公开(公告)号：US20140157593A1

公开(公告)日：2014-06-12

申请号：US13753625

申请日：2013-01-30

Applicant: BRIDGE SEMICONDUCTOR CORPORATION

Inventor： Charles W.C. LIN ,  Chia Chung WANG

IPC: H05K3/30

CPC classification number: H05K3/30 ,  H01L24/19 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/73259 ,  H01L2224/8314 ,  H01L2224/92144 ,  H01L2924/12042 ,  H05K1/183 ,  H05K3/4644 ,  H05K2201/09781 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/2009 ,  H05K2203/1469 ,  H05K2203/167 ,  Y10T29/4913 ,  H01L2924/00

Abstract: The present invention relates to a method of making a hybrid wiring board with built-in stopper and interposer. In accordance with one preferred embodiment of the present invention, the method includes: forming a stopper on a dielectric layer; mounting an interposer on the dielectric layer using the stopper as a placement guide for the interposer; attaching a stiffener to the dielectric layer; and forming a build-up circuitry that covers the interposer, the stopper and the stiffener and provides signal routing for the interposer. Accordingly, the stopper can accurately confine the placement location of the interposer and avoid the electrical connection failure between the interposer and the build-up circuitry.

Abstract translation: 本发明涉及一种制造具有内置止动器和插入件的混合布线板的方法。 根据本发明的一个优选实施例，该方法包括：在电介质层上形成一个塞子; 使用所述塞子将所述介电层安装在所述介电层上作为所述插入件的放置引导件; 将加强件附接到介电层; 以及形成覆盖插入件，止动器和加强件并且为插入件提供信号路由的积聚电路。 因此，止动器可以精确地限制插入器的放置位置，并避免插入器和积聚电路之间的电连接故障。

公开(公告)号：US20140145317A1

公开(公告)日：2014-05-29

申请号：US14170900

申请日：2014-02-03

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Junichi NAKAMURA ,  Kotaro KODANI ,  Michiro OGAWA

IPC: H01L23/495

CPC classification number: H01L23/49544 ,  H01L23/49822 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0271 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/4682 ,  H05K2201/09136 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/2009 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A wiring board includes a wiring forming region in which a plurality of wiring layers are stacked while sandwiching insulating layers, an outer periphery region which is arranged around the wiring forming region and in which a reinforcing pattern is formed in the same layer as each of the wiring layers. An area ratio of the reinforcing pattern to the outer periphery region and an area ratio of the wiring layer to the wiring forming region are substantially the same in each of the layers, and the reinforcing patterns exist without a gap in the outer periphery region when the wiring board is viewed in planar perspective.

Abstract translation: 布线基板包括布线形成区域，其中堆叠多个布线层，同时夹着绝缘层;外周区域布置在布线形成区域周围，并且其中加强图案形成在与每个布线形成区域相同的层中 接线层。 增强图案与外周区域的面积比和布线层与布线形成区域的面积比在各层中基本相同，并且当外围区域中没有间隙时，增强图案在外周区域中不存在间隙 接线板以平面视角观看。

公开(公告)号：US20140138027A1

公开(公告)日：2014-05-22

申请号：US14086511

申请日：2013-11-21

Applicant: HAI SAN TEW

Inventor： HAI SAN TEW

IPC: H05K3/30 ,  F27D3/00 ,  B65G37/00

CPC classification number: H05K3/305 ,  B65G37/00 ,  H05K1/189 ,  H05K13/0061 ,  H05K2201/2009 ,  H05K2203/1105 ,  Y02P70/613

Abstract: A method of depositing one or more stiffener onto a wiring board includes the steps of engaging the wiring board onto a heat-retaining pallet to form an assembly, pre-heating the assembly to a temperature ranged from 70 to 140° C., and disposing the stiffeners onto the pre-heated wiring board of the assembly, wherein the pallet of the assembly retains sufficient heat for the wiring board to at least partially melt the stiffener, more preferably adhesive stiffener, to fix onto the wiring board upon disposition of the stiffeners.

Abstract translation: 将一个或多个加强件沉积到布线板上的方法包括以下步骤：将布线板接合到保温托盘上以形成组件，将组件预热至70至140℃的温度，并且布置 加强件到组件的预加热布线板上，其中组件的托盘保留足够的热量，用于布线板，以在加强件的处置时至少部分地熔化加强件，更优选粘合剂加强件，以固定到布线板上 。

公开(公告)号：US20140017935A1

公开(公告)日：2014-01-16

申请号：US13940262

申请日：2013-07-12

Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： DA-WEI XING ,  JUN CHEN ,  JERRY WU

IPC: H01R12/59 ,  H01B7/08

CPC classification number: H01R12/59 ,  H01B7/08 ,  H01R12/771 ,  H05K1/117 ,  H05K1/118 ,  H05K2201/2009

Abstract: A flexible flat cable assembly comprises: a flexible flat cable having two opposite top and bottom surfaces, and defining a plurality of golden fingers exposed out of the top surface; and a base attached to the bottom surface of the flexible flat cable and defining a protecting portion formed on a front end thereof to shield front ends of the plurality of golden fingers.

