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公开(公告)号：US09630831B1
公开(公告)日：2017-04-25
申请号：US14883908
申请日：2015-10-15
Inventor： Jung-Huei Peng , Chia-Hua Chu , Fei-Lung Lai , Shiang-Chi Lin
CPC classification number: B81C1/00238 , B81B7/0038 , B81B2201/0235 , B81B2201/0242 , B81B2203/0127 , B81B2203/0315 , B81B2203/04 , B81B2207/012 , B81C1/00285 , B81C2201/0125 , B81C2201/0154 , B81C2201/019 , B81C2203/0118 , B81C2203/035 , B81C2203/0792
Abstract: The present disclosure provides a CMOS structure, including a substrate, a metallization layer over the substrate, a sensing structure over the metallization layer, and a signal transmitting structure adjacent to the sensing structure. The sensing structure includes an outgassing layer over the metallization layer, a patterned outgassing barrier over the outgassing layer; and an electrode over the patterned outgassing barrier. The signal transmitting structure electrically couples the electrode and the metallization layer.
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公开(公告)号：US09287075B2
公开(公告)日：2016-03-15
申请号：US14670671
申请日：2015-03-27
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Stephen E. Luce , Anthony K. Stamper
CPC classification number: B81C1/00698 , B81C1/0015 , B81C1/00166 , B81C1/00523 , B81C2201/0132 , B81C2201/0133 , B81C2201/0145 , B81C2201/0154 , B81C2203/0145 , H01H1/0036 , H01H1/58 , H01H11/00 , H01H49/00 , H01H59/00 , H01H59/0009 , H01H2059/0018 , Y10T29/49105
Abstract: MEMS switches and methods of manufacturing MEMS switches is provided. The MEMS switch having at least two cantilevered electrodes having ends which overlap and which are structured and operable to contact one another upon an application of a voltage by at least one fixed electrode.
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公开(公告)号：US20160035511A1
公开(公告)日：2016-02-04
申请号：US14883825
申请日：2015-10-15
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Stephen E. LUCE , Anthony K. STAMPER
CPC classification number: B81C1/00698 , B81C1/0015 , B81C1/00166 , B81C1/00523 , B81C2201/0132 , B81C2201/0133 , B81C2201/0145 , B81C2201/0154 , B81C2203/0145 , H01H1/0036 , H01H1/58 , H01H11/00 , H01H49/00 , H01H59/00 , H01H59/0009 , H01H2059/0018 , Y10T29/49105
Abstract: MEMS switches and methods of manufacturing MEMS switches is provided. The MEMS switch having at least two cantilevered electrodes having ends which overlap and which are structured and operable to contact one another upon an application of a voltage by at least one fixed electrode.
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24.发明授权公开(公告)号：US09019049B2
公开(公告)日：2015-04-28
申请号：US13826070
申请日：2013-03-14
Applicant: International Business Machines Corporation
Inventor： Stephen E. Luce , Anthony K. Stamper
CPC classification number: B81C1/00698 , B81C1/0015 , B81C1/00166 , B81C1/00523 , B81C2201/0132 , B81C2201/0133 , B81C2201/0145 , B81C2201/0154 , B81C2203/0145 , H01H1/0036 , H01H1/58 , H01H11/00 , H01H49/00 , H01H59/00 , H01H59/0009 , H01H2059/0018 , Y10T29/49105
Abstract: MEMS switches and methods of manufacturing MEMS switches is provided. The MEMS switch having at least two cantilevered electrodes having ends which overlap and which are structured and operable to contact one another upon an application of a voltage by at least one fixed electrode.
