公开(公告)号：US08659371B2

公开(公告)日：2014-02-25

申请号：US12713946

申请日：2010-02-26

Applicant: Daniel L. Fonataine ,  David Sherrer

Inventor： Daniel L. Fonataine ,  David Sherrer

IPC: H01P3/06

CPC classification number: H01P3/06 ,  H01P3/087 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0298 ,  H05K2201/0116

Abstract: A system is provided for three dimensional coaxial transmission of signals in a micro-machined component, the system having, a micro-machined component matrix with a first metallic sheet having a plurality of first access holes disposed therein; a second metallic sheet having a plurality of second access holes disposed therein; a plurality of metal posts disposed between the first and second metallic sheets such that the metallic sheets are maintained at a desired distance; walls defining a coaxial transmission channel; and a coaxial transmission core disposed within the channel.

Abstract translation: 提供了一种用于微加工部件中的信号的三维同轴传输的系统，该系统具有：微加工部件矩阵，其具有设置在其中的多个第一进入孔的第一金属片; 第二金属片，其中设置有多个第二进入孔; 设置在第一和第二金属片之间的多个金属柱，使得金属片保持在期望的距离; 定义同轴传输通道的墙壁; 以及设置在通道内的同轴传动芯。

公开(公告)号：US08578599B2

公开(公告)日：2013-11-12

申请号：US13053417

申请日：2011-03-22

Applicant: Michael S. Kuszaj

Inventor： Michael S. Kuszaj

IPC: H05K3/02

CPC classification number: H05K1/0313 ,  H05K2201/0116 ,  H05K2201/2018 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/249953 ,  Y10T428/249982

Abstract: A method of making a supported foam circuit laminate comprises fitting a dielectric foam substrate having a shape defined by edges to a support frame having a thickness, an inner rim and an outer rim, wherein the edges of the dielectric foam substrate are flush with the inner rim of the support frame, and the dielectric foam substrate has a thickness that is greater than the thickness of the support frame; disposing an electrically conductive layer onto a side of the dielectric foam substrate and the support frame, wherein the edges of the electrically conductive layer overlap the inner rim of the support frame; and co-laminating the electrically conductive layer to the dielectric foam substrate and the overlapped support frame under heat and pressure to provide a supported foam circuit laminate.

Abstract translation: 制造支撑泡沫电路层压体的方法包括将具有由边缘限定的形状的电介质泡沫基材装配到具有厚度，内缘和外缘的支撑框架，其中电介质泡沫基底的边缘与内部 支撑框架的边缘，并且电介质泡沫基板具有大于支撑框架的厚度的厚度; 将导电层设置在电介质泡沫衬底和支撑框架的侧面上，其中导电层的边缘与支撑框架的内边缘重叠; 并且在热和压力下将导电层共同层叠到电介质泡沫衬底和重叠的支撑框架，以提供支撑的泡沫电路层压体。

公开(公告)号：US08529780B2

公开(公告)日：2013-09-10

申请号：US12562396

申请日：2009-09-18

Applicant: Dieter Schwanke ,  Mirco Harnack ,  Achim Bittner ,  Ulrich Schmid

Inventor： Dieter Schwanke ,  Mirco Harnack ,  Achim Bittner ,  Ulrich Schmid

IPC: B31D3/00

CPC classification number: C03C15/00 ,  C03C17/02 ,  C03C17/28 ,  C03C17/34 ,  C03C17/38 ,  C03C2218/113 ,  C03C2218/116 ,  C03C2218/119 ,  C03C2218/31 ,  C04B41/009 ,  C04B41/52 ,  C04B41/89 ,  C04B2111/00844 ,  H01Q1/38 ,  H05K1/024 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2203/1147 ,  C04B41/4582 ,  C04B41/5023 ,  C04B41/5353 ,  C04B41/4539 ,  C04B41/5022 ,  C04B41/4537 ,  C04B41/522 ,  C04B41/488 ,  C04B35/00

Abstract: The invention relates to a ceramic substrate material having a first layer having a cavity structure formed therein, and at least one sealing layer situated on at least a part of the cavity structure. The first layer comprises at least one first component made of a crystalline ceramic material and/or a glass material as a matrix, the first layer containing a second component made of a further crystalline ceramic material, with selected mantle areas of the crystals and/or crystal agglomerates of the second component being etched out in such a way that the cavity structure is provided (preferably in the form of a pore and/or tube structure). The sealing layer seals the surface of the first layer in the areas on which it is situated (e.g., above the cavity structure), allowing application of thin-film structures to the cavity structure.

