公开(公告)日：2010-04-20

申请号：US10850584

申请日：1998-09-28

Applicant: Motoo Asai ,  Yoji Mori

Inventor： Motoo Asai ,  Yoji Mori

IPC: H05K1/14

CPC classification number: H01L23/50 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15173 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/114 ,  H05K1/116 ,  H05K3/3457 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 μm in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also small. On the other hand, each soldering pad formed on the bottom surface of the package board, on which a mother board, etc. are to be mounted, is large (600 μm in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also large. Consequently, a dummy pattern 58M is formed between conductor circuits 58U and 58U for forming signal lines on the IC chip side surface of the package board thereby to increase the metallic portion on the surface and adjust the rate of the metallic portion between the IC chip side and the mother board side of the package board, protecting the package board from warping in the manufacturing processes, as well as during operation.

Abstract translation: 根据本发明的封装板，形成在其上安装有IC芯片的封装板的顶表面上的每个焊盘的直径小（133至170μm），所以金属部分被 封装板表面上的焊盘也很小。 另一方面，形成在其上安装有母板等的封装基板的底面上的每个焊盘的直径大（直径为600μm），因此焊盘上的金属部分 封装板的表面也很大。 因此，在导体电路58U和58U之间形成虚设图形58M，用于在封装板的IC芯片侧表面上形成信号线，从而增加表面上的金属部分，并调节IC芯片侧之间的金属部分的速率 和封装板的母板侧，保护封装板在制造过程中以及在运行期间不发生翘曲。

公开(公告)号：US07696013B2

公开(公告)日：2010-04-13

申请号：US11737187

申请日：2007-04-19

Applicant: M. Zaki Ali ,  A. Peter Stolt ,  Gilbert A. Hawkins ,  Thomas M. Stephany

Inventor： M. Zaki Ali ,  A. Peter Stolt ,  Gilbert A. Hawkins ,  Thomas M. Stephany

IPC: H01L21/00

CPC classification number: H01L23/48 ,  B81B2207/098 ,  B81C1/00301 ,  H01L21/4864 ,  H01L24/24 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/1131 ,  H01L2224/24226 ,  H01L2224/244 ,  H01L2224/24992 ,  H01L2224/27013 ,  H01L2224/73217 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2224/83051 ,  H01L2224/838 ,  H01L2224/92144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/12041 ,  H01L2924/1306 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/125 ,  H05K3/1258 ,  H05K3/321 ,  H05K2201/09472 ,  H05K2201/10674 ,  H05K2203/013 ,  H05K2203/0568 ,  H05K2203/1469 ,  Y10S438/94 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die.

Abstract translation: 提供与微型化装置的连通性的方法，该方法包括以下步骤：提供具有至少顶表面的烧蚀性基材; 提供具有第一和第二表面的模具，并且至少在所述第一表面上具有焊盘; 使所述模具与所述模具的所述至少第一表面接触所述可烧蚀基材的所述至少第一表面; 并且在靠近模具的烧蚀材料中烧蚀通道。

公开(公告)号：US07669748B2

公开(公告)日：2010-03-02

申请号：US12173346

申请日：2008-07-15

Applicant: Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

Inventor： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC: B23K31/02

CPC classification number: H05K3/3484 ,  B23K3/0607 ,  B23K2101/42 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09472 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568

Abstract: A system provides solder into cavities in a circuit supporting substrate. The system places a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Solder is forced out of the fill head toward the circuit supporting substrate. The solder is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head. The system brings a second circuit supporting substrate in close proximity to the circuit supporting substrate, at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity.

