中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

186 records (took 0.018 seconds)

    Electrical Interconnection System
    22.
    发明申请
    Electrical Interconnection System 审中-公开
    电气互连系统

    公开(公告)号：US20100134995A1

    公开(公告)日：2010-06-03

    申请号：US12628805

    申请日：2009-12-01

    Applicant: Julie N. Strickland

    Inventor： Julie N. Strickland

    IPC: H05K1/11

    CPC classification number: H05K3/365 ,  H01R12/721 ,  H01R13/639 ,  H01R24/60 ,  H01R2107/00 ,  H05K1/142 ,  H05K3/325 ,  H05K3/4015 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09163 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10409

    Abstract: According to one embodiment, an electrical interconnection system includes a pair of printed wiring boards formed of a printed wiring board material. Each printed wiring board has multiple surface pads formed on a surface of the printed wiring board adjacent its outer edge. The surface of each printed wiring board is operable to be placed adjacent to one another such that an electrical circuit coupled to one printed wiring board is electrically coupled to another electrical circuit of the other printed wiring board by contact of the surface pads of each printed wiring board with one another.

    Abstract translation: 根据一个实施例，电互连系统包括由印刷线路板材料形成的一对印刷线路板。 每个印刷电路板具有形成在印刷电路板的与其外边缘相邻的表面上的多个表面焊盘。 每个印刷线路板的表面可操作以彼此相邻放置，使得耦合到一个印刷线路板的电路通过每个印刷线路的表面焊盘的接触电耦合到另一个印刷线路板的另一个电路 彼此之间。

    METHOD FOR PRODUCING MULTILAYER CERAMIC SUBSTRATE
    25.
    发明申请
    METHOD FOR PRODUCING MULTILAYER CERAMIC SUBSTRATE 有权
    生产多层陶瓷基板的方法

    公开(公告)号：US20080135155A1

    公开(公告)日：2008-06-12

    申请号：US12029545

    申请日：2008-02-12

    Applicant: Akiyoshi KAWAMURA ,  Takayuki TSUKIZAWA ,  Tetsuya IKEDA

    Inventor： Akiyoshi KAWAMURA ,  Takayuki TSUKIZAWA ,  Tetsuya IKEDA

    IPC: C03B29/00

    CPC classification number: H05K3/0052 ,  H01L21/4807 ,  H05K1/0272 ,  H05K1/0306 ,  H05K3/4614 ,  H05K3/4629 ,  H05K2201/0909 ,  H05K2201/09163 ,  H05K2201/09781 ,  Y10T428/166

    Abstract: In a method for producing a multilayer ceramic substrate, a green ceramic laminate includes green conductive patterns arranged on a plurality of ceramic green sheets and portions to be formed into a plurality of multilayer ceramic substrates. Boundary-defining conductive patterns are arranged on the ceramic green sheets and along boundaries of the multilayer ceramic substrates. The boundary-defining conductive patterns have firing shrinkage characteristics that are different from those of the ceramic green sheets. During firing of the green ceramic laminate, cavities adjacent to edges of the boundary-defining conductive patterns are formed. A sintered ceramic laminate is divided at edges passing through the cavities.

    Abstract translation: 在多层陶瓷基板的制造方法中，生坯陶瓷层叠体包括布置在多个陶瓷生片上的绿色导电图案和形成多个多层陶瓷基板的部分。 边界限定导电图案布置在陶瓷生片上并沿着多层陶瓷基片的边界。 边界限定导电图案具有与陶瓷生片不同的焙烧收缩特性。 在焙烧生坯陶瓷层压板期间，形成与边界限定导电图案的边缘相邻的空腔。 烧结的陶瓷层压体在通过空腔的边缘处分开。

    Connection structure for printed wiring board
    26.
    发明授权
    Connection structure for printed wiring board 失效
    印刷线路板连接结构

    公开(公告)号：US07371074B2

    公开(公告)日：2008-05-13

    申请号：US10554959

    申请日：2004-04-23

    Applicant: Shinji Uchida ,  Hiroshi Yamane ,  Akihito Funakoshi ,  Kazuto Miura

    Inventor： Shinji Uchida ,  Hiroshi Yamane ,  Akihito Funakoshi ,  Kazuto Miura

    IPC: H01R12/00

    CPC classification number: H01R12/79 ,  H05K3/365 ,  H05K2201/09163

    Abstract: The present invention relates to a connection structure for a printed wiring board to be electrically connected to a FPC. The FPC has an elongated substrate, and plural conductors are laminated on a surface of the substrate for extending along an axial direction of the substrate. The printed wiring board has an insertion opening provided at an edge surface for being inserted by a top end portion of the FPC, and plural line connecting terminals formed on an internal wall surface of the insertion opening. The top end portion of the FPC has a slider including plural elastic deformable first contacts, and a first housing for holding the plurality of contacts. The FPC is inserted into the insertion opening of the printed wiring board such that one end of the first contact presses the conductor and the other end of the first contact presses the line connecting terminal. The FPC can be connected to the printed wiring board on an edge surface thereof, allowing circuit elements to be mounted in high density, and improving freedom in designing wiring patterns.

