公开(公告)号：US20100308030A1

公开(公告)日：2010-12-09

申请号：US12865771

申请日：2009-01-26

Applicant: Philippe Maurin-Perrier ,  Benoit Terme ,  Christophe Heau

Inventor： Philippe Maurin-Perrier ,  Benoit Terme ,  Christophe Heau

IPC: F23Q7/00 ,  H05B3/00

CPC classification number: H05K1/167 ,  H01C7/006 ,  H01C17/065 ,  H05B3/84 ,  H05B2203/017 ,  H05K1/0212 ,  H05K3/381 ,  H05K2201/0317 ,  H05K2203/025 ,  H05K2203/1115 ,  Y10T29/49083

Abstract: A method for fabricating a heating a element includes modifying the surface state of a substrate in order to obtain at least one smooth area of low roughness and at least one rough area having a higher roughness; applying a highly electrically conductive material to these various areas; and connecting smooth area(s) of the conductive material to an electrical power source.

Abstract translation: 制造加热元件的方法包括改变基底的表面状态以获得至少一个具有较低粗糙度的平滑区域和至少一个具有较高粗糙度的粗糙区域; 将高导电性材料施加到这些不同的区域; 以及将导电材料的平滑区域连接到电源。

公开(公告)号：US20100186227A1

公开(公告)日：2010-07-29

申请号：US12662108

申请日：2010-03-31

Applicant: Jun ISHII ,  Yasunari OOYABU

Inventor： Jun ISHII ,  Yasunari OOYABU

IPC: H05K3/10

CPC classification number: H05K1/056 ,  G11B5/484 ,  G11B5/486 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0317 ,  H05K2201/0338 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer.

公开(公告)号：US07756366B2

公开(公告)日：2010-07-13

申请号：US12405818

申请日：2009-03-17

Applicant: Shigemi Ohtsu ,  Akira Fujii ,  Kazutoshi Yatsuda ,  Masahiro Igusa ,  Toshihiko Suzuki ,  Keishi Shimizu

Inventor： Shigemi Ohtsu ,  Akira Fujii ,  Kazutoshi Yatsuda ,  Masahiro Igusa ,  Toshihiko Suzuki ,  Keishi Shimizu

IPC: G02B6/12 ,  G02B6/10

CPC classification number: G02B6/10 ,  G02B6/138 ,  G02B6/4293 ,  G02B6/43 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/09 ,  H05K2201/0317

Abstract: An optical waveguide film includes: an optical waveguide film main body including an optical waveguide core through which light travels and a cladding portion that surrounds the optical waveguide core and has a lower refractive index than that of the optical waveguide core; an electric wiring portion including silver or a silver alloy and formed on at least a part of a principal surface of the optical waveguide film main body; and a protective layer including a titanium layer or a titanium alloy layer and disposed to cover the electric wiring portion.

Abstract translation: 光波导膜包括：光波导膜主体，其包括光波导的光波导芯和围绕光波导芯并且具有比光波导芯低的折射率的包层部分; 包括银或银合金并形成在所述光波导膜主体的主表面的至少一部分上的电配线部分; 以及包括钛层或钛合金层的保护层，并且设置成覆盖电线路部分。

公开(公告)号：US07723617B2

公开(公告)日：2010-05-25

申请号：US11892052

申请日：2007-08-20

Applicant: Jun Ishii ,  Yasunari Ooyabu

Inventor： Jun Ishii ,  Yasunari Ooyabu

IPC: H05K1/00

CPC classification number: H05K1/056 ,  G11B5/484 ,  G11B5/486 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0317 ,  H05K2201/0338 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer.

Abstract translation: 布线电路板具有金属支撑板，金属箔形成在金属支撑板上以具有小于2.0μm的厚度，形成在金属支撑板上以覆盖金属箔的第一绝缘层和形成的导电图案 在第一绝缘层上。

公开(公告)号：US20100025085A1

公开(公告)日：2010-02-04

申请号：US12421411

申请日：2009-04-09

Applicant: Yasuki Torigoshi ,  Kiyomi Muro

Inventor： Yasuki Torigoshi ,  Kiyomi Muro

IPC: H05K1/00 ,  B44C1/22

CPC classification number: H05K1/0224 ,  H05K1/0253 ,  H05K1/0393 ,  H05K3/16 ,  H05K3/243 ,  H05K3/281 ,  H05K2201/0317 ,  H05K2201/09681 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2203/0369

Abstract: According to one embodiment, an electronic apparatus includes a casing and a flexible printed wiring board contained in the casing. The flexible printed wiring board includes an insulating layer, which is sheet-like, a signal line formed on a first surface of the insulating layer, and a ground layer, which is conductive and formed on a second surface of the insulating layer opposite to the first surface. The ground layer includes a mesh portion having a mesh structure and a thin film portion which fills cells in the mesh structure of the mesh portion.

