公开(公告)号：US07735713B2

公开(公告)日：2010-06-15

申请号：US11562644

申请日：2006-11-22

Applicant: Naruki Kataoka ,  Taisuke Ahiko ,  Akitoshi Yoshii ,  Akira Goshima ,  Takashi Aoki ,  Tomohiro Sogabe

Inventor： Naruki Kataoka ,  Taisuke Ahiko ,  Akitoshi Yoshii ,  Akira Goshima ,  Takashi Aoki ,  Tomohiro Sogabe

IPC: B23K31/02 ,  H01L21/44

CPC classification number: H01L23/49816 ,  H01G2/065 ,  H01L23/49838 ,  H01L24/81 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/13019 ,  H01L2224/16 ,  H01L2224/16105 ,  H01L2224/81024 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/19041 ,  H05K3/3442 ,  H05K3/3457 ,  H05K3/3489 ,  H05K2201/0373 ,  H05K2201/10636 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/0485 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: A method for mounting a chip component includes the steps of: flattening a solder deposit adhering onto a land terminal of a circuit board; forming grooves on the solder deposit simultaneously with or after flattening the solder deposit; coating the solder deposit with a flux; and placing a chip component on the solder deposit with the flux interposed therebetween.

Abstract translation: 一种用于安装芯片部件的方法包括以下步骤：使粘附在电路板的焊盘端子上的焊料沉积物变平; 在焊料沉积物平坦化之后或之后在焊料沉积物上形成凹槽; 用焊剂涂覆焊料沉积物; 并且将焊料沉积物中的芯片部件放置在其间。

公开(公告)号：US07699500B2

公开(公告)日：2010-04-20

申请号：US11950884

申请日：2007-12-05

Applicant: Kyosuke Takemoto ,  Ryuji Suzuki ,  Masakazu Ohashi

Inventor： Kyosuke Takemoto ,  Ryuji Suzuki ,  Masakazu Ohashi

IPC: F21V29/00

CPC classification number: H05K1/021 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/641 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/053 ,  H05K1/183 ,  H05K3/0061 ,  H05K2201/0373 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In accordance with the present invention, a light-emitting element mounting board is provided including an enamel layer which covers the surface of a core metal, wherein reflective cup portions for mounting light-emitting elements are provided on one face of the board, and wherein a heat radiating part is formed by at least partially removing the enamel layer on the other face of the board, and exposing the core metal. Further, a light-emitting element module including light-emitting elements mounted thereon, a lighting device including the light-emitting element, a display device, and traffic signal equipment are provided.

Abstract translation: 根据本发明，提供了一种发光元件安装板，其包括覆盖芯金属表面的搪瓷层，其中用于安装发光元件的反射杯部分设置在板的一个面上，并且其中 通过至少部分地去除板的另一面上的釉层并且使芯金属露出而形成散热部。 此外，提供了一种发光元件模块，其包括安装在其上的发光元件，包括发光元件的照明装置，显示装置和交通信号灯设备。

公开(公告)号：US07629269B2

公开(公告)日：2009-12-08

申请号：US11096315

申请日：2005-03-31

Applicant: Cengiz A. Palanduz

Inventor： Cengiz A. Palanduz

IPC: H01L21/31

CPC classification number: H01G4/33 ,  H01G4/1209 ,  H01G4/20 ,  H01L2224/16225 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/0257 ,  H05K2201/0355 ,  H05K2201/0373 ,  H05K2201/09309 ,  H05K2201/09745 ,  H05K2203/0568 ,  Y10S977/773

Abstract: A method including depositing a suspension of a colloid comprising an amount of nano-particles of a ceramic material on a substrate; and thermally treating the suspension to form a thin film. A method including depositing a plurality of nano-particles of a ceramic material to pre-determined locations across a surface of a substrate; and thermally treating the plurality of nano-particles to form a thin film. A system including a computing device comprising a microprocessor, the microprocessor coupled to a printed circuit board through a substrate, the substrate comprising at least one capacitor structure formed on a surface, the capacitor structure comprising a first electrode, a second electrode, and a ceramic material disposed between the first electrode and the second electrode, wherein the ceramic material comprises columnar grains.