Abstract translation: 本发明涉及一种具有形成在其中的腔结构的第一层和位于空腔结构的至少一部分上的至少一个密封层的陶瓷衬底材料。 第一层包括由结晶陶瓷材料和/或作为基质的玻璃材料制成的至少一个第一部件，所述第一层包含由另外的结晶陶瓷材料制成的第二部件，其中所选择的晶体和/或 蚀刻第二部件的晶体聚集体，使得提供空腔结构（优选以孔和/或管结构的形式）。 密封层在其所在的区域（例如，空腔结构之上）密封第一层的表面，允许将薄膜结构施加到空腔结构。

公开(公告)号：US20130143030A1

公开(公告)日：2013-06-06

申请号：US13692834

申请日：2012-12-03

Applicant: c/o Samsung Electro-Mechanics Co., Ltd.

Inventor： Yoon Shik KIM

IPC: C09D163/00

CPC classification number: C09D163/00 ,  C08J9/42 ,  C08J2363/00 ,  C08J2363/02 ,  C08L63/00 ,  H01B3/40 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0116 ,  H05K2201/0209 ,  Y10T428/249994

Abstract: Disclosed herein are a prepreg including an insulating resin composition impregnated into a porous support, and a printed circuit board including the same as an insulating layer. According to the present invention, the porous support used for impregnation of the insulating resin composition has excellent thermal stability and wide surface area, a coefficient of thermal expansion (CTE) of the porous support is not changed according to directivity, and the prepreg has a structure in which fillers included in the insulating resin composition are dispersed between the porous supports, such that the CTE may be efficiently improved. In addition, although damage is generated from the outside, the damage is not enlarged due to adjacent porous supports but is only locally generated and physical properties for pressure load is excellent due to the porous structure, such that damage of the printed circuit board may be reduced.

Abstract translation: 本文公开了一种预浸料，其包括浸渍到多孔载体中的绝缘树脂组合物，以及包含其作为绝缘层的印刷电路板。 根据本发明，用于浸渍绝缘树脂组合物的多孔载体具有优异的热稳定性和宽的表面积，多孔载体的热膨胀系数（CTE）根据方向性没有改变，并且预浸料具有 包含在绝缘树脂组合物中的填料分散在多孔载体之间的结构，使得可以有效地提高CTE。 此外，虽然从外部产生损伤，但是由于相邻的多孔载体而导致的损伤不会扩大，而是仅局部产生，并且由于多孔结构，压力负载的物理性能优异，使得印刷电路板的损坏可能 减少

公开(公告)号：US08419924B2

公开(公告)日：2013-04-16

申请号：US12827343

申请日：2010-06-30

Applicant: Toru Nakai ,  Liyi Chen

Inventor： Toru Nakai ,  Liyi Chen

IPC: C25F3/14 ,  C25D11/02

CPC classification number: C25D1/04 ,  C25D5/022 ,  C25D11/02 ,  C25D11/026 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/244 ,  H05K3/3484 ,  H05K3/4038 ,  H05K3/4605 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2203/0315 ,  H05K2203/043 ,  H05K2203/1142 ,  H05K2203/1147

Abstract: [Subject Matter] To provide a method for manufacturing a wiring substrate where rigidity is enhanced in an insulative portion made by oxidizing aluminum.[Solution(s)] Aluminum oxide insulative portion 24 is formed on aluminum plate 20 as shown in FIG. 1(A) through anodic oxidation (FIG. 1(C)). Then, holes (nano-holes) (24h) in aluminum oxide 24 are filled with resin 30 (FIG. 1(E)). Accordingly, the rigidity (strength) of insulative portion 24 will be enhanced and cracking will not occur during heat cycles. Also, the insulation reliability of aluminum oxide will increase, and short circuiting may be prevented at through holes 26 (aluminum portions) separated by aluminum oxide 24.