Abstract translation: 柔性扁平电缆组件包括：柔性扁平电缆，其具有两个相对的顶表面和底表面，并且限定暴露在顶表面之外的多个金手指; 以及基部，其附接到柔性扁平电缆的底表面并且限定形成在其前端上的保护部分，以屏蔽多个金手指的前端。

公开(公告)号：US20130307005A1

公开(公告)日：2013-11-21

申请号：US13837001

申请日：2013-03-15

Applicant: INNOLIGHT TECHNOLOGY (SUZHOU) LTD.

Inventor： Weilong LI ,  Yuzhou SUN ,  Pan WANG ,  Peng HUANG ,  Gaohong SHI ,  Sheng LIU

IPC: H01L31/0232 ,  H01L31/18 ,  H01L33/58

CPC classification number: H01L31/0232 ,  H01L31/18 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H05K1/189 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/2009 ,  H01L2924/00014

Abstract: A surface mount packaging structure for semiconductor optical device and packaging method. A semiconductor optical device, disposed on a substrate, is electrically connected with a substrate through wires. A lower surface of the substrate is fixed on an upper surface of a flexible printed board that is provided with internal leads and external leads. The internal leads are electrically connected with the substrate through wires. A lower surface of the flexible printed board is fixed on a base board. A glass baffle is provided to form a window in front of a light-emitting or light-receiving surface of the semiconductor optical device. A focusing lens is adhered to the window of the glass baffle and is coupled with an optical path of the semiconductor optical device. The substrate and the semiconductor optical device thereon, the wires, and the internal leads on the flexible printed board are encased into packaging material.

Abstract translation: 一种用于半导体光学器件的表面贴装封装结构和封装方法。 设置在基板上的半导体光学器件通过导线与基板电连接。 基板的下表面固定在设置有内部引线和外部引线的柔性印刷电路板的上表面上。 内部引线通过导线与基板电连接。 柔性印刷电路板的下表面固定在基板上。 提供玻璃挡板以在半导体光学器件的发光或光接收表面前面形成窗口。 聚焦透镜粘附到玻璃挡板的窗口上并与半导体光学器件的光路耦合。 其上的基板和半导体光学装置，电线以及柔性印刷电路板上的内部引线被包装在包装材料中。

公开(公告)号：US20130284483A1

公开(公告)日：2013-10-31

申请号：US13883499

申请日：2011-09-29

Applicant: Pascal Modock

Inventor： Pascal Modock

IPC: H01B7/08 ,  H05K3/32

CPC classification number: H01B7/08 ,  H01R12/62 ,  H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/32 ,  H05K2201/10053 ,  H05K2201/10189 ,  H05K2201/2009 ,  Y10T29/4913

Abstract: A flexible device for electrically connecting an electric component and a printed circuit board together includes a main extension direction, and the flexible electric-connection device includes a first contact region formed at one end of the flexible electric-connection device in the main extension direction, as well as a second contact region formed at the other end of the flexible electric-connection device in the main extension direction. The flexible electric-connection device includes a stiffener, or the flexible electric connection device is combined with a supporting element. The electric component is provided so as to be in direct electric contact with the flexible electric-connection device via the first contact region.

Abstract translation: 用于将电气部件和印刷电路板电连接在一起的柔性装置包括主延伸方向，并且柔性电连接装置包括形成在柔性电连接装置的主延伸方向的一端的第一接触区域， 以及形成在柔性电连接装置的主延伸方向的另一端的第二接触区域。 柔性电连接装置包括加强件，或者柔性电连接装置与支撑元件结合。 电气部件设置成经由第一接触区域与柔性电连接装置直接电接触。

公开(公告)号：US20130256022A1

公开(公告)日：2013-10-03

申请号：US13748182

申请日：2013-01-23

Applicant: FUJITSU LIMITED

Inventor： Hiroshi KOBAYASHI ,  Naoki ISHIKAWA ,  Satoshi EMOTO ,  Toru OKADA ,  Takumi MASUYAMA

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/068 ,  H05K2201/10734 ,  H05K2201/2009 ,  H01L2924/00012

Abstract: A wiring board assembly includes: a plurality of insulating substrates of which each includes an insulating layer and a wiring layer; a wiring board that includes pads formed on the insulating substrate; and a semiconductor component that is joined on the pads by using solder bumps. The wiring board embeds a stiffening member whose thickness is thinner than that of the insulating layer and whose thermal expansion coefficient is smaller and Young's modulus is higher than those of the wiring layer and the insulating layer.

