公开(公告)号：US20130333931A1

公开(公告)日：2013-12-19

申请号：US14002552

申请日：2012-02-22

Applicant: Yoshihide Sekito

Inventor： Yoshihide Sekito

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  C08G18/0823 ,  C08G18/6659 ,  C08G18/672 ,  C08G18/758 ,  C08J5/18 ,  C08K7/16 ,  C08K2003/026 ,  C08K2003/0812 ,  C08K2201/003 ,  H05K3/287 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0266 ,  C08G18/44

Abstract: The present invention provides an insulating film including: a (A) binder polymer; (B) spherical organic beads; and (C) fine particles containing at least one element selected from the group consisting of phosphorus, aluminum, and magnesium, both the (B) spherical organic bead and the (C) fine particles being dispersed in a predetermined state in the insulating film.

Abstract translation: 本发明提供一种绝缘膜，包括：（A）粘合剂聚合物; （B）球形有机珠粒; 和（C）含有选自磷，铝和镁中的至少一种元素的细颗粒，（B）球形有机珠和（C）微粒均以预定状态分散在绝缘膜中。

公开(公告)号：US20130213707A1

公开(公告)日：2013-08-22

申请号：US13401028

申请日：2012-02-21

Applicant: Dylan J. Boday ,  Joseph Kuczynski ,  Jason T. Wertz ,  Jing Zhang

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Jason T. Wertz ,  Jing Zhang

IPC: H05K7/06 ,  C07F9/50

CPC classification number: C07F9/5022 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/09872 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T428/23986

Abstract: A conformal coating comprising modified porous silica particles is disclosed. A porous silica particle, such as MCM-14 or SBA-15 is modified with a sulfur gettering functionality, such as a phosphine compound, covalently bonded to silicon atoms in the porous silica particle. The conformal coating comprising the modified porous silica particles may be applied to metallic wiring areas of a circuit component, with the sulfur gettering functionality preventing sulfur from atmospheric gasses from penetrating the conformal coating to the metallic wiring.

Abstract translation: 公开了一种包含改性多孔二氧化硅颗粒的保形涂层。 诸如MCM-14或SBA-15的多孔二氧化硅颗粒用硫吸收官能团改性，例如与多孔二氧化硅颗粒中的硅原子共价结合的膦化合物。 包含改性多孔二氧化硅颗粒的保形涂层可以施加到电路部件的金属布线区域，硫吸气功能可以防止大气中的硫渗透到金属布线的保形涂层。

公开(公告)号：US20130156616A1

公开(公告)日：2013-06-20

申请号：US13447841

申请日：2012-04-16

Applicant: Chia-Yuan CHANG ,  Han-Pei Wang ,  Cheng-Chieh Liu ,  Wen-Ping Teng

Inventor： Chia-Yuan CHANG ,  Han-Pei Wang ,  Cheng-Chieh Liu ,  Wen-Ping Teng

IPC: F04B35/04 ,  B21D53/78 ,  H05K3/00

CPC classification number: F04D29/624 ,  F04D25/0606 ,  F04D25/0633 ,  F04D25/0693 ,  F04D29/424 ,  F04D29/646 ,  H05K3/105 ,  H05K3/182 ,  H05K3/341 ,  H05K2201/0215 ,  H05K2201/0999 ,  Y02P70/613 ,  Y10T29/49316

Abstract: A manufacturing method of a thin fan comprises the steps of: providing a plastic material containing a plurality of metal particles; molding the plastic material into a housing; removing a part of a surface of the housing to form a circuit layout area at the housing; and forming a metal layer in the circuit layout area.

Abstract translation: 薄风扇的制造方法包括以下步骤：提供含有多个金属颗粒的塑料材料; 将塑料材料成型为壳体; 移除所述壳体的表面的一部分以在所述壳体处形成电路布局区域; 以及在电路布局区域中形成金属层。

公开(公告)号：US08410887B2

公开(公告)日：2013-04-02

申请号：US13602600

申请日：2012-09-04

Applicant: Jyunichi Nanjyo ,  Hiroki Sakamoto

Inventor： Jyunichi Nanjyo ,  Hiroki Sakamoto

IPC: H01F5/00 ,  H01F27/30

CPC classification number: H05K1/165 ,  H01F3/14 ,  H01F17/0033 ,  H05K3/4629 ,  H05K2201/0215 ,  H05K2201/09672

Abstract: In a built-in-coil substrate, when viewed in perspective in a stacking direction in which insulating layers of a substrate body are stacked, mutually superposed second coil elements are located further inward than inner peripheries of mutually superposed first coil elements. A cavity is continuous between at least one of the second coil elements and one insulating layer that is in contact with the second coil element(s), and another insulating layer that opposes the second coil element(s) such that the second coil element(s) are exposed, and, when viewed in perspective in the stacking direction, the cavities have annular shapes and extend further inward than the outer peripheries of the mutually superposed first coil elements, there being an interval provided between the cavities and these outer peripheries, and further outward than the inner peripheries of the mutually superposed second coil elements.

