公开(公告)号：US20180024411A1

公开(公告)日：2018-01-25

申请号：US15657222

申请日：2017-07-24

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Norikazu MIYAZAKI ,  Toru SUGAMATA

IPC: G02F1/225 ,  H05K1/11 ,  H05K1/02

CPC classification number: G02F1/2255 ,  G02F1/0121 ,  G02F2001/212 ,  H05K1/0206 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/113 ,  H05K1/118 ,  H05K3/306 ,  H05K3/363 ,  H05K2201/0338 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2201/09181 ,  H05K2201/09481 ,  H05K2201/10121

Abstract: An optical modulator including a flexible printed circuit performing an electrical connection with an external circuit substrate, in which the flexible printed circuit includes a plurality of first pads and the like provided on one surface of the flexible printed circuit along one side of the flexible printed circuit, a plurality of second pads and the like provided on the other surface of the flexible printed circuit at locations that respectively correspond to the plurality of first pads, and a plurality of metal films and the like provided at locations that respectively correspond to the first pads on a side surface of the flexible printed circuit along the one side of the flexible printed circuit.

公开(公告)号：US09812412B2

公开(公告)日：2017-11-07

申请号：US14980404

申请日：2015-12-28

Applicant: ROHM CO., LTD.

Inventor： Takuma Shimoichi ,  Yasuhiro Kondo

IPC: H01L23/66 ,  H01L49/02 ,  H01L27/01

CPC classification number: H01L23/66 ,  H01L27/016 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L2223/6672 ,  H01L2924/0002 ,  H05K1/0289 ,  H05K1/029 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/107 ,  H05K3/146 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/0376 ,  H05K2201/0391 ,  H05K2201/09263 ,  H05K2201/09981 ,  H05K2201/10181 ,  H05K2203/0353 ,  H05K2203/1338 ,  H01L2924/00

Abstract: A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.

公开(公告)号：US09807848B2

公开(公告)日：2017-10-31

申请号：US14792092

申请日：2015-07-06

Applicant: YISSUM RESEARCH DEVELOPMENT COMPANY OF THE HEBREW UNIVERSITY OF JERUSALEM, LTD.

Inventor： Shlomo Magdassi ,  Michael Grouchko ,  Michael Layani

IPC: H05B33/28 ,  H01B1/02 ,  H01B1/10 ,  H01L31/0224 ,  C23C4/18 ,  C23C26/00 ,  H01L31/18 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  C23C16/513 ,  B05D3/10 ,  B05D5/06 ,  B05D5/12 ,  H01L33/42 ,  H05K1/02 ,  H05K3/14

CPC classification number: H05B33/28 ,  B05D3/107 ,  B05D5/061 ,  B05D5/12 ,  C23C4/18 ,  C23C16/513 ,  C23C26/00 ,  H01B1/02 ,  H01B1/026 ,  H01B1/10 ,  H01L31/022466 ,  H01L31/1884 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2933/0016 ,  H05K1/0225 ,  H05K1/0278 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/095 ,  H05K1/097 ,  H05K3/125 ,  H05K3/14 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0302 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2201/0969 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/0545 ,  H05K2203/1173 ,  H05K2203/125 ,  Y02E10/50 ,  Y10T428/24273 ,  Y10T428/24331 ,  Y10T428/249978 ,  Y10T428/249979 ,  H01L2924/00

Abstract: The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

公开(公告)号：US09788437B2

公开(公告)日：2017-10-10

申请号：US14848517

申请日：2015-09-09

Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： Wei-Shuo Su

IPC: H05K1/09 ,  H05K3/24 ,  H05K3/10 ,  H05K3/42

CPC classification number: H05K3/244 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0154 ,  H05K2201/0338 ,  H05K2201/09736 ,  H05K2201/098 ,  H05K2203/0723 ,  H05K2203/1394

Abstract: The present disclosure relates to a method for manufacturing a printed circuit board. The method includes the steps as follows. First, a substrate including a base layer and a copper foil layer on a surface of the base layer is provided. Second, a conductive layer is formed on portions of the copper foil layer. Third, portions of the copper foil layer exposed from the conductive layer are removed by an etching process, and the conductive layer is thinner by the etching process. The reserved portions of the copper foil layer and the conductive layer form a conductive pattern to obtain a printed circuit board without plating wires. A printed circuit board without plating wires made by the above method is also provided.

公开(公告)号：US09736937B2

公开(公告)日：2017-08-15

申请号：US14443213

申请日：2014-10-30

Applicant: LG CHEM, LTD.

Inventor： Yong Chan Kim ,  Jin Hyong Lim ,  Ki-Hwan Kim ,  Junghwan Yoon ,  Ilha Lee

IPC: H01L31/00 ,  H05K1/09 ,  G06F3/041 ,  H01L31/18 ,  G06F1/16 ,  H01L31/0224 ,  H05K5/00 ,  H01B1/02 ,  H05K1/02 ,  H05K3/06 ,  H01L51/44

CPC classification number: H05K1/09 ,  G06F1/16 ,  G06F3/041 ,  H01B1/026 ,  H01L31/022433 ,  H01L31/022475 ,  H01L31/022483 ,  H01L31/1884 ,  H01L51/445 ,  H05K1/0274 ,  H05K1/0298 ,  H05K3/06 ,  H05K5/0017 ,  H05K2201/0108 ,  H05K2201/0338 ,  Y02E10/50

Abstract: The present application relates to a conductive film, a method for manufacturing the same, and a display device including the same.