Abstract translation: 布线基板组件包括：多个绝缘基板，每个绝缘基板包括绝缘层和布线层; 布线板，其包括形成在所述绝缘基板上的焊盘; 以及通过使用焊料凸块接合在焊盘上的半导体部件。 布线板嵌入厚度比绝缘层薄的加强构件，其热膨胀系数较小，杨氏模量高于布线层和绝缘层。

公开(公告)号：US20130242513A1

公开(公告)日：2013-09-19

申请号：US13891620

申请日：2013-05-10

Applicant: PANASONIC CORPORATION

Inventor： Kohei MASUDA ,  Osamu SHIBATA ,  Yoshiyuki SAITO

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0218 ,  H05K1/025 ,  H05K1/0277 ,  H05K1/0281 ,  H05K1/14 ,  H05K1/147 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10371 ,  H05K2201/2009 ,  H05K2201/2036

Abstract: An electronic device includes a conductor plate, a circuit board placed with a distance to a surface of the conductor plate, a connector provided on the circuit board, a flexible cable having one end connected to the connector and laid down along the surface of the conductor plate, and a cable holding member which includes a sloped holding surface for holding at least part of a portion of the flexible cable ranging from the connector to the surface of the conductor plate and which is electrically connected to the conductor plate.

Abstract translation: 电子设备包括导体板，与导体板的表面一定距离放置的电路板，设置在电路板上的连接器，柔性电缆，其一端连接到连接器并沿着导体的表面放置 板和电缆保持构件，其包括倾斜的保持表面，用于将柔性电缆的至少一部分从连接器保持到导体板的表面，并且电连接到导体板。

公开(公告)号：US08514581B2

公开(公告)日：2013-08-20

申请号：US12857463

申请日：2010-08-16

Applicant: Kenji Hasegawa

Inventor： Kenji Hasegawa

IPC: H05K1/00

CPC classification number: H05K1/189 ,  H05K3/0064 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: According to one embodiment, a flexible printed wiring board includes a component mounting portion to which a component is mounted and to which a reinforcing sheet is bonded. The component mounting portion includes an inner layer comprising a wiring pattern, and an outermost film layer disposed to cover the wiring pattern. The outermost film layer, to which the reinforcing sheet is bonded, is formed with a groove such that, when the reinforcing sheet is bonded, the groove extends in a region between the outermost film layer and the reinforcing sheet and communicates with an outside of the region.

Abstract translation: 根据一个实施例，柔性印刷线路板包括部件安装部分，部件安装到该部件安装部分上，并且加强板被粘合到该部件安装部分。 部件安装部分包括包括布线图案的内层和设置成覆盖布线图案的最外面的薄膜层。 形成加强片的最外层膜形成有槽，使得当加强板粘合时，槽在最外膜层和加强板之间的区域中延伸，并与 地区。

公开(公告)号：US08510939B2

公开(公告)日：2013-08-20

申请号：US11924696

申请日：2007-10-26

Applicant: Robert J. Greenberg ,  Matthew J. McMahon ,  James Singleton Little ,  Kelly H. McClure ,  Brian V. Mech ,  Neil Hamilton Talbot ,  Jordan M. Neysmith

Inventor： Robert J. Greenberg ,  Matthew J. McMahon ,  James Singleton Little ,  Kelly H. McClure ,  Brian V. Mech ,  Neil Hamilton Talbot ,  Jordan M. Neysmith

IPC: H01K3/22

CPC classification number: A61N1/36046 ,  A61N1/0543 ,  A61N1/37223 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/118 ,  H05K3/0014 ,  H05K3/28 ,  H05K2201/0133 ,  H05K2201/09018 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/302 ,  Y10T29/49158

Abstract: Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, and cortical stimulation, and many related purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. By applying the right amount of heat to a completed array, a curve can be induced. With a thermoplastic polymer it may be further advantageous to repeatedly heat the flexible circuit in multiple molds, each with a decreasing radius. Further, it is advantageous to add material along the edges. It is further advantageous to provide a fold or twist in the flexible circuit array. Additional material may be added inside and outside the fold to promote a good seal with tissue.

Abstract translation: 聚合物材料可用作神经刺激的电极阵列体。 它们特别有用于视网膜刺激以产生人造视觉，耳蜗刺激以产生人造听觉和皮质刺激以及许多相关目的。 通过电极阵列对视网膜或其他神经组织施加的压力是至关重要的。 太小的压力会导致电阻增加以及电场分散。 太大的压力可能会阻止血液流动。 通常的柔性电路制造技术通常需要使柔性电路电极阵列平坦。 由于神经组织几乎从不平坦，平面阵列必然会施加不均匀的压力。 此外，柔性电路聚合物阵列的边缘可以是尖锐的并切割精细的神经组织。 通过将适量的热应用于完整的阵列，可以引起曲线。 对于热塑性聚合物，可以进一步有利的是在多个模具中反复加热柔性电路，每个模具具有减小的半径。 此外，沿着边缘添加材料是有利的。 在柔性电路阵列中提供折叠或扭曲是更有利的。 可以在折叠内部和外部添加附加材料以促进与组织的良好密封。