Abstract translation: 系统将焊料提供到电路支撑衬底中的空腔中。 该系统使填充头与电路支撑衬底基本接触。 电路支撑衬底包括至少一个空腔。 当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。 焊料被迫从填充头朝向电路支撑基板。 焊料被提供到与填充头附近的至少一个空腔同时的至少一个空腔中。 系统使第二电路支撑衬底紧靠电路支撑衬底，第二电路支撑衬底上的至少一个接收衬垫基本上接触至少一个空腔的导电接合材料。

公开(公告)号：US07660129B2

公开(公告)日：2010-02-09

申请号：US12022540

申请日：2008-01-30

Applicant: Yuuji Minota ,  Yasuhiro Fukutomi ,  Motonobu Koike

Inventor： Yuuji Minota ,  Yasuhiro Fukutomi ,  Motonobu Koike

IPC: H05K7/10

CPC classification number: H05K3/363 ,  H05K3/3452 ,  H05K2201/09472 ,  H05K2201/09909 ,  H05K2201/2036 ,  H05K2203/0588 ,  Y10T29/49126

Abstract: There is provided a printed circuit board in which a PCB and an FPC can be readily located, a solder connection structure and method between a printed circuit board and a flexible printed circuit board. The printed circuit board 1 includes a plurality of pads 2 for mounting a flexible printed circuit board, wherein a solder resist 3 is formed on the surface of the printed circuit board so as to expose the pads 2 and convex portions are formed by insulation print layers 4 around the pads 2.

Abstract translation: 提供了一种印刷电路板，其中可以容易地定位PCB和FPC，在印刷电路板和柔性印刷电路板之间的焊接连接结构和方法。 印刷电路板1包括用于安装柔性印刷电路板的多个焊盘2，其中在印刷电路板的表面上形成阻焊剂3，以便露出焊盘2，并且凸部由绝缘印刷层形成 4周围垫2。

公开(公告)号：US20100007012A1

公开(公告)日：2010-01-14

申请号：US12550327

申请日：2009-08-28

Applicant: Peter C. Salmon

Inventor： Peter C. Salmon

IPC: H01L23/50 ,  H01L23/367

CPC classification number: H05K3/363 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/5386 ,  H01L23/5387 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/05573 ,  H01L2224/11332 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/81052 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3651 ,  H05K1/0289 ,  H05K1/115 ,  H05K3/007 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/4015 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10674 ,  H05K2203/016 ,  H05K2203/0568 ,  Y02P70/613 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599

Abstract: This specification describes techniques for manufacturing an electronic system module. The module includes flexible multi-layer interconnection circuits with trace widths as narrow as 5 microns or less. A glass panel manufacturing facility, similar to those employed for making liquid crystal display, LCD, panels is preferably used to fabricate the interconnection circuits. A multi-layer interconnection circuit is fabricated on the glass panel using a release layer. A special assembly layer is formed over the interconnection circuit comprising a thick dielectric layer with openings formed at input/output (I/O) pad locations. Solder paste is deposited in the openings using a squeegee to form wells filled with solder. IC chips are provided with gold stud bumps at I/O pad locations, and these bumps are inserted in the wells to form flip chip connections. The IC chips are tested and reworked. The same bump/well connections can be used to attach fine-pitch cables. Module packaging layers are provided for hermetic sealing and for electromagnetic shielding. A blade server or supercomputer embodiment is also described.

Abstract translation: 本说明书描述了用于制造电子系统模块的技术。 该模块包括具有窄至5微米或更小的迹线宽度的柔性多层互连电路。 与用于制造液晶显示器，LCD，面板的玻璃面板制造设备相似，优选地用于制造互连电路。 使用剥离层在玻璃面板上制造多层互连电路。 在互连电路上形成特殊的组装层，该电路包括在输入/输出（I / O）焊盘位置处形成有开口的厚电介质层。 使用刮刀将焊膏沉积在开口中以形成填充有焊料的孔。 IC芯片在I / O焊盘位置处设有金柱凸起，并且这些凸块插入孔中以形成倒装芯片连接。 IC芯片经过测试和返工。 相同的凹凸/连接可用于连接细间距电缆。 提供模块封装层用于密封和电磁屏蔽。 还描述了刀片服务器或超级计算机实施例。