Abstract translation: 根据一个实施例，电子设备包括壳体和容纳在壳体中的柔性印刷线路板。 柔性印刷电路板包括片状的绝缘层，形成在绝缘层的第一表面上的信号线和接地层，导电并形成在绝缘层的与该绝缘层相反的第二表面上 第一表面。 接地层包括具有网状结构的网状部分和填充网格部分的网格结构中的单元的薄膜部分。

公开(公告)号：US20090226850A1

公开(公告)日：2009-09-10

申请号：US11720180

申请日：2005-11-28

Applicant: Koichi Misumi ,  Koji Saito ,  Kaoru Ishikawa

Inventor： Koichi Misumi ,  Koji Saito ,  Kaoru Ishikawa

IPC: G03F7/20

CPC classification number: H05K3/108 ,  G03F7/0397 ,  G03F7/11 ,  H05K3/384 ,  H05K2201/0317

Abstract: This process for producing a resist pattern includes: the step of laminating (a) a support having an upper surface on which copper exists, (b) an inorganic substance layer consisting of an inorganic substance supplied from an inorganic substance source, and (c) a photoresist layer consisting of a chemically amplified type positive photoresist composition, to obtain a photoresist laminate, the step of selectively irradiating active light or radioactive rays to said photoresist laminate, and the step of developing said (c) photoresist layer together with said (b) inorganic substance layer to form a resist pattern.

Abstract translation: 制造抗蚀剂图案的方法包括：（a）具有铜的上表面的载体的层叠步骤，（b）由无机物质源供给的无机物质构成的无机物质层，（c） 由化学放大型正性光致抗蚀剂组合物构成的光致抗蚀剂层，以获得光致抗蚀剂层压体，选择性地向所述光致抗蚀剂层压体照射活性光或放射线的步骤，以及将所述（c）光致抗蚀剂层与所述（b ）无机物质层以形成抗蚀剂图案。

公开(公告)号：US20090159565A1

公开(公告)日：2009-06-25

申请号：US11962164

申请日：2007-12-21

Applicant: John B. Szczech ,  Daniel R. Gamota ,  Tomasz L. Klosowiak ,  Jerzy Wielgus

Inventor： John B. Szczech ,  Daniel R. Gamota ,  Tomasz L. Klosowiak ,  Jerzy Wielgus

IPC: B44C1/22

CPC classification number: H05K3/027 ,  H05K1/0393 ,  H05K3/16 ,  H05K2201/0116 ,  H05K2201/0317 ,  H05K2201/10113 ,  H05K2203/0557 ,  H05K2203/056

Abstract: A method for delineating a metallization pattern in a layer of sputtered aluminum or sputtered copper using a broad spectrum high intensity light source. The metal is deposited on a polymeric substrate by sputtering, so that it has a porous nanostructure. An opaque mask that is a positive representation of the desired metallization pattern is then situated over the metallization layer, exposing those portions of the metallization layer intended to be removed. The masked metallization layer is then exposed to a rapid burst of high intensity visible light from an arc source sufficient to cause complete removal of the exposed portions of the metallization layer, exposing the underlying substrate and creating the delineated pattern.

Abstract translation: 使用广谱高强度光源描绘溅射铝或溅射铜层中的金属化图案的方法。 通过溅射将金属沉积在聚合物基底上，使其具有多孔纳米结构。 然后将作为所需金属化图案的正表示的不透明掩模放置在金属化层上方，暴露预期要去除的金属化层的那些部分。 掩蔽的金属化层然后暴露于来自电弧源的高强度可见光的快速爆发，足以引起金属化层的暴露部分的完全去除，暴露下面的衬底并产生描绘图案。