    Abstract translation: 本发明涉及一种与FPC电连接的印刷电路板的连接结构。 FPC具有细长基板，并且多个导体层叠在基板的表面上，以沿着基板的轴向延伸。 印刷电路板具有设置在边缘表面处以由FPC的顶端部分插入的插入开口，以及形成在插入开口的内壁表面上的多个线连接端子。 FPC的顶端部具有滑动件，该滑块包括多个弹性变形的第一触点，以及用于保持多个触点的第一壳体。 FPC被插入到印刷线路板的插入口中，使得第一接触的一端压住导体，并且第一接触的另一端压入线路连接端子。 FPC可以在其边缘表面上连接到印刷线路板，从而允许电路元件以高密度安装，并提高设计布线图案的自由度。

    Connection structure of printed wiring board
    27.
    发明申请
    Connection structure of printed wiring board 失效
    印刷线路板的连接结构

    公开(公告)号：US20060281361A1

    公开(公告)日：2006-12-14

    申请号：US10554693

    申请日：2004-03-23

    Applicant: Shinji Uchida ,  Hideyasa Yamada ,  Akihito Funakoshi

    Inventor： Shinji Uchida ,  Hideyasa Yamada ,  Akihito Funakoshi

    IPC: H01R12/24

    CPC classification number: H01R12/79 ,  H01R13/025 ,  H01R13/05 ,  H05K3/365 ,  H05K3/4092 ,  H05K2201/09163

    Abstract: An FPC is electrically connected to a printed wiring board. The FPC includes an elongated substrate and a conductor part laminated on the face of the substrate. The conductor part includes a plurality of conductors extending along the axial direction of the substrate, and elastically deformable first contact terminals each of which extends from the face of the conductors toward the base end of the FPC. The printed wiring board includes an insertion opening formed at the edge surface thereof, and plural line connecting terminals which are formed on the internal wall surface of the insertion opening, and which extend in the inserting direction for inserting the FPC.

    Abstract translation: FPC与印刷电路板电连接。 FPC包括细长基板和层压在基板的表面上的导体部分。 导体部分包括沿着基板的轴向延伸的多个导体，以及可弹性变形的第一接触端子，每个接触端子从导体的表面延伸到FPC的基端。 印刷电路板包括形成在其边缘表面处的插入孔和形成在插入开口的内壁表面上并且在插入FPC的插入方向上延伸的多个线连接端子。

    Printed wiring board connection structure
    28.
    发明申请
    Printed wiring board connection structure 失效
    印刷电路板连接结构

    公开(公告)号：US20060281343A1

    公开(公告)日：2006-12-14

    申请号：US10554692

    申请日：2004-04-23

    Applicant: Shinji Uchida ,  Hiroshi Yamane ,  Wataru Sugihara

    Inventor： Shinji Uchida ,  Hiroshi Yamane ,  Wataru Sugihara

    IPC: H01R12/00

    CPC classification number: H05K3/363 ,  H05K2201/09163 ,  H05K2201/10666

    Abstract: The present invention relates to a connection structure for a printed wiring board to be electrically connected to a FPC. The FPC comprises a long substrate, a plurality of conductors laminated on the surface of the substrate and extending along an axial direction of the substrate. The printed wiring board comprises a planar main wiring board, an insertion opening, and a plurality of the through-hole terminals. Each of the conductors of the FPC abuts the through-hole terminal upon the insertion of the FPC into the insertion opening of the printed wiring board. According to the invention, a connector structure to be connected to FPC is provided inside the printed wiring board in order to mount circuit element in high density, and thus improve degree of freedom in designing wiring pattern.