Abstract translation: 一种方法，包括将包含一定量的陶瓷材料的纳米颗粒的胶体悬浮液沉积在基底上; 并对悬浮液进行热处理以形成薄膜。 一种方法，包括将陶瓷材料的多个纳米颗粒沉积在衬底的表面上的预定位置; 并对多个纳米颗粒进行热处理以形成薄膜。 一种包括计算设备的系统，包括微处理器，所述微处理器通过衬底耦合到印刷电路板，所述衬底包括形成在表面上的至少一个电容器结构，所述电容器结构包括第一电极，第二电极和陶瓷 设置在第一电极和第二电极之间的材料，其中陶瓷材料包括柱状晶粒。

公开(公告)号：US20090200065A1

公开(公告)日：2009-08-13

申请号：US11994896

申请日：2006-07-05

Applicant: Kota Otoshi ,  Eiji Kono ,  Keiji Toh ,  Katsufumi Tanaka ,  Yuichi Furukawa ,  Shinobu Yamauchi ,  Ryoichi Hoshino ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa

Inventor： Kota Otoshi ,  Eiji Kono ,  Keiji Toh ,  Katsufumi Tanaka ,  Yuichi Furukawa ,  Shinobu Yamauchi ,  Ryoichi Hoshino ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa

IPC: H05K7/20

CPC classification number: H05K3/0061 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/1028 ,  H05K2203/0405 ,  Y02P70/613 ,  H01L2924/00

Abstract: A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on the second side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 formed of a high-thermal-conduction material intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5 and includes a plate-like body 10 and a plurality of projections 11 formed at intervals on one side of the plate-like body 10. The end faces of the projections 11 of the stress relaxation member 4 are brazed to the metal layer 7, whereas the side of the plate-like body 10 on which the projections 11 are not formed is brazed to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.

Abstract translation: 散热器1包括第一侧用作发热元件安装侧的绝缘基板3和固定到绝缘基板3的第二侧的散热片5.金属层7形成在第二侧 绝缘基板3与发热元件安装侧相反。 由高导热材料形成的应力松弛部件4介于绝缘基板3的金属层7和散热片5之间，并且包括板状体10和在一侧形成为间隔的多个突起11 板状体10的突起11的端面钎焊到金属层7，而没有形成突起11的板状体10的侧面钎焊到 该散热器1的材料成本低，散热性能优异。

公开(公告)号：US20090040727A1

公开(公告)日：2009-02-12

申请号：US12187737

申请日：2008-08-07

Applicant: Michael Decker

Inventor： Michael Decker

IPC: H05K7/20

CPC classification number: H05K7/205 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/115 ,  H05K1/181 ,  H05K3/429 ,  H05K2201/0373 ,  H05K2201/10416 ,  H01L2924/00

Abstract: A circuit carrier structure has at least one electronic component and is formed using SMD technology. Underneath the at least one electronic component is arranged a continuous recess in a circuit carrier. A die made of a heat-conducting material is inserted with one end of a joining area into the recess and fixed in place with a layer of heat-conducting cement and connected to the component in a heat-conducting manner. Further the die has on its other side a linkage area, whose cross-sectional area is at least in part of larger dimensions than the recess in the circuit carrier and whose end is connected to a heat sink in a heat-conducting manner.

Abstract translation: 电路载体结构具有至少一个电子部件，并且使用SMD技术形成。 所述至少一个电子部件的下方在电路载体中布置有连续的凹部。 将由导热材料制成的模具插入到连接区域的一端到凹槽中，并用导电粘合剂层固定就位，并以导热方式与组件连接。 此外，模具的另一侧具有连接区域，其横截面积至少部分地大于电路载体中的凹部的尺寸，并且其端部以导热方式连接到散热器。

