公开(公告)号：US06853080B2

公开(公告)日：2005-02-08

申请号：US10373670

申请日：2003-02-24

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: G02F1/1333 ,  G02F1/1345 ,  H01L21/60 ,  H05K1/11 ,  H05K3/28 ,  H05K3/30 ,  H05K3/36 ,  H05K3/40 ,  H01L23/48

CPC classification number: H05K3/361 ,  H01L2224/73204 ,  H05K1/117 ,  H05K3/28 ,  H05K3/305 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09709 ,  H05K2201/10977 ,  H05K2203/0369

Abstract: A plurality of lands are arranged in rows. The lands in adjacent rows are disposed in a staggered arrangement. A first interconnecting line is pulled out from each of the lands. Each of the lands is wider than the first interconnecting line in the row direction. A plurality of electrical connection sections are arranged in rows. The electrical connection sections in adjacent rows are disposed in a staggered arrangement. The lands are electrically connected with the electrical connection sections so as to overlap. Each of the electrical connection sections is a part of a second interconnecting line, and an insulating layer is formed between the second interconnecting lineing pattern other than the electrical connection sections and the first interconnecting lineing pattern.

Abstract translation: 多个平台排成行。 相邻行中的平台以交错排列布置。 从每个焊盘拉出第一互连线。 每个平台比行方向上的第一互连线宽。 多个电连接部分排列成行。 相邻行中的电连接部分以交错布置设置。 焊盘与电连接部分电连接以便重叠。 每个电连接部分是第二互连线的一部分，并且绝缘层形成在第二互连线图案之外，而不是电连接部分和第一互连线条图案。

公开(公告)号：US06848176B2

公开(公告)日：2005-02-01

申请号：US10640272

申请日：2003-08-14

Applicant: Hiroyuki Hishinuma ,  Hideyuki Kurita ,  Ryo Ito ,  Masayuki Nakamura

Inventor： Hiroyuki Hishinuma ,  Hideyuki Kurita ,  Ryo Ito ,  Masayuki Nakamura

IPC: H05K3/18 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K3/02 ,  H05K3/10

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/4985 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/423 ,  H05K3/4647 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0759 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2224/05624 ,  H01L2924/00014

Abstract: A process for manufacturing a flexible wiring board according to the present invention comprises growing metal bumps 16 using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps 16 can be formed with good precision because laser beam is not used to form openings in a polyimide film. After metal bumps 16 have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps 16.

Abstract translation: 根据本发明的制造柔性布线板的方法包括使用通过光刻图案化的掩模膜生长金属凸块16。 可以精确地形成精细的开口，因此，由于激光束不用于在聚酰亚胺膜中形成开口，所以可以以高精度形成精细的金属凸块16。 在形成金属凸块16之后，去除掩模膜并施加液态树脂材料并干燥以形成涂层，然后将其固化成树脂膜。 可以在涂覆阶段期间在表面部分蚀刻涂层以暴露金属凸块16的顶部。

公开(公告)号：US20040245619A1

公开(公告)日：2004-12-09

申请号：US10860493

申请日：2004-06-04

Inventor： Yoshihiko Takeuchi ,  Yasuhito Ohwaki ,  Yuichi Takayoshi

IPC: H01L021/44 ,  H01L023/48

CPC classification number: H01L23/49833 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K1/056 ,  H05K1/141 ,  H05K1/147 ,  H05K3/108 ,  H05K3/363 ,  H05K2201/0367 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/0969 ,  H01L2924/00

Abstract: A wired circuit board that can control characteristic impedance at connection points between wires of a suspension board with circuit and terminal portions of the wired circuit board connected thereto with a simple structure, to improve signal transmission efficiency even for fine pitch wiring or for high frequency signal. To provide this wired circuit board, a relay flexible wiring circuit board 1 is formed by a first wired circuit board 14 comprising a first metal substrate 16, a first insulating base layer 17, a first conductor layer 18 and a first insulating cover layer 19 which is substantially identical in layer structure with the suspension board with circuit 3 and a second wired circuit board 15 connected with the first wired circuit board 14 for connecting with a control circuit board 4. In this wired circuit board, since the suspension board with circuit 3 and the first wired circuit board 14 are rendered substantially identical in layer structure with each other, both characteristic impedances at these connection points can be matched with each other.

