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    Method for manufacturing LED light bar and LED light bar thereof
    21.
    发明授权
    Method for manufacturing LED light bar and LED light bar thereof 有权
    LED灯条及其LED灯条的制造方法

    公开(公告)号：US09234633B2

    公开(公告)日：2016-01-12

    申请号：US14345943

    申请日：2014-01-24

    Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.

    Inventor： Changcheng Lo ,  Chong Huang ,  Yewen Wang

    IPC: H01L21/00 ,  H01L33/00 ,  F21K99/00

    CPC classification number: F21K9/30 ,  F21K9/90 ,  H01L25/0753 ,  H01L33/641 ,  H01L33/644 ,  H01L2924/0002 ,  H05K1/056 ,  H05K2201/0162 ,  H05K2201/0323 ,  H05K2201/10106 ,  Y10T29/49146 ,  H01L2924/00

    Abstract: The present invention provides a method for manufacturing an LED light bar and an LED light bar thereof. The method includes (1) providing a metal substrate (20) and a plurality of LED lights (40); (2) forming a graphene layer (60) on the metal substrate (20) in such a way that the graphene layer (60) includes hollow sections (62) formed to correspond to the LED lights (40); (3) mounting the LED lights (40) to the metal substrate (20) in the hollow sections (62); and (4) forming silicone layers (80) in the hollow sections (62). The method for manufacturing the LED light bar and the LED light bar thereof according to the present invention use a graphene layer formed on a metal substrate and use silicone layers for planarization and heat transfer so as to effectively enhance heat dissipation performance of the LED light bar and extend lifespan of the LED light bar.

    Abstract translation: 本发明提供一种制造LED灯条及其LED灯条的方法。 该方法包括（1）提供金属基板（20）和多个LED灯（40）; （2）在所述金属基板（20）上形成石墨烯层（60），使得所述石墨烯层（60）包括形成为对应于所述LED灯（40）的中空部分（62）。 （3）将LED灯（40）安装在中空部（62）中的金属基板（20）上; 和（4）在中空部分（62）中形成硅氧烷层（80）。 根据本发明的LED灯条及其LED灯条的制造方法使用形成在金属基板上的石墨烯层，并使用有机硅层进行平坦化和传热，以有效提高LED灯条的散热性能 并延长LED灯条的使用寿命。

    INTERDIGITATED CHIP CAPACITOR ASSEMBLY
    24.
    发明申请
    INTERDIGITATED CHIP CAPACITOR ASSEMBLY 审中-公开
    互连芯片电容器总成

    公开(公告)号：US20150230345A1

    公开(公告)日：2015-08-13

    申请号：US14695216

    申请日：2015-04-24

    Applicant: Texas Instruments Incorporated

    Inventor： Allan Jerome Daen Rapales ,  Floro Lopez Camenforte, III ,  John Paul Quianzon Kwo

    IPC: H05K3/34 ,  H05K3/00 ,  H05K3/30 ,  H01G2/06

    CPC classification number: H05K3/3442 ,  H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K1/18 ,  H05K1/183 ,  H05K3/0014 ,  H05K3/301 ,  H05K3/3452 ,  H05K2201/0162 ,  H05K2201/09036 ,  H05K2201/09172 ,  H05K2201/09909 ,  H05K2203/0126 ,  H05K2203/046 ,  H05K2203/167 ,  H05K2203/168 ,  Y02P70/613 ,  Y10T29/43 ,  Y10T29/49135

    Abstract: A method of registering terminals on an interdigitated chip capacitor (“IDC”) with a plurality of contact pads on a substrate. At least one vertically extending nonconductive abutment surface is formed between adjacent ones of the contact pads. A plurality of grooves projecting outwardly from said a central recess is formed on the substrate top portion. At least one sidewall portion of the IDC is urged into abutting engagement with the at least one abutment surface on the substrate. Another method prevent solder from causing short circuits between adjacent terminals. A plurality of grooves extending laterally outwardly from a central recessed portion are formed. The plurality of grooves defining a plurality of inwardly projecting fingers. A plurality of contact pads on are formed on a respective plurality of fingers. A solder bead is formed on at least some of the plurality of contact pads. The at least one solder bead is isolated from adjacent solder beads and adjacent terminals.

    Abstract translation: 一种在叉指片式电容器（“IDC”）上的端子与衬底上的多个接触焊盘对准的方法。 在相邻的接触垫之间形成至少一个垂直延伸的非导电邻接表面。 在所述基板顶部形成有从所述中心凹部向外突出的多个凹槽。 IDC的至少一个侧壁部分被推动成与基底上的至少一个邻接表面邻接接合。 另一种方法可以防止焊料在相邻端子之间引起短路。 形成从中心凹部横向向外延伸的多个槽。 多个槽限定多个向内突出的指状物。 在多个指状物上形成多个接触垫。 在多个接触垫中的至少一些上形成焊珠。 至少一个焊珠与相邻的焊球和相邻的端子隔离。

    Flexible circuitry with heat and pressure spreading layers
    27.
    发明授权
    Flexible circuitry with heat and pressure spreading layers 有权
    具有热和压力扩展层的柔性电路

    公开(公告)号：US08946561B2

    公开(公告)日：2015-02-03

    申请号：US13353203

    申请日：2012-01-18

    Applicant: Joshua G. Wurzel ,  Casey J. Feinstein

    Inventor： Joshua G. Wurzel ,  Casey J. Feinstein

    IPC: H05K1/00 ,  H05K3/36

    CPC classification number: H05K1/02 ,  H05K3/361 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/2009 ,  Y10T29/49126

    Abstract: A flexible printed circuit may be provided with an integrated heat and pressure spreading layer. The heat and pressure spreading layer may be configured to uniformly spread heat and pressure from a bonding tool across a portion of the flexible printed circuit during bonding of the flexible printed circuit to additional circuitry. During manufacturing of the flexible printed circuit, a sheet of heat and pressure spreading material may be attached to a sheet of flexible printed circuitry and the heat and pressure spreading material and the sheet of flexible printed circuitry may be die cut to form multiple flexible printed circuits each with a heat and pressure spreading layer. An electronic device may be provided with a flexible printed circuit with a heat and pressure spreading layer coupled to a component such as a display.

    Abstract translation: 柔性印刷电路可以设置有集成的热和压扩散层。 热和压扩散层可以被配置为在将柔性印刷电路连接到附加电路的过程中，均匀地将粘合工具的热量和压力传播到柔性印刷电路的一部分上。 在柔性印刷电路的制造期间，一片热和压力扩展材料可以附接到柔性印刷电路板上，并且热和压力扩展材料和柔性印刷电路板可以被模切以形成多个柔性印刷电路 每个具有热和压力扩散层。 电子设备可以设置有柔性印刷电路，其具有耦合到诸如显示器的部件的热和压力扩展层。

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