公开(公告)号：US20080203546A1

公开(公告)日：2008-08-28

申请号：US12115051

申请日：2008-05-05

Applicant: John J. Maloney ,  Robert M. Smith ,  Charles H. Wilson

Inventor： John J. Maloney ,  Robert M. Smith ,  Charles H. Wilson

IPC: H01L23/495 ,  H01L21/56

CPC classification number: H01L23/49548 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K3/341 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A QFN package with improved joint solder thickness for improved second level attachment fatigue life. The copper leadframe of a QFN chip carrier is provided with rounded protrusions in both the chip attach pad region and the surrounding lead regions before second level attachment. The rounded stand-off protrusions are formed from the copper itself of the copper of the leadframe. This may be achieved by punching dimples into one surface of the copper plate of the leadframe before plating to form protrusions on the opposing surface. This method of forming the rounded protrusions simplifies the process of forming stand-offs. The protrusions provide a structure that increases wetting area and allows the use of a larger quantity of solder for increased solder joint thickness and better die paddle solder joint area coverage. As a result of the increased solder joint thickness, second level fatigue life is significantly improved. As a result of the improved die paddle solder joint area coverage, improved thermal performance of the chip carrier is also significantly improved.

Abstract translation: QFN封装，具有改进的焊点厚度，可提高二级附着疲劳寿命。 QFN芯片载体的铜引线框架在第二级附接之前在芯片连接焊盘区域和周围的引线区域中设置有圆形突起。 圆形的突出突起由引线框架的铜的铜本身形成。 这可以通过在电镀之前将凹坑冲压到引线框架的铜板的一个表面中以在相对表面上形成突起来实现。 形成圆形突起的这种方法简化了形成支座的过程。 突起提供了增加润湿面积的结构，并且允许使用更大量的焊料以增加焊接接​​头厚度和更好的焊盘焊接区域覆盖。 由于焊接接头厚度的增加，二级疲劳寿命显着提高。 由于焊盘焊接区域覆盖率的提高，芯片载体的热性能也得到了显着提高。

公开(公告)号：US20080130289A1

公开(公告)日：2008-06-05

申请号：US11950884

申请日：2007-12-05

Applicant: Kyosuke TAKEMOTO ,  Ryuji Suzuki ,  Masakazu Ohashi

Inventor： Kyosuke TAKEMOTO ,  Ryuji Suzuki ,  Masakazu Ohashi

IPC: F21V7/20 ,  F21V29/00

CPC classification number: H05K1/021 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/641 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/053 ,  H05K1/183 ,  H05K3/0061 ,  H05K2201/0373 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In accordance with the present invention, a light-emitting element mounting board is provided including an enamel layer which covers the surface of a core metal, wherein reflective cup portions for mounting light-emitting elements are provided on one face of the board, and wherein a heat radiating part is formed by at least partially removing the enamel layer on the other face of the board, and exposing the core metal. Further, a light-emitting element module including light-emitting elements mounted thereon, a lighting device including the light-emitting element, a display device, and traffic signal equipment are provided.

Abstract translation: 根据本发明，提供了一种发光元件安装板，其包括覆盖芯金属表面的搪瓷层，其中用于安装发光元件的反射杯部分设置在板的一个面上，并且其中 通过至少部分地去除板的另一面上的釉层并且使芯金属露出而形成散热部。 此外，提供了一种发光元件模块，其包括安装在其上的发光元件，包括发光元件的照明装置，显示装置和交通信号灯设备。

公开(公告)号：US20080081253A1

公开(公告)日：2008-04-03

申请号：US11905282

申请日：2007-09-28

Applicant: Tomoyuki Shose ,  Katsuyuki Kida ,  Masao Kondou ,  Yasuo Akai

Inventor： Tomoyuki Shose ,  Katsuyuki Kida ,  Masao Kondou ,  Yasuo Akai

IPC: H01M2/02

CPC classification number: H01M2/0413 ,  H01M2/0222 ,  H01M10/052 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/10462 ,  H05K2201/10643 ,  H05K2201/10659 ,  Y02P70/613 ,  Y10S228/901

Abstract: A lead plate-attached coin-type battery is constituted from a combination of a coin-type battery and a positive lead plate. In the coin-type battery, a negative cap seals the aperture of a positive outer can. In a lateral view, the positive lead plate is crank-shaped, and one end thereof is attached to the outer surface of the positive outer can of the coin-type battery. A lead plate is not attached to the negative cap. One or more projections that project in the Z axis direction are provided on the negative cap. In the lead plate-attached coin-type battery, the positive lead plate and negative cap have been attached to respective conductive lands on a circuit board by a solder reflow method.