Abstract translation: [主题]提供一种制造在通过氧化铝制成的绝缘部分中提高刚性的布线基板的方法。 [解决方案]如图1所示，在铝板20上形成氧化铝绝缘部24。 1（A）通过阳极氧化（图1（C））。 然后，在树脂30中填充氧化铝24中的孔（纳米孔）（24小时）（图1（E））。 因此，绝缘部24的刚性（强度）提高，并且在热循环期间不会发生开裂。 此外，氧化铝的绝缘可靠性将增加，并且可以防止由氧化铝24分离的通孔26（铝部分）的短路。

公开(公告)号：US08318032B2

公开(公告)日：2012-11-27

申请号：US11962164

申请日：2007-12-21

Applicant: John B. Szczech ,  Daniel R. Gamota ,  Tomasz L. Klosowiak ,  Jerzy Wielgus

Inventor： John B. Szczech ,  Daniel R. Gamota ,  Tomasz L. Klosowiak ,  Jerzy Wielgus

IPC: B44C1/22

CPC classification number: H05K3/027 ,  H05K1/0393 ,  H05K3/16 ,  H05K2201/0116 ,  H05K2201/0317 ,  H05K2201/10113 ,  H05K2203/0557 ,  H05K2203/056

Abstract: A method for delineating a metallization pattern in a layer of sputtered aluminum or sputtered copper using a broad spectrum high intensity light source. The metal is deposited on a polymeric substrate by sputtering, so that it has a porous nanostructure. An opaque mask that is a positive representation of the desired metallization pattern is then situated over the metallization layer, exposing those portions of the metallization layer intended to be removed. The masked metallization layer is then exposed to a rapid burst of high intensity visible light from an arc source sufficient to cause complete removal of the exposed portions of the metallization layer, exposing the underlying substrate and creating the delineated pattern.

Abstract translation: 使用广谱高强度光源描绘溅射铝或溅射铜层中的金属化图案的方法。 通过溅射将金属沉积在聚合物基底上，使其具有多孔纳米结构。 然后将作为所需金属化图案的正表示的不透明掩模放置在金属化层上方，暴露预期要去除的金属化层的那些部分。 掩蔽的金属化层然后暴露于来自电弧源的高强度可见光的快速爆发，足以引起金属化层的暴露部分的完全去除，暴露下面的衬底并产生描绘图案。

公开(公告)号：US20120273034A1

公开(公告)日：2012-11-01

申请号：US13520115

申请日：2011-02-02

Applicant: Keigo Sato ,  Ryuichi Nakayama ,  Shigenori Yuya ,  Atsushi Mukai ,  Shinya Suzuki ,  Youta Miyashita

Inventor： Keigo Sato ,  Ryuichi Nakayama ,  Shigenori Yuya ,  Atsushi Mukai ,  Shinya Suzuki ,  Youta Miyashita

IPC: H01L21/31 ,  H01L33/44 ,  C25D5/00 ,  H01L31/02 ,  B32B15/01 ,  H05K3/00 ,  H05K7/04 ,  F21V21/00

CPC classification number: H01L31/0392 ,  C25D11/04 ,  C25D11/08 ,  C25D11/10 ,  C25D11/18 ,  H01L31/03926 ,  H05K1/053 ,  H05K2201/0116 ,  H05K2203/0315 ,  Y02E10/50 ,  Y10T29/49155 ,  Y10T428/12479

Abstract: A metal substrate with an insulation layer includes a metal substrate having at least an aluminum base and an insulation layer formed on said aluminum base of said metal substrate. The insulation layer is a porous type anodized film of aluminum. The anodized film includes a barrier layer portion and a porous layer portion, and at least the porous layer portion has compressive strain at room temperature. a magnitude of the strain ranges from 0.005% to 0.25%. The anodized film has a thickness of 3 micrometers to 20 micrometers.

Abstract translation: 具有绝缘层的金属基板包括至少具有铝基底的金属基底和形成在所述金属基底的所述铝基底上的绝缘层。 绝缘层是铝的多孔型阳极氧化膜。 阳极氧化膜包括阻挡层部分和多孔层部分，并且至少多孔层部分在室温下具有压缩应变。 应变的大小范围为0.005％至0.25％。 阳极氧化膜的厚度为3微米至20微米。

公开(公告)号：US08294040B2

公开(公告)日：2012-10-23

申请号：US12224180

申请日：2007-02-16

Applicant: Kiyoshi Shimizu ,  Yo Yamato

Inventor： Kiyoshi Shimizu ,  Yo Yamato

IPC: H05K1/11

CPC classification number: H05K1/036 ,  B32B5/18 ,  B32B15/08 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/12 ,  H05K3/185 ,  H05K2201/0116 ,  Y10T29/49155 ,  Y10T428/24331 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/249979