Abstract translation: 在内置线圈基板中，当层叠基板主体的绝缘层的层叠方向的立体图来看，相互重叠的第二线圈元件位于相互叠置的第一线圈元件的内周的内侧的位置的内侧。 在第二线圈元件中的至少一个和与第二线圈元件接触的一个绝缘层之间连续地形成空腔，以及与第二线圈元件相对的另一个绝缘层，使得第二线圈元件 并且当从层叠方向的角度看时，空腔具有环形形状，并且比相互重叠的第一线圈元件的外周更向内延伸，在空腔和这些外周之间设有间隔， 并且比相互叠置的第二线圈元件的内周更向外。

公开(公告)号：US08388724B2

公开(公告)日：2013-03-05

申请号：US12226653

申请日：2007-04-23

Applicant: Rikiya Kato ,  Sakie Yamagata

Inventor： Rikiya Kato ,  Sakie Yamagata

IPC: B32B15/01 ,  B32B15/02 ,  B32B15/20 ,  B23K1/00

CPC classification number: H05K3/3484 ,  B22F1/0003 ,  B22F1/0059 ,  B22F1/025 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  C22C5/00 ,  C22C9/02 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H05K2201/0215 ,  H05K2201/0218 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2982

Abstract: High-temperature solders having a higher melting point than solder alloys used for soldering of printed circuit boards are used for internal bonding of electronic parts, but high-temperature solders which are free from Pb have not been developed. There exist high-temperature solders which comprises Sn balls and Cu balls and which perform bonding through the formation of an intermetallic compound without melting to form a single-phase structure, but they have poor wettability to the lands of a printed circuit board or electrodes of electronic parts and have not been used.A solder paste according to the present invention is provided by mixing flux with a powder mixture of Sn powder or an Sn based lead-free solder powder with Cu or Ag powder which has Ni plating formed on its surface. Although the solder paste performs bonding by means of an intermetallic compound without melting to form a single phase structure, the Ni plating acts as a barrier which retards the formation of the intermetallic compound so as to leave enough time to permit wetting of the lands of a printed circuit board or electrodes of an electronic part.

Abstract translation: 具有比用于焊接印刷电路板的焊料合金更高的熔点的高温焊料用于电子部件的内部粘合，但是没有开发出没有Pb的高温焊料。 存在包含Sn球和Cu球的高温焊料，并且通过形成金属间化合物而不熔化形成单相结构，但是它们对印刷电路板的焊盘或电极的电极的润湿性差 电子部件并未使用。 通过将助熔剂与Sn粉末或Sn类无铅焊料粉末的混合物与其表面上形成有Ni镀层的Cu或Ag粉末混合来提供根据本发明的焊膏。 虽然焊膏通过金属间化合物进行结合而不熔化形成单相结构，但是Ni镀层作为阻碍金属间化合物形成的屏障，以便留下足够的时间来润湿 印刷电路板或电子部件的电极。

公开(公告)号：US08298680B2

公开(公告)日：2012-10-30

申请号：US11569609

申请日：2005-05-11

Applicant: Nicolaas Johannes Anthonius Van Veen ,  Mohammad Hossain Biglari

Inventor： Nicolaas Johannes Anthonius Van Veen ,  Mohammad Hossain Biglari

IPC: B23K35/22

CPC classification number: B23K35/262 ,  B23K35/0222 ,  B23K35/24 ,  B23K35/26 ,  B23K35/264 ,  B23K35/28 ,  B23K35/286 ,  H01L24/29 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/14 ,  H05K3/3484 ,  H05K2201/0215 ,  Y10T428/12028 ,  Y10T428/1216 ,  Y10T428/24826 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2924/0103 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.

