Abstract:
In a memory module, a plurality of memories are mounted on a module base plate, impedance between Vref and Vss near each memory is coupled to Vss by a decoupling capacitor and a Vref plane to achieve low impedance configuration in a wide frequency range, Vref planes are individually provided for the respective memories, and the Vref planes are connected to each other by using a high impedance wire, or a high impedance chip part. Accordingly, a wiring technique for a module which allows effective reduction of self noise and propagation noise can be provided.
Abstract:
Input circuit ensuring a noise margin for a reference voltage. A semiconductor chip 11a comprises a pad 14 that inputs a reference voltage Vref, an input circuit 13, a resistance element R1 connected between an input terminal of the input circuit 13 and the pad 14, a capacitance element C1 connected between the input terminal of the input circuit 13 and a power supply VDD, and a capacitance element C2 connected between the input terminal of the input circuit 13 and a ground VSS within the semiconductor chip. A resistance value of the resistance element R1 is set based on an impedance characteristic of a network, for supplying the reference voltage Vref.
Abstract:
The present invention realizes high density mounting along with achieving power source sharing by a digital semiconductor element and an analog semiconductor element in a semiconductor device. An power layer for analog is connected to one end of an EBG layer, a power layer for digital is connected to the other end of the EBG layer, ground terminals for the respective elements are connected to a common ground layer, and a ground layer for separating the power layer for analog and the EBG layer from each other is disposed between the power layer for analog and the EBG layer. Thereby, high density mounting is achieved along with reducing interference of power source to an analog chip.
Abstract:
A motherboard for backplane buses is provided that reduces noise due to entry of external signals into signal wiring which interconnects modules, or noise due to any external signals entering a power supply after being routed around the power supply. An EBG pattern formed up of two wiring regions different from each other in impedance is periodically disposed in at least three arrays as part of the power supply layer(s) constituting a microstripline structure (one layer adjacent to a signal layer is a power supply layer, and the other layer-is interposed in air) or a stripline structure (both layers adjacent to a signal layer are power supply layers); the part of the power supply layer(s) not being involved in signal transmission between the modules on the motherboard for backplane buses.
Abstract:
In a memory module, a plurality of memories are mounted on a module base plate, impedance between Vref and Vss near each memory is coupled to Vss by a decoupling capacitor and a Vref plane to achieve low impedance configuration in a wide frequency range, Vref planes are individually provided for the respective memories, and the Vref planes are connected to each other by using a high impedance wire, or a high impedance chip part. Accordingly, a wiring technique for a module which allows effective reduction of self noise and propagation noise can be provided.
Abstract:
A printed board inspecting apparatus includes: an input unit for inputting a pulse from a first signal line; a receiving unit for receiving a voltage induced in a second signal line in response to the input pulse inputted; and a judging unit for judging whether or not a ratio between a voltage of the input pulse and the voltage induced in the second signal line is within a predetermined range. A check is made using a TDR method to determine whether or not the degree of coupling is within a range of specified values and a check is made to determine each of the voltage of the polarized RZ signal and the pulse width time is within a range of specified values to thereby inspect a printed board and a semiconductor chip constituting a bus using a directional coupler.
Abstract:
The number of steps for preparing a layout diagram of a circuit including a coupler, which is formed by arranging a main line and a stub line in parallel with each other, is reduced. A circuit diagram editor 1902 arranges a coupler symbol 100 stored in a component symbol storage section 1904 when the coupler is arranged in preparing a circuit diagram. A layout section 1935 of a layout diagram editor 1922 layouts two wirings constituting the coupler by use of circuit diagram information and coupler information in which a coupler length and a coupler interval are defined. An object extraction section 1937 of a wiring check section 1936 extracts components and wirings from the layout diagram, and passes these to a wiring checker 1938. At this time, the coupler is passed to the wiring checker as one component that cannot be decomposed no more. Therefore, an interval between two wirings constituting the coupler is not checked.
Abstract:
Conventionally, wiring length occupied by a directional coupler decides intervals between modules connected to a bus, and those intervals can not be shortened furthermore. Accordingly, the intervals between modules are wide and high-density mounting is not possible. In the present invention, a directional coupler in a memory bus is formed by a leader line from a controller and a leader line from a memory chip and contained within a memory module. Accordingly, pitch between the modules can be reduced and high-density mounting can be realized.
Abstract:
In each of the information processing apparatuses connected to each other via a network, there is arranged a quality of service (QOS) table to which functions and performance thereof are registered. When an information processing apparatus is additionally linked with the network, a QOS table thereof is automatically registered to a local directory of the network such that an agent converts the contents of the QOS table into service information to be supplied via a user interface to the user. Thanks to the operation, information of functions and performance of each information processing apparatus connected to the network is converted into service information for the user. Consequently, the user can much more directly receive necessary services.
Abstract:
A plurality of processor elements (31 to 34) are disposed on a main board (710) in line in parallel with a first edge of the main substrate (710). Expansion board slots (331 to 336) into which an expansion board for mounting an I/O interface thereon is plugged and a memory connector (341) to which a memory board for mounting a memory thereon is connected are disposed in a region of the main substrate opposite to the first edge. The long sides of the expansion board slots (331 to 336) and the memory board connector (341) are in parallel with the first edge. A bridge LSI for executing protocol conversion between processor buses (210, 211, 212) and an I/O bus (230) and memory controllers (151, 152) for controlling memory access are disposed in regions adjacent to both the expansion board slots and the processor elements. The processor bus (210, 211, 212) is bent into a protuberance shape so that a branch does not substantially form and the bridge LSI and memory controller are substantially at the middle portion of a plurality of processors. The processor bus connects the processor elements, the bridge LSI and the memory controller in this order.