Abstract: [Object] To provide a multilayer assembly that excels in pore properties, is flexible, and is satisfactorily handled and processed; and a method of producing the multilayer assembly.[Solving Means] A multilayer assembly includes a base and, arranged on at least one side thereof, a porous layer and has a large number of continuous micropores with an average pore diameter of 0.01 to 10 μm. The multilayer assembly suffers from no interfacial delamination between the base and the porous layer when examined in a tape peeling test according to the following procedure: Tape Peeling Test A 24-mm wide masking tape [Film Masking Tape No. 603 (#25)] supplied by Teraoka Seisakusho Co., Ltd. is applied to a surface of the porous layer of the multilayer assembly and press-bonded thereto with a roller having a diameter of 30 mm and a load of 200 gf to give a sample; and the sample is subjected to a T-peel test with a tensile tester at a peel rate of 50 mm/min.

Abstract translation: 本发明提供一种多孔组合物，其具有优异的孔性，柔软性，并且被令人满意地处理和加工; 以及制造多层组件的方法。 [解决方案]多层组件包括基底，并且在其至少一侧上布置有多孔层，并且具有大量的平均孔径为0.01至10μm的连续微孔。 当根据以下步骤在带剥离试验中进行检查时，多层组件在基底和多孔层之间没有界面分层：胶带剥离试验24mm宽的胶带[Film Masking Tape No.603（＃25）] 由Teraoka Seisakusho Co.，Ltd。提供，用多层组件的多孔层的表面施加直径为30mm，载荷为200gf的辊压合到其上，得到样品; 用拉伸试验机以50mm / min的剥离速度对样品进行T剥离试验。

公开(公告)号：US20120234585A1

公开(公告)日：2012-09-20

申请号：US13395659

申请日：2010-09-09

Applicant: Wolfgang Schmidt ,  Kirsten Barth-Gremmel

Inventor： Wolfgang Schmidt ,  Kirsten Barth-Gremmel

IPC: H05K1/09 ,  H05K3/00 ,  B32B5/18

CPC classification number: B41M5/5218 ,  B41M5/506 ,  B41M5/52 ,  B41M5/5254 ,  H01L51/0096 ,  H05K1/0386 ,  H05K1/0393 ,  H05K3/1208 ,  H05K3/125 ,  H05K2201/0116 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0284 ,  H05K2201/05 ,  H05K2203/013 ,  Y02E10/549 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/249979

Abstract: Support materials for printing electrically conductive structures by means of inkjet printing with inks which contain conductive particles lead to low resistances for the printed structures without thermal post-treatment when they contain a microporous layer with a mean pore size of less than 100 nm as an outer layer.

Abstract translation: 用于通过喷墨印刷印刷导电结构的支撑材料，其中含有导电颗粒的油墨导致印刷结构的低电阻，当它们含有平均孔径小于100nm的微孔层作为外部时，无需热后处理 层。

公开(公告)号：US08263983B2

公开(公告)日：2012-09-11

申请号：US10973986

申请日：2004-10-27

Applicant: Shinji Maekawa ,  Yasuyuki Arai

Inventor： Shinji Maekawa ,  Yasuyuki Arai

IPC: H01L29/04 ,  H01L29/76

CPC classification number: H05K3/1208 ,  G02F2001/136295 ,  H01L27/1285 ,  H01L27/1292 ,  H05K3/125 ,  H05K3/38 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2203/013

Abstract: The present invention provides a thin wiring pattern such as wiring formed by discharging a droplet. In the present invention, a porous (including microporous) substance is formed as a base film in forming pattern by using a droplet discharge method (also referred to as an ink-jetting method). One feature of a wiring substrate according to the present invention provides a porous film and a conductive layer thereon. One feature of a semiconductor device of the present invention provides a thin film transistor in which a gate electrode is formed by the conductive layer having the above-described structure.

Abstract translation: 本发明提供了一种薄布线图案，例如通过放电液滴形成的布线。 在本发明中，通过使用液滴喷射法（也称为喷墨法），在形成图案中形成多孔（包括微孔）物质作为基膜。 根据本发明的布线基板的一个特征在其上提供多孔膜和导电层。 本发明的半导体器件的一个特征是提供一种薄膜晶体管，其中栅极由具有上述结构的导电层形成。