Abstract translation: 焊料组合物包含热力学亚稳态合金的颗粒。 合金的一个元素将形成具有金属表面的金属间化合物。 焊料组合物特别适用于半导体器件的凸起。

公开(公告)号：US20120249375A1

公开(公告)日：2012-10-04

申请号：US12154486

申请日：2008-05-23

Applicant: Markku T. Heino ,  Reijo K. Lehtiniemi ,  Markku A. Oksanen ,  Eira T. Seppala ,  Pekka Martti Tapio Ikonen ,  Robin H.A. Ras ,  Jaakko Timonen ,  Maija Pohjakallio ,  Christoffer Johans

Inventor： Markku T. Heino ,  Reijo K. Lehtiniemi ,  Markku A. Oksanen ,  Eira T. Seppala ,  Pekka Martti Tapio Ikonen ,  Robin H.A. Ras ,  Jaakko Timonen ,  Maija Pohjakallio ,  Christoffer Johans

IPC: H01F1/00 ,  B32B5/16 ,  H01F1/01 ,  H01F1/42 ,  B05D3/02 ,  B32B27/18 ,  H01Q1/38 ,  B82Y30/00

CPC classification number: H01F1/44 ,  B05D3/06 ,  C08J3/24 ,  C08K3/08 ,  C08K3/22 ,  H01F1/28 ,  H01L21/563 ,  H01L23/295 ,  H01L23/552 ,  H01L23/645 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/83222 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/351 ,  H01Q9/0407 ,  H01Q9/0421 ,  H05K1/0233 ,  H05K3/305 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/086 ,  H05K2201/10371 ,  H05K2201/10689 ,  H05K2203/101 ,  H05K2203/104 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T428/249986 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/3154 ,  Y10T428/31678 ,  Y10T428/31938 ,  Y10T428/32 ,  H01L2924/00

Abstract: A material contains a curable liquid polymer containing suspended nanoparticles capable of exhibiting a magnetic property. The nanoparticles are present in a concentration sufficient to cause the curable liquid polymer to flow in response to application of a magnetic field, enabling the material to be guided into narrow regions to completely fill such regions prior to the polymer being cured. A method includes applying a filler material to at least one component, the filler material including a heat curable polymer containing nanoparticles, and applying an electromagnetic field to at least part of the filler material. The nanoparticles contain a core capable of experiencing localized heating sufficient to at least partially cure surrounding polymer. Also disclosed is an assembly for use at radio frequencies. The assembly includes a substrate and at least one component supported by the substrate. The substrate contains a thermoplastic or thermoset polymer with suspended nanoparticles capable of exhibiting a magnetic property. The nanoparticles are of a type and have a concentration in the polymer selected to provide a certain dielectric permittivity, magnetic permeability and dissipation factor.

Abstract translation: 材料含有可显示磁性的含有悬浮纳米粒子的可固化液体聚合物。 纳米颗粒以足以使可固化液体聚合物响应于施加磁场而流动的浓度存在，使得材料能够在聚合物固化之前被引导到狭窄的区域中以完全填充这些区域。 一种方法包括将填料材料应用于至少一种组分，所述填料材料包括含有纳米颗粒的可热固化聚合物，以及向填充材料的至少一部分施加电磁场。 纳米颗粒含有能够经历足以至少部分固化周围聚合物的局部加热的芯。 还公开了一种用于无线电频率的组件。 该组件包括基底和由基底支撑的至少一个部件。 基材含有具有能够表现出磁性的悬浮纳米粒子的热塑性或热固性聚合物。 纳米颗粒是一种类型的并且在聚合物中的浓度被选择以提供一定的介电常数，磁导率和耗散因子。

公开(公告)号：US20120134631A1

公开(公告)日：2012-05-31

申请号：US13185883

申请日：2011-07-19

Applicant: Cheng-Feng Chiang ,  Jung-Chuan Chiang ,  Wei-Cheng Fu

Inventor： Cheng-Feng Chiang ,  Jung-Chuan Chiang ,  Wei-Cheng Fu

IPC: G02B6/36 ,  B29C45/14 ,  B29C35/08 ,  B29C70/00 ,  H01R43/00

CPC classification number: H05K3/0014 ,  B29C45/0013 ,  B29C45/0053 ,  B29C45/16 ,  B29C2045/0079 ,  B29K2995/0005 ,  B29L2031/3493 ,  C25D5/006 ,  C25D5/02 ,  C25D5/56 ,  H01L23/3677 ,  H01L23/49861 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0206 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0236 ,  H05K2203/107 ,  H01L2924/00

Abstract: A molded interconnect device (MID) with a thermal conductive property and a method for production thereof are disclosed. A thermal conductive element is set in a support element to improve the thermal conductivity of the support element, and the support element is a non-conductive support or a metallizable support. A metallization layer is formed on a surface of the support element. If a heat source is set on the metallization layer, heat produced by the heat source will pass out from the metallization layer or the support element with the thermal conductivity material element.

