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    BALL GRID ARRAY CARD EDGE CONNECTOR
    21.
    发明申请
    BALL GRID ARRAY CARD EDGE CONNECTOR 有权

    公开(公告)号：US20210203094A1

    公开(公告)日：2021-07-01

    申请号：US17202961

    申请日：2021-03-16

    Applicant: Intel Corporation

    Inventor： Xiang Li ,  Mo Liu ,  Shaohua Li ,  Jingbo Li ,  Kai Xiao

    IPC: H01R12/73 ,  H01R12/57 ,  H01R12/72 ,  H01R13/26 ,  H05K1/18

    Abstract: In one embodiment, a card edge connector includes: a housing having an opening into which a first circuit board is to be inserted; a plurality of pins each having a first end and a second end, the plurality of pins extending from within the opening through a bottom surface of the housing, the first end of the first plurality of pins to mate with a corresponding contact of the first circuit board; and a plurality of ball grid array (BGA) solder balls each adapted at the second end of a corresponding one of the plurality of pins, the plurality of pins to mate with a corresponding conductive area of a second circuit board to which the card edge connector mates via the plurality of BGA solder balls. Other embodiments are described and claimed.

    Memory device with insertable portion
    23.
    发明授权
    Memory device with insertable portion 有权

    公开(公告)号：US10342132B2

    公开(公告)日：2019-07-02

    申请号：US15839419

    申请日：2017-12-12

    Applicant: INTEL CORPORATION

    Inventor： Xiang Li ,  George Vergis ,  Slobodan Mrdjan

    IPC: H05K7/00 ,  H05K5/00 ,  H05K1/14 ,  H05K1/02 ,  H05K3/46 ,  H01R12/70 ,  H01R12/55 ,  H01R12/52 ,  H01R12/73

    Abstract: Embodiments of the present disclosure are directed towards a memory device insertable into a PCB, e.g., a motherboard of a computing device. In some embodiments, the memory device may include a first PCB having a first thickness, to house one or more memory modules disposed on at least one side of the first PCB. The memory device may further include a layer having a second thickness, which may be attached to the side of the first PCB in an area that is proximate to an edge of the first PCB, to form a memory device portion that may be insertable into a connector slot disposed on a second PCB. The insertable portion may have a thickness that comprises the first and second thicknesses, to fit into the connector slot of the second PCB. Other embodiments may be described and/or claimed.

    Connector design for high density platforms
    24.
    发明授权
    Connector design for high density platforms 有权

    公开(公告)号：US10305207B2

    公开(公告)日：2019-05-28

    申请号：US15622001

    申请日：2017-06-13

    Applicant: INTEL CORPORATION

    Inventor： Xiang Li ,  George Vergis

    IPC: H01R12/73 ,  H01R12/72 ,  H01R43/20 ,  H01R12/50 ,  H01R13/64

    Abstract: A surface mount connector includes a housing including inner surfaces surrounding a card edge region, and outer surfaces defining an exterior region. The connector also includes a recess in at least one of the outer surfaces, the recess sized to accept a removably engageable arm therein. The connector also defines a cross-sectional width that is smaller in the recess than at a position adjacent to the recess. Other embodiments are described and claimed.

    SHIELDED HIGH DENSITY CARD CONNECTOR
    26.
    发明申请
    SHIELDED HIGH DENSITY CARD CONNECTOR 有权

    公开(公告)号：US20170271818A1

    公开(公告)日：2017-09-21

    申请号：US15074094

    申请日：2016-03-18

    Applicant: Intel Corporation

    Inventor： John M. Lynch ,  Chong Richard Zhao ,  Xiang Li ,  Donald T. Tran

    IPC: H01R13/6461 ,  H01R12/75 ,  H01R12/73

    CPC classification number: H01R13/6461 ,  H01R12/72 ,  H01R12/721 ,  H01R12/73 ,  H01R12/737 ,  H01R12/75 ,  H01R13/658 ,  H01R13/6585 ,  H01R13/6586 ,  H01R23/6873

    Abstract: An example electronic assembly for securing an electronic card. In some forms, the electronic assembly further includes a printed circuit board. The electronic assembly includes a housing having a first set of electrical contacts and a second set of electrical contacts. The housing is configured to receive the electronic card between the first and second set of electrical contacts. The housing further includes a third set of electrical contacts and a fourth set of electrical contacts. The housing is configured to receive the electronic card between the third and fourth set of electrical contacts. A ground shield is positioned between at least one of the first and third set of electrical contacts and the second and fourth set of electrical contacts. In some forms, the ground shield may be positioned between both the first and third set of electrical contacts and the second and fourth set of electrical contacts.

    Dual in-line memory module (DIMM) socket that prevents improper DIMM release
    28.
    发明授权
    Dual in-line memory module (DIMM) socket that prevents improper DIMM release 有权

    公开(公告)号：US12300931B2

    公开(公告)日：2025-05-13

    申请号：US17352211

    申请日：2021-06-18

    Applicant: Intel Corporation

    Inventor： Xiang Li ,  George Vergis

    IPC: H01R13/633 ,  H01R12/73 ,  H01R13/635

    Abstract: An apparatus is described. The apparatus includes a dual-in line memory module (DIMM) socket having a first latch and a second latch. One of the first latch and the second latch having a feature for a user to apply force to release a DIMM from the DIMM socket. The other of the first latch and the second latch not having a feature for the user to apply force so that one end of the DIMM releases before an opposite end of the DIMM during release of the DIMM from the DIMM socket.

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