Abstract translation: 一种布线电路板，其可以以简单的结构控制悬挂板的导线之间的连接点处的连接点处的特性阻抗，并且连接到其上的布线电路板的端子部分，以便即使对于细间距布线或用于高频信号也可以提高信号传输效率 。 为了提供这种布线电路板，继电器柔性布线电路板1由包括第一金属基板16，第一绝缘基底层17，第一导体层18和第一绝缘覆盖层19的第一布线电路板14形成， 与具有电路3的悬挂板的层结构基本相同，以及与第一布线电路板14连接的第二布线电路板15，用于与控制电路板4连接。在该布线电路板中，由于具有电路3的悬架板 并且第一布线电路板14的层结构彼此基本相同，这两个连接点的两个特征阻抗都可以相互匹配。

公开(公告)号：US06828812B2

公开(公告)日：2004-12-07

申请号：US08838452

申请日：1997-04-07

Applicant: Warren M. Farnworth ,  Alan G. Wood ,  Trung T. Doan ,  David R. Hembree

Inventor： Warren M. Farnworth ,  Alan G. Wood ,  Trung T. Doan ,  David R. Hembree

IPC: G01R1073

CPC classification number: H01L23/49838 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2863 ,  G01R31/2893 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/81192 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15787 ,  H01L2924/16195 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A die contacting substrate establishes ohmic contact with the die by means of raised portions on contact members. The raised portions are dimensioned so that a compression force applied to the die against the substrate results in a limited penetration of the contact member into the bondpads. The arrangement may be used for establishing electrical contact with a burn-in oven and with a discrete die tester. This permits the die to be characterized prior to assembly, so that the die may then be transferred in an unpackaged form. A Z-axis anisotropic conductive interconnect material may be interposed between the die attachment surface and the die.

Abstract translation: 模具接触衬底通过接触构件上的凸起部分与模具建立欧姆接触。 凸起部分的尺寸被设计成使得对模具施加到基板上的压缩力导致接触构件有限地渗透到粘合垫中。 该装置可用于建立与老化炉的电气接触以及离散的模具测试器。 这允许在组装之前对模具进行表征，从而可以以未包装的形式转移模具。 Z轴各向异性导电互连材料可以插入在模具附接表面和模具之间。

公开(公告)号：US06809267B1

公开(公告)日：2004-10-26

申请号：US09936359

申请日：2002-01-02

Applicant: Hideyuki Kurita ,  Masato Taniguchi

Inventor： Hideyuki Kurita ,  Masato Taniguchi

IPC: H05K100

CPC classification number: H05K3/4007 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K3/423 ,  H05K2201/0154 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/09709 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/0759

Abstract: In a flexible printed wiring board obtained by connecting metal bumps of a first flexible printed wiring part and connection pads of a second flexible printed wiring part, the first flexible printed wiring part is composed of a conductive layer and insulating layer adjacent thereto, holes A being provided in the insulating layer so as to reach the conductive layer, metal plugs being formed in these holes by an electrolytic plating method, metal bumps being produced by making the tips of these metal plugs project from the insulating layer. In this way, as many as possible flexible printed wiring boards can be obtained from a laminated sheet for flexible printed wiring of prescribed size.

Abstract translation: 在通过连接第一柔性印刷布线部分的金属凸块和第二柔性印刷布线部分的连接垫而获得的柔性印刷布线板中，第一柔性印刷布线部分由导电层和与其相邻的绝缘层组成，孔A为 设置在绝缘层中以到达导电层，通过电解电镀法在这些孔中形成金属插塞，通过使这些金属插头的顶端从绝缘层突出而制造金属凸块。 以这种方式，可以从用于规定尺寸的柔性印刷布线的层压片材获得尽可能多的柔性印刷线路板。

公开(公告)号：US20040203262A1

公开(公告)日：2004-10-14

申请号：US10411175

申请日：2003-04-10

Applicant: FormFactor, Inc.

Inventor： Scott E. Lindsey ,  Charles A. Miller ,  David M. Royster ,  Stuart W. Wenzel

IPC: H01R012/00

CPC classification number: G01R1/06733 ,  G01R1/06711 ,  G01R1/06744 ,  G01R31/2884 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2224/16 ,  H01L2924/00014 ,  H01R4/4863 ,  H01R12/57 ,  H01R13/035 ,  H01R13/2421 ,  H01R13/33 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/10265 ,  H05K2203/308 ,  H01L2224/0401

Abstract: A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device in a coil pattern over the compliant pad to its end area, forming a helix. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. In an alternative embodiment, the pad is removed to leave a freestanding helical contact.