Abstract translation: 公开了一种具有导热性能的模制互连装置（MID）及其制造方法。 将导热元件设置在支撑元件中以改善支撑元件的导热性，并且支撑元件是非导电支撑件或金属化支撑件。 金属化层形成在支撑元件的表面上。 如果在金属化层上设置热源，则由热源产生的热量将从导电材料元件的金属化层或支撑元件中排出。

公开(公告)号：US08187710B2

公开(公告)日：2012-05-29

申请号：US13009688

申请日：2011-01-19

Applicant: Takahiro Matsumoto ,  Toshiaki Yamada ,  Hirotaka Tsuruya

Inventor： Takahiro Matsumoto ,  Toshiaki Yamada ,  Hirotaka Tsuruya

IPC: B05D5/12 ,  B05D5/00 ,  B05D7/00

CPC classification number: H05K1/162 ,  B82Y30/00 ,  C01P2004/64 ,  C01P2006/12 ,  C01P2006/40 ,  C04B35/628 ,  C04B35/62821 ,  C04B2235/3293 ,  C09C1/00 ,  H01B1/08 ,  H01B3/006 ,  H01B3/02 ,  H01B3/10 ,  H01G4/206 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y10T428/268 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998

Abstract: There are disclosed insulated ultrafine powder comprising electroconductive ultrafine powder which is in the form of sphere, spheroid or acicular each having a minor axis in the range of 1 to 100 nm and an insulating film applied thereto; a process for producing the same which is capable of covering the surfaces of the insulated ultrafine powder with the insulating film having a thickness in the range of 0.3 to 100 nm without causing any clearance or vacancy; and a resin composite material which uses the same. A high dielectric constant of the material is assured by adding a small amount of insulated ultrafine powder wherein an insulating film is applied to the electroconductive ultrafine powder, while maintaining the processability and moldability that are the characteristics inherent in a resin material.

Abstract translation: 公开了包含导电性超细粉末的绝缘超细粉末，其为球状，球状或针状，各具有1〜100nm的短轴和施加于其上的绝缘膜; 其制造方法能够利用厚度在0.3〜100nm范围内的绝缘膜覆盖绝缘超细粉末的表面，而不会产生任何间隙或空位; 和使用该树脂复合材料的树脂复合材料。 通过在保持作为树脂材料中固有的特性的加工性和成型性的同时，通过添加少量绝缘超细粉末来确保材料的高介电常数，其中绝缘膜被施加到导电超细粉末。

公开(公告)号：US08173051B2

公开(公告)日：2012-05-08

申请号：US12558049

申请日：2009-09-11

Applicant: Takahiro Matsumoto ,  Toshiaki Yamada ,  Hirotaka Tsuruya

Inventor： Takahiro Matsumoto ,  Toshiaki Yamada ,  Hirotaka Tsuruya

IPC: H01B1/20 ,  H01B1/08

CPC classification number: H05K1/162 ,  B82Y30/00 ,  C01P2004/64 ,  C01P2006/12 ,  C01P2006/40 ,  C04B35/628 ,  C04B35/62821 ,  C04B2235/3293 ,  C09C1/00 ,  H01B1/08 ,  H01B3/006 ,  H01B3/02 ,  H01B3/10 ,  H01G4/206 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y10T428/268 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998

Abstract: There are disclosed insulated ultrafine powder comprising electroconductive ultrafine powder which is in the form of sphere, spheroid or acicular each having a minor axis in the range of 1 to 100 nm and an insulating film applied thereto; a process for producing the same which is capable of covering the surfaces of the insulated ultrafine powder with the insulating film having a thickness in the range of 0.3 to 100 nm without causing any clearance or vacancy; and a resin composite material which uses the same. A high dielectric constant of the material is assured by adding a small amount of insulated ultrafine powder wherein an insulating film is applied to the electroconductive ultrafine powder, while maintaining the processability and moldability that are the characteristics inherent in a resin material.