Abstract translation: 提供MEMS开关和制造MEMS开关的方法。 所述MEMS开关具有至少两个悬臂电极，所述至少两个悬臂电极具有重叠的端部，并且在被至少一个固定电极施加电压时被构造和可操作以彼此接触。
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公开(公告)号：US08961853B2
公开(公告)日：2015-02-24
申请号：US13375361
申请日：2010-06-04
Applicant: Chad A. Mirkin , Wooyoung Shim , Adam B. Braunschweig , Xing Liao , Jinan Chai , Jong Kuk Lim , Gengfeng Zheng , Zijian Zheng
Inventor： Chad A. Mirkin , Wooyoung Shim , Adam B. Braunschweig , Xing Liao , Jinan Chai , Jong Kuk Lim , Gengfeng Zheng , Zijian Zheng
CPC classification number: G03F7/0002 , B81B2203/0361 , B81B2207/056 , B81C1/00111 , B81C1/0046 , B81C2201/0154 , B81C2201/0185 , B82Y10/00 , B82Y40/00 , Y10S977/732
Abstract: Disclosed are methods of lithography using a tip array having a plurality of pens attached to a backing layer, where the tips can comprise a metal, metalloid, and/or semi-conducting material, and the backing layer can comprise an elastomeric polymer. The tip array can be used to perform a lithography process in which the tips are coated with an ink (e.g., a patterning composition) that is deposited onto a substrate upon contact of the tip with the substrate surface. The tips can be easily leveled onto a substrate and the leveling can be monitored optically by a change in light reflection of the backing layer and/or near the vicinity of the tips upon contact of the tip to the substrate surface.
Abstract translation: 公开了使用具有连接到背衬层的多个笔的尖端阵列的光刻方法，其中尖端可以包括金属，准金属和/或半导电材料，并且背衬层可以包括弹性体聚合物。 尖端阵列可用于执行光刻工艺，其中尖端涂覆有当尖端与衬底表面接触时沉积到衬底上的油墨（例如，图案化组合物）。 尖端可以容易地平整到基底上，并且可以通过背衬层的光反射的变化和/或在尖端与基底表面接触时靠近尖端附近来光学地监测流平。
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Patent Agency Ranking
公开(公告)号：US08187480B2
公开(公告)日：2012-05-29
申请号：US12270511
申请日：2008-11-13
Applicant: Kim Yang Lee , David S. Kuo , Dorothea Buechel , Kalman Pelhos
Inventor： Kim Yang Lee , David S. Kuo , Dorothea Buechel , Kalman Pelhos
IPC: B44C1/22
CPC classification number: G11B5/855 , B81C1/00111 , B81C2201/0154 , B81C2201/038 , Y10T428/2457 , Y10T428/26
Abstract: Methods comprising providing a pre-patterned substrate having an array of thick walls, depositing a conforming layer on the pre-patterned substrate, etching the conforming layer from the top of the thick walls and the space between the walls, and etching the thick walls while leaving thin walls of conforming layer.
Abstract translation: 方法包括提供具有厚壁阵列的预图案化衬底，在预图案化衬底上沉积合适层，从厚壁的顶部和壁之间的空间蚀刻适形层，并蚀刻厚壁，同时 留下薄壁的合格层。
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公开(公告)号：US07998330B2
公开(公告)日：2011-08-16
申请号：US12122967
申请日：2008-05-19
Applicant: Nicholas X. Fang , Placid M. Ferreira , Keng Hao Hsu , Peter Lee Schultz , Kyle E. Jacobs , Anil Kumar
Inventor： Nicholas X. Fang , Placid M. Ferreira , Keng Hao Hsu , Peter Lee Schultz , Kyle E. Jacobs , Anil Kumar
CPC classification number: B23H3/00 , B23H3/04 , B81C1/0046 , B81C2201/0154 , C25D1/00 , C25D1/006 , C25D5/02 , C25D11/22 , C25D17/007 , G01Q80/00 , H01L21/32134 , H05K3/07 , H05K2203/0108 , H05K2203/0117
Abstract: Disclosed herein are electrochemical fabrication platforms for making structures, arrays of structures and functional devices having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods, systems and system components use an electrochemical stamping tool such as solid state polymeric electrolytes for generating patterns of relief and/or recessed features exhibiting excellent reproducibility, pattern fidelity and resolution on surfaces of solid state ionic conductors and in metal. Electrochemical stamping tools are capable high throughput patterning of large substrate areas, are compatible with commercially attractive manufacturing pathways to access a range of functional systems and devices including nano- and micro-electromechanical systems, sensors, energy storage devices, metal masks for printing, interconnects, and integrated electronic circuits.