Abstract translation: 公开了一种用于在器件和匹配衬底之间进行电接触的微电子弹簧触点及其制造方法。 弹簧触点具有粘附到装置的基板并与装置的端子间隔开的柔性衬垫。 柔性衬垫具有粘附到衬底的基底，以及远离衬底延伸的侧表面，并且逐渐变细到远离衬底的较小端部区域。 迹线从器件的端子以柔性衬垫的线圈图案延伸到其端部区域，形成螺旋线。 柔性焊盘端部区域的至少一部分被迹线覆盖，并且位于柔性焊盘上方的迹线的一部分由柔性焊盘支撑。 在替代实施例中，去除垫以留下独立的螺旋接触。

公开(公告)号：US20040188139A1

公开(公告)日：2004-09-30

申请号：US10819220

申请日：2004-04-07

Applicant: Sony Chemicals Corp.

Inventor： Yutaka Kaneda

IPC: H05K001/11 ,  H01R012/04 ,  H01L023/52 ,  H01L023/48 ,  H01L029/40

CPC classification number: H01L23/49816 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/06 ,  H05K3/4007 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00

Abstract: A method of manufacturing a wiring circuit board having bumps is disclosed in which a stable bump connection is possible, and complex operations such as plating pre-treatment are unnecessary. Bumps having a surface roughness on the tip face thereof of 0.2 to 20 nullm are formed by forming an etching mask for bump formation on bump formation surface of a metal foil which has a thickness (t1nullt2) which is the sum of a thickness t1 of a wiring circuit and a height t2 of bumps to be formed on wiring circuit and which has a surface roughness of the bump formation surface thereof of 0.2 to 20 nullm, and half etching the metal foil from the side of the etching mask for bump formation to a depth corresponding to the desired bump height t2.

Abstract translation: 公开了一种制造具有凸块的布线电路板的方法，其中可以进行稳定的凸起连接，并且不需要复杂的操作，例如电镀预处理。 通过在金属箔的凸块形成表面上形成用于凸块形成表面的蚀刻掩模，形成具有0.2至20μm的表面粗糙度的凸起表面粗糙度的凸起，其厚度（t1 + t2）为厚度t1 的布线电路和要形成在布线电路上的凸块的高度t2，并且其凸起形成表面的表面粗糙度为0.2至20μm，并且从用于凸起形成的蚀刻掩模的侧面蚀刻金属箔 达到对应于期望的凸起高度t2的深度。

公开(公告)号：US20040140560A1

公开(公告)日：2004-07-22

申请号：US10346285

申请日：2003-01-16

Applicant: International Business Machines Corporation

Inventor： Paul Marlan Harvey

IPC: H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC classification number: H05K3/4038 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K3/064 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0367 ,  H05K2203/0554 ,  H05K2203/1476 ,  H01L2924/00

Abstract: The present invention provides for a method of interconnecting a bumped circuit having relatively fine traces to an overlying conductive layer of a laminated circuit assembly. The overlying conductive layer is laminated with a suitable insulating adhesive over a bumped relatively fine pitch circuit layer. In the general vicinity of the desired power connection, a window substantially larger than the width of the bump is etched away from the conductive material of the trace of the outer conductive layer and the adhesive is plasma etched to expose the elevated portion of the desired bump of the bumped circuit. A conductive media such as conductive polymer or solder is then applied at the etched window of the overlying relatively coarse trace, which ensures an electrical connection between the exposed portion of the bump and the overlying trace.

Abstract translation: 本发明提供了一种将具有相对精细迹线的凸起电路互连到层压电路组件的上覆导电层的方法。 覆盖的导电层与凸起的相对细间距电路层上的合适的绝缘粘合剂层压。 在所需功率连接的总体附近，基本上大于凸块的宽度的窗口被蚀刻远离外部导电层的迹线的导电材料，并且粘合剂被等离子体蚀刻以暴露所需凸块的升高部分 的碰撞电路。 导电介质如导电聚合物或焊料然后被施加在覆盖的相对粗糙的迹线的蚀刻窗口处，这确保凸起的暴露部分和上覆迹线之间的电连接。

公开(公告)号：US06739878B1

公开(公告)日：2004-05-25

申请号：US10385364

申请日：2003-03-10

Applicant: Alfiero Balzano

Inventor： Alfiero Balzano

IPC: H01R1200

CPC classification number: H05K3/365 ,  H01R12/7047 ,  H01R12/714 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/1031 ,  H05K2203/167 ,  Y02P70/611