公开(公告)号：US20170223828A1

公开(公告)日：2017-08-03

申请号：US15014096

申请日：2016-02-03

Applicant: THE BOEING COMPANY

Inventor： Minas H. Tanielian

IPC: H05K1/09 ,  H05K3/16 ,  C25D5/54 ,  H05K3/18 ,  C23C14/34 ,  H05K1/02 ,  H05K3/14

CPC classification number: H05K1/09 ,  C23C14/18 ,  C23C28/322 ,  C23C28/34 ,  C23C28/42 ,  C25D5/54 ,  H01B1/04 ,  H01B1/24 ,  H05K1/097 ,  H05K2201/0245 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2201/0379

Abstract: A method of forming a high-conductivity electrical interconnect on a substrate may include forming a graphene film with a plurality of graphene members, depositing a metal over the graphene film, and providing a metallic overlay that connects the plurality of graphene members together through the depositing operation to form a covered graphene film.

公开(公告)号：US20170169918A1

公开(公告)日：2017-06-15

申请号：US15220866

申请日：2016-07-27

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Chan Woo PARK ,  Jae Bon KOO ,  Bock Soon NA ,  Rae-Man PARK ,  Ji-Young OH ,  Sang Seok LEE ,  Soon-Won JUNG

IPC: H01B7/06 ,  H01B13/008

CPC classification number: H01B7/06 ,  H01B13/008 ,  H05K1/0283 ,  H05K3/007 ,  H05K3/107 ,  H05K3/20 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2203/016 ,  H05K2203/0568 ,  H05K2203/128

Abstract: Provided is a stretchable wire including: a stretchable solid-phase conductive structure; a stretchable insulation layer which surrounds the solid-phase conductive structure; and a liquid-phase conductive material layer disposed between the solid-phase conductive structure and the stretchable insulation layer, and in contact with the solid-phase conductive structure, and a method of fabricating the same.

公开(公告)号：US20170167713A1

公开(公告)日：2017-06-15

申请号：US15339033

申请日：2016-10-31

Applicant: LG ELECTRONICS INC.

Inventor： Jaepyo HONG ,  Jaechan KIM ,  Injoong KIM

IPC: F21V29/71 ,  F21V29/503 ,  F21V23/06 ,  F21V31/00 ,  F21V29/83 ,  F21S2/00 ,  F21V29/76

CPC classification number: F21V29/713 ,  F21S2/005 ,  F21V3/0625 ,  F21V23/06 ,  F21V29/503 ,  F21V29/74 ,  F21V29/763 ,  F21V29/83 ,  F21V31/00 ,  F21Y2115/10 ,  H01L33/64 ,  H01L33/647 ,  H05K1/0209 ,  H05K1/053 ,  H05K3/107 ,  H05K2201/0338 ,  H05K2201/10106 ,  H05K2201/10969 ,  H05K2203/1355

Abstract: A light source module includes at least one light source emitting light, and a body supporting the light source. The body includes a heat sink supporting the light source on a top surface thereof, an electrical insulating part provided on the heat sink, and a plating part provided on the insulating part. The plating part includes a contact heat dissipation part contacting a portion of a bottom surface of the light source to receive heat generated from the light source, and a diffusion heat dissipation part connected to the contact heat dissipation part for receiving heat from the contact heat dissipation part to discharge the heat to the heat sink. Accordingly, quick heat dissipation is performed.

公开(公告)号：US09648740B2

公开(公告)日：2017-05-09

申请号：US14502745

申请日：2014-09-30

Applicant: Honeywell Federal Manufacturing & Technologies, LLC

Inventor： Joseph Ambrose Wolf ,  Kenneth A. Peterson

IPC: H05K3/46 ,  H05K1/11

CPC classification number: H05K1/115 ,  H05K3/4629 ,  H05K2201/0338

Abstract: A ceramic substrate comprises a plurality of ceramic sheets, a plurality of inner conductive layers, a plurality of vias, and an upper conductive layer. The ceramic sheets are stacked one on top of another and include a top ceramic sheet. The inner conductive layers include electrically conductive material that forms electrically conductive features on an upper surface of each ceramic sheet excluding the top ceramic sheet. The vias are formed in each of the ceramic sheets with each via being filled with electrically conductive material. The upper conductive layer includes electrically conductive material that forms electrically conductive features on an upper surface of the top ceramic sheet. The upper conductive layer is constructed from a stack of four sublayers. A first sublayer is formed from titanium. A second sublayer is formed from copper. A third sublayer is formed from platinum. A fourth sublayer is formed from gold.

公开(公告)号：US20170042040A1

公开(公告)日：2017-02-09

申请号：US14819150

申请日：2015-08-05

Applicant: UYEMURA INTERNATIONAL CORPORATION

Inventor： JON E. BENGSTON

IPC: H05K3/18 ,  C23C18/16 ,  C23C18/44

CPC classification number: C23C18/44 ,  C23C18/1637 ,  C23C18/1651 ,  C23C18/54 ,  H05K1/09 ,  H05K1/118 ,  H05K3/187 ,  H05K3/244 ,  H05K2201/0338

Abstract: A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto copper. Use of such a solution produces a plated component comprising a copper surface and a palladium plated coating having a thickness of between 0.01 micrometers (μm) and 5 μm. A method for electroless plating of palladium onto a copper surface of a component includes preparing a bath having a palladium compound and a polyaminocarboxylic compound. The copper component is submerged in the bath to plate a palladium layer on the copper surface of the component. The component resulting from the plating method has a palladium layer plated on the copper surface.

Abstract translation: 已经发现包含钯化合物和聚氨基羧酸化合物的溶液适合作为用于在铜上无电镀钯的浴。 使用这种溶液产生包含铜表面和厚度在0.01微米（μm）和5μm之间的镀钯涂层的镀层组分。 在组分的铜表面上无电镀钯的方法包括制备具有钯化合物和多氨基羧酸化合物的浴。 将铜组分浸没在浴中以在组件的铜表面上镀钯层。 由镀覆方法得到的成分在铜表面上镀钯层。