公开(公告)号：US20090120676A1

公开(公告)日：2009-05-14

申请号：US12288718

申请日：2008-10-22

Applicant: Michael Rohm ,  Juri Attner

Inventor： Michael Rohm ,  Juri Attner

IPC: H05K1/18 ,  B32B37/30 ,  B32B3/00

CPC classification number: H05K3/046 ,  H05K1/0393 ,  H05K3/244 ,  H05K3/386 ,  H05K2201/0108 ,  H05K2201/0317 ,  H05K2201/0329 ,  H05K2203/0522 ,  H05K2203/0525 ,  H05K2203/0528 ,  H05K2203/1545 ,  Y10T428/24802

Abstract: The invention concerns a process for the production of a conductor track structure on a flexible plastic film, a conductor track structure produced in accordance therewith, wherein the conductor track structure is connected to the plastic film by means of an adhesive layer hardened by irradiation, and is formed from an electrically conducting thin film layer in pattern form, which is galvanically reinforced with at least one metal layer, as well as an electronic component or an electronic circuit having such a conductor track structure.

Abstract translation: 本发明涉及一种用于在柔性塑料膜上制造导体轨道结构的方法，根据该导体轨道结构制造的导体轨道结构，其中导体轨道结构通过通过照射而硬化的粘合剂层连接到塑料膜，以及 由图案形式的导电薄膜层形成，其由至少一个金属层电流增强，以及具有这种导体轨道结构的电子部件或电子电路。

公开(公告)号：US20080202919A1

公开(公告)日：2008-08-28

申请号：US12034707

申请日：2008-02-21

Applicant: Jeon Geon Han ,  Kab Seog Kim ,  Yong Mo Kim

Inventor： Jeon Geon Han ,  Kab Seog Kim ,  Yong Mo Kim

IPC: C23C14/35

CPC classification number: C23C14/352 ,  C23C14/20 ,  C23C14/562 ,  H01J37/3277 ,  H01J37/3405 ,  H05K1/028 ,  H05K1/09 ,  H05K3/16 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2203/1476 ,  H05K2203/1545

Abstract: An apparatus and method for manufacturing a highly efficient flexible thin metal film-laminated strip by improves adhesiveness between a polyimide strip and a thin metal film, and removes stress from thin films laminated through magnetron sputtering, which is a dry deposition process. The stress-free flexible circuit board manufacturing method includes the steps of: a) depositing a seed layer on the substrate using the magnetron deposition source; b) depositing a compressive thin film using the single magnetron deposition source arranged next to the magnetron deposition source; c) depositing tensile thin film using the dual magnetron deposition source arranged next to the single magnetron deposition source; and d) repeating the steps b) and c) so as to sequentially and alternately deposit compressive thin films and tensile thin films thereby obtaining a thick film with a desired thickness.

Abstract translation: 通过改善聚酰亚胺条和薄金属膜之间的粘合性，并且通过作为干沉积工艺的磁控溅射层叠的薄膜来消除应力，从而制造高效率的柔性薄金属膜层叠带的装置和方法。 无应力柔性电路板的制造方法包括以下步骤：a）使用磁控管沉积源将种子层沉积在基板上; b）使用布置在磁控管沉积源旁边的单个磁控管沉积源沉积压缩薄膜; c）使用布置在单个磁控管沉积源旁边的双重磁控管沉积源沉积拉伸薄膜; 以及d）重复步骤b）和c），以顺序和交替地沉积压缩薄膜和拉伸薄膜，从而获得具有所需厚度的厚膜。

公开(公告)号：US20080190656A1

公开(公告)日：2008-08-14

申请号：US11579727

申请日：2005-05-06

Applicant: David Cheeke ,  Leslie M. Landsberger

Inventor： David Cheeke ,  Leslie M. Landsberger

IPC: H05K1/02 ,  H05K3/30

CPC classification number: H05K1/167 ,  H05K1/0212 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/062 ,  H05K2203/171 ,  Y10T29/49155

Abstract: There is described a printed circuit board with a thermally trimmable component embedded therein. A layer of refractory insulating material is provided to provide mechanical support and chemical passivation for the thermally trimmable component. The component is trimmed by applying a sequence of heat pulses the a heating element, which could be the component itself or a separate element. A cavity may be burned in the substrate to provide thermal isolation for the thermally trimmable component.

Abstract translation: 描述了嵌入其中的可热调制组件的印刷电路板。 提供一层难熔绝缘材料，为热可调节部件提供机械支撑和化学钝化。 通过施加加热元件的加热元件序列来修剪部件，加热元件可以是部件本身或单独的元件。 空腔可以在基板中燃烧以提供热可分离组件的热隔离。