Abstract: Pressure point contact for interconnecting electronic circuits wherein one component includes a flexible cable having a plurality of conductive strips with each strip terminating in contact pads having outwardly projecting pressure point contact mounds that protrude through a layer covering the strips with electrically insulated material. The other component of the interconnecting circuit includes a plurality of conductive contact elements placed on the exposed surface of a printed circuit board, LCD or other planar surface. A pressure plate is arcuate shaped and is employed for applying pressure to the backside of the flexible cable in order to force the contact mounds into pressure engagement with the contact elements on the planar surface. To provide equal application of pressure, a flat compression stabilizer plate is placed between the arcuate pressure plate and the backside of the cable. A pressure applicator is employed for applying equal pressure via the pressure plate serving as a compression stabilizer for equalizing the application pressure to the backside of the flexible cable so that pressure is evenly distributed as pressure is applied. Alternately, the contact elements on the planar surface may include raised receptacles for registering with and insertably receiving the pressure point contact mounds.

Abstract translation: 用于互连电子电路的压力点接触，其中一个部件包括具有多个导电条带的柔性电缆，每个条带终止于具有向外突出的压力点接触凸块的接触焊盘，所述接触焊盘通过电绝缘材料覆盖所述条带而突出。 互连电路的另一部件包括放置在印刷电路板，LCD或其它平面表面的暴露表面上的多个导电接触元件。 压板是弓形的，并且用于向柔性电缆的背面施加压力，以便迫使接触丘与平坦表面上的接触元件进行压力接合。 为了提供相同的压力施加，扁平压缩稳定板被放置在弧形压板和电缆的背面之间。 使用压力施加器通过用作压缩稳定器的压力板施加相等的压力，以将施加压力均衡到柔性电缆的背面，使得在施加压力时压力均匀分布。 或者，平面表面上的接触元件可以包括凸起的接收器，用于与压力点接触凸起配准并可插入地接收。

公开(公告)号：US20040092141A1

公开(公告)日：2004-05-13

申请号：US10702235

申请日：2003-11-05

Inventor： Peter C. Salmon

IPC: H01R004/58

CPC classification number: H05K3/363 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/5386 ,  H01L23/5387 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/05573 ,  H01L2224/11332 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/81052 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3651 ,  H05K1/0289 ,  H05K1/115 ,  H05K3/007 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/4015 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10674 ,  H05K2203/016 ,  H05K2203/0568 ,  Y02P70/613 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599

Abstract: This specification describes techniques for manufacturing an electronic system module. The module includes flexible multi-layer interconnection circuits with trace widths as narrow as 5 microns or less. A glass panel manufacturing facility, similar to those employed for making liquid crystal display, LCD, panels is preferably used to fabricate the interconnection circuits. A multi-layer interconnection circuit is fabricated on the glass panel using a release layer. A special assembly layer is formed over the interconnection circuit comprising a thick dielectric layer with openings formed at input/output (I/O) pad locations. Solder paste is deposited in the openings using a squeegee to form wells filled with solder. IC chips are provided with gold stud bumps at I/O pad locations, and these bumps are inserted in the wells to form flip chip connections. The IC chips are tested and reworked. The same bump/well connections can be used to attach fine-pitch cables. Module packaging layers are provided for hermetic sealing and for electromagnetic shielding. A blade server or supercomputer embodiment is also described.

Abstract translation: 本说明书描述了用于制造电子系统模块的技术。 该模块包括具有窄至5微米或更小的迹线宽度的柔性多层互连电路。 与用于制造液晶显示器，LCD，面板的玻璃面板制造设备相似，优选地用于制造互连电路。 使用剥离层在玻璃面板上制造多层互连电路。 在互连电路上形成特殊的组装层，该电路包括在输入/输出（I / O）焊盘位置处形成有开口的厚电介质层。 使用刮刀将焊膏沉积在开口中以形成填充有焊料的孔。 IC芯片在I / O焊盘位置处设有金柱凸起，并且这些凸块插入孔中以形成倒装芯片连接。 IC芯片经过测试和返工。 相同的凹凸/连接可用于连接细间距电缆。 提供模块封装层用于密封和电磁屏蔽。 还描述了刀片服务器或超级计算机实施例。