Abstract translation: 引线板式硬币型电池由硬币型电池和正极引线板的组合构成。 在硬币型电池中，负极帽密封正外壳的孔径。 在侧视图中，正极引线板是曲柄形的，其一端连接到硬币型电池的正外壳的外表面。 引线板未连接到负极盖。 在Z轴方向上投影的一个或多个突起设置在负极盖上。 在带引线板的硬币型电池中，通过焊料回流法将正极引线板和负极盖安装在电路板上的各个导电焊盘上。

公开(公告)号：US07301106B2

公开(公告)日：2007-11-27

申请号：US11262982

申请日：2005-11-01

Applicant: Shotaro Senga

Inventor： Shotaro Senga

IPC: H05K1/16

CPC classification number: H05K3/325 ,  H01R12/57 ,  H01R13/24 ,  H05K1/11 ,  H05K3/3457 ,  H05K2201/0311 ,  H05K2201/0373 ,  H05K2201/099 ,  H05K2203/043 ,  H05K2203/0465

Abstract: In a laser beam printer, an elastic conductive member is disposed between a rotating axis of a transfer roller and a land portion of a power supply circuit board and the transfer roller is electrically connected to the power supply circuit board through the elastic conductive member. A front end portion of the elastic conductive member is pressed onto the land portion by its elastic force to come into contact with a solder pad formed on the surface of the land portion for electrical connection. A resist film is partially formed on the surface of the land portion and the solder pad is formed on the region on the land portion that is not covered with the resist film. Thus, a large contact area between the front end portion of the elastic conductive member and the solder pad is ensured so as to address a high voltage applied to the transfer roller. As a result, the transfer roller, etc. can be electrically connected to the power supply circuit board with certainty without increasing the number of components.

Abstract translation: 在激光束打印机中，弹性导电构件设置在转印辊的旋转轴线和电源电路板的接地部之间，并且转印辊通过弹性导电构件电连接到电源电路板。 弹性导电部件的前端部通过其弹性力被压接到台肩部上，以与形成在焊盘部分的表面上的焊接焊盘接触以进行电连接。 在焊盘部分的表面上部分地形成抗蚀剂膜，并且在没有被抗蚀剂膜覆盖的焊盘部分上的区域上形成焊盘。 因此，确保弹性导电构件的前端部与焊盘之间的大的接触面积，以解决施加到转印辊的高电压。 结果，转印辊等可以确实地电连接到电源电路板，而不增加部件的数量。

公开(公告)号：US20070181642A1

公开(公告)日：2007-08-09

申请号：US11496593

申请日：2006-08-01

Applicant: Yoshiyuki Hiroshima

Inventor： Yoshiyuki Hiroshima

IPC: A47J36/02

CPC classification number: H05K3/3442 ,  B23K1/0016 ,  B23K2101/36 ,  H05K2201/0373 ,  H05K2201/10242 ,  H05K2203/1178 ,  Y02P70/613

Abstract: The present invention is an electrode 10 so provided as to be soldered to an electronic component 12 and, when the electronic component 12 is mounted on a substrate 13, soldered to the substrate 13. The electrode 10 includes a column-like electrode body 11 soldered to the electronic component 12 and to the substrate 13. The electrode has grooves as an air discharging device discharging the air 15a in air voids 15 generated within the solder 14 between joint surfaces 11a, 11b of the electrode body 11 and the electronic component 12 or the substrate 13 when the electrode body 11 is soldered to the electronic component 12 or the substrate 13.

Abstract translation: 本发明是一种电极10，其被设置为焊接到电子部件12上，并且当将电子部件12安装在基板13上时焊接到基板13.电极10包括焊接的柱状电极体11 电子部件12和基板13.电极具有作为排气装置的槽，用于将电极体11的接合面11a，11b之间的焊料14内产生的空气15内的空气15a排出， 当电极体11焊接到电子部件12或基板13上时，部件12或基板13。