Abstract translation: 本文公开了用于制造具有选定的纳米尺寸和/或微尺寸物理尺寸，形状和空间取向的结构，结构阵列和功能装置的电化学制造平台。 方法，系统和系统组件使用电化学冲压工具，例如固态聚合物电解质，用于产生在固态离子导体和金属表面上显示出优异的再现性，图案保真度和分辨率的浮雕和/或凹陷特征图案。 电化学冲压工具能够对大衬底区域进行高通量图案化，与商业上有吸引力的制造途径兼容，以访问一系列功能系统和设备，包括纳米和微机电系统，传感器，能量存储设备，印刷用金属掩模，互连 ，和集成电子电路。
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公开(公告)号：US20230365396A1
公开(公告)日：2023-11-16
申请号：US18142373
申请日：2023-05-02
Applicant: TDK CORPORATION
Inventor： Toyotaka KOBAYASHI
CPC classification number: B81B3/0021 , B81C1/00158 , B81B2201/0257 , B81B2203/0315 , B81B2203/0353 , B81B2207/015 , B81C2201/0154 , B81C2201/0159
Abstract: Disclosed herein is a MEMS sensor package that includes a substrate, an annular-shaped first dry film pattern stuck to one surface of the substrate, and a MEMS sensor chip including a tubular support and a detection part which is supported on the support so as to overlap a cavity of the support. The MEMS sensor chip is fixed to the substrate by sticking an annular mounting surface of the support to the first dry film pattern.
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公开(公告)号：US20180362335A1
公开(公告)日：2018-12-20
申请号：US16058897
申请日：2018-08-08
Inventor： JUNG-HUEI PENG , CHIA-HUA CHU , FEI-LUNG LAI , SHIANG-CHI LIN
CPC classification number: B81C1/00238 , B81B7/0038 , B81B2201/0235 , B81B2201/0242 , B81B2203/0127 , B81B2203/0315 , B81B2203/04 , B81B2207/012 , B81C1/00285 , B81C2201/0125 , B81C2201/0154 , B81C2201/019 , B81C2203/0118 , B81C2203/035 , B81C2203/0792
Abstract: The present disclosure provides a CMOS structure, including a substrate, a metallization layer over the substrate, a sensing structure over the metallization layer, and a signal transmitting structure adjacent to the sensing structure. The sensing structure includes an outgassing layer over the metallization layer, a patterned outgassing barrier over the outgassing layer; and an electrode over the patterned outgassing barrier. The signal transmitting structure electrically couples the electrode and the metallization layer.
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公开(公告)号：US20170107099A1
公开(公告)日：2017-04-20
申请号：US14883908
申请日：2015-10-15
Inventor： JUNG-HUEI PENG , CHIA-HUA CHU , FEI-LUNG LAI , SHIANG-CHI LIN
CPC classification number: B81C1/00238 , B81B7/0038 , B81B2201/0235 , B81B2201/0242 , B81B2203/0127 , B81B2203/0315 , B81B2203/04 , B81B2207/012 , B81C1/00285 , B81C2201/0125 , B81C2201/0154 , B81C2201/019 , B81C2203/0118 , B81C2203/035 , B81C2203/0792
Abstract: The present disclosure provides a CMOS structure, including a substrate, a metallization layer over the substrate, a sensing structure over the metallization layer, and a signal transmitting structure adjacent to the sensing structure. The sensing structure includes an outgassing layer over the metallization layer, a patterned outgassing barrier over the outgassing layer; and an electrode over the patterned outgassing barrier. The signal transmitting structure electrically couples the electrode and the metallization layer.
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