公开(公告)号：USRE41051E1

公开(公告)日：2009-12-22

申请号：US10876287

申请日：2004-06-25

Applicant: Motoo Asai ,  Yoji Mori

Inventor： Motoo Asai ,  Yoji Mori

IPC: H05K1/14 ,  H05K1/11

CPC classification number: H01L23/50 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15173 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/114 ,  H05K1/116 ,  H05K3/3457 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 μm in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also small. On the other hand, each soldering pad formed on the bottom surface of the package board, on which a mother board, etc. are to be mounted, is large (600 μm in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also large. Consequently, a dummy pattern 58M is formed between conductor circuits 58U and 58U for forming signal lines on the IC chip side surface of the package board thereby to increase the metallic portion on the surface and adjust the rate of the metallic portion between the IC chip side and the mother board side of the package board, protecting the package board from warping in the manufacturing processes, as well as during operation.

公开(公告)号：US07636145B2

公开(公告)日：2009-12-22

申请号：US11353823

申请日：2006-02-14

Applicant: Jin-Goo Jung ,  Chun-Gi You ,  Chul-Ho Kim ,  Kyung-Min Park ,  Il-Gon Kim

Inventor： Jin-Goo Jung ,  Chun-Gi You ,  Chul-Ho Kim ,  Kyung-Min Park ,  Il-Gon Kim

IPC: G02F1/1345

CPC classification number: G02F1/136227 ,  G02F1/13458 ,  G02F2001/13456 ,  H05K1/117 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09436 ,  H05K2201/09472

Abstract: In a display apparatus and a manufacturing method of the display apparatus, the display apparatus includes a display panel having signal lines and an insulating layer, and a signal generator electrically connected to the signal lines and adhering to the display panel. The signal lines include pads formed at ends thereof, respectively. The organic insulating layer is partially removed such that the via holes are formed between the pads of the signal lines to reduce a step-difference between an area in which the pads are formed and an area in which the pads are not formed. Thus, the display apparatus may enhance the coupling force between the signal generator and the display panel.

Abstract translation: 在显示装置的显示装置和制造方法中，显示装置包括具有信号线和绝缘层的显示面板，以及电连接到信号线并附着在显示面板上的信号发生器。 信号线分别包括在其端部形成的焊盘。 有机绝缘层被部分去除，使得通孔形成在信号线的焊盘之间，以减小其中形成焊盘的区域与不形成焊盘的区域之间的阶差。 因此，显示装置可以增强信号发生器和显示面板之间的耦合力。

公开(公告)号：US20090284943A1

公开(公告)日：2009-11-19

申请号：US12464307

申请日：2009-05-12

Applicant: Toshihisa YODA ,  Shunichiro Matsumoto ,  Masako Sato

Inventor： Toshihisa YODA ,  Shunichiro Matsumoto ,  Masako Sato

IPC: H05K7/02 ,  H05K1/11 ,  H05K3/10

CPC classification number: H05K1/113 ,  H01L23/498 ,  H01L23/49816 ,  H01L2224/16237 ,  H05K3/4644 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K2201/10734 ,  Y10T29/49155

Abstract: In a wiring board, a plurality of wiring layers and a plurality of insulating layers are alternately stacked. The wiring layers are electrically connected to one another through via holes formed in the insulating layers. The wiring board includes: a connection pad which is disposed on one of the wiring layers that is on the inner side of an outermost wiring layer; and an external connection terminal which is disposed on the connection pad, and which is projected from the surface of the wiring board. The external connection terminal is passed through the outermost wiring layer.

Abstract translation: 在布线板中，交替层叠多个布线层和多​​个绝缘层。 布线层通过形成在绝缘层中的通孔彼此电连接。 布线基板包括：连接焊盘，其设置在布线层中的位于最外布线层的内侧的一个布线层上; 以及外部连接端子，其设置在连接焊盘上，并且从布线板的表面突出。 外部连接端子穿过最外面的布线层。