    Abstract translation: 本发明涉及一种与FPC电连接的印刷电路板的连接结构。 FPC包括长基板，层叠在基板的表面上并沿着基板的轴向延伸的多个导体。 印刷电路板包括平面主配线板，插入开口和多个通孔端子。 在将FPC插入印刷电路板的插入口中时，FPC的每个导体与通孔端子抵接。 根据本发明，为了安装高密度的电路元件，在印刷电路板的内部设置有连接到FPC的连接器结构，从而提高了布线图案的设计自由度。

    Connection structure of printed wiring board
    29.
    发明申请
    Connection structure of printed wiring board 失效
    印刷线路板的连接结构

    公开(公告)号：US20060234521A1

    公开(公告)日：2006-10-19

    申请号：US10554741

    申请日：2004-03-23

    Applicant: Shinji Uchida ,  Yoshiyuki Nakai ,  Tadashi Inoue

    Inventor： Shinji Uchida ,  Yoshiyuki Nakai ,  Tadashi Inoue

    IPC: H05K1/00

    CPC classification number: H05K3/365 ,  H01R12/728 ,  H05K1/117 ,  H05K2201/09163 ,  H05K2201/10189 ,  H05K2201/10265

    Abstract: A connecting structure is for a printed wiring board to be electrically connected to a FPC. The FPC includes a substrate and electro-conductive portions. The printed wiring board includes an insertion opening provided on an edge surface thereof, and line connecting terminals formed on an inner wall face of the insertion opening. A dual in-line contact member including first contact members is fixed to the top end portion of the FPC. Each first contact member includes a main body, and a first arm and a second arm extending from the main body generally in parallel to each other. Furthermore, the first arm and the second arm are bent at bent portions so as to form curves protruding away from each other. With the present embodiment, at least one of the first arm and the second arm press the corresponding line connecting terminal provided within the insertion opening at the bent portion thereof by inserting the FPC to the insertion opening of the printed wiring board. Thus, the FPC is connected to the edge surface of the printed wiring board. This improves the freedom from the perspective of design of the wiring pattern as well as allowing mounting of circuit components with high circuit density.

    Abstract translation: 连接结构用于印刷线路板与FPC电连接。 FPC包括基板和导电部分。 印刷电路板包括设置在其边缘表面上的插入开口和形成在插入开口的内壁面上的线连接端子。 包括第一接触构件的双列直线接触构件固定到FPC的顶端部分。 每个第一接触构件包括主体，并且第一臂和第二臂大体上彼此平行地从主体延伸。 此外，第一臂和第二臂在弯曲部弯曲，以形成彼此远离的曲线。 在本实施例中，通过将FPC插入印刷电路板的插入口，第一臂和第二臂中的至少一个通过将FPC设置在插入口内的相应的线连接端子的弯曲部分处。 因此，FPC连接到印刷线路板的边缘表面。 这提高了从布线图案的设计的角度的自由度以及允许安装具有高电路密度的电路部件。

    Unit type clip lead terminal, clip lead terminal connecting method, lead terminal connecting board, and method of producing board with lead terminals
    30.
    发明授权
    Unit type clip lead terminal, clip lead terminal connecting method, lead terminal connecting board, and method of producing board with lead terminals 失效
    单元型夹子引线端子，夹子引线端子连接方法，引线端子连接板以及带引线端子的板材的制造方法

    公开(公告)号：US06320247B2

    公开(公告)日：2001-11-20

    申请号：US08818994

    申请日：1997-03-17

    Applicant: Akira Sakamoto

    Inventor： Akira Sakamoto

    IPC: H01L2348

    CPC classification number: H05K3/4092 ,  H01R12/58 ,  H01R12/721 ,  H01R43/205 ,  H05K3/3405 ,  H05K3/4623 ,  H05K2201/09163 ,  H05K2201/0919 ,  H05K2201/09536 ,  H05K2201/1034 ,  H05K2201/10386 ,  H05K2201/10924

    Abstract: There is provided a technique of connecting easily the lead terminal to the board of the module. A plurality of clip lead terminals each has at one end thereof clip portions which are connected electrically to connecting terminals by sandwiching an end portion of a board of a module and the connecting terminals formed thereon between clip members of said clip portions and has a lead portion at the other end thereof. The clip lead terminals are arranged so as to be spaced from one another in parallel with one another with the leading edges of the respective clip portions aligned on a straight line. The clip lead terminals are connected to one another through a tie bar and a guide as a connecting portion, respectively, whereby the connecting clip lead terminal 18 is formed as one-body. The lead portions are bent on every other one, leading end portions of the bent lead portions and leading end portions of the non-bent lead portions are in parallel with each other viewing from a side of the board.

    Abstract translation: 提供了将引线端子容易地连接到模块的板的技术。 多个夹子引线端子的一端具有通过夹持模块的板的端部而电连接到连接端子的夹持部分，并且形成在其上的连接端子在所述夹持部分的夹子部件之间并具有引线部分 在另一端。 夹子引线端子被布置成彼此平行地彼此分开，各个夹子部分的前缘在直线上对准。 夹子引线端子分别通过连接杆和引导件彼此连接，由此将连接夹引线端子18形成为一体。 引线部分彼此弯曲，弯曲引线部分的前端部分和非弯曲引线部分的前端部分彼此平行，从板的侧面观察。

Patent Agency Ranking