公开(公告)号：US20070035372A1

公开(公告)日：2007-02-15

申请号：US11435786

申请日：2006-05-18

Applicant: Asao Ishikawa ,  Yuji Ichikawa

Inventor： Asao Ishikawa ,  Yuji Ichikawa

IPC: H01F27/02

CPC classification number: H01F27/292 ,  H01F19/04 ,  H01F27/2828 ,  H01F2017/067 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09172 ,  H05K2201/1003 ,  H05K2201/10287

Abstract: It is intended to provide a surface mount transformer which can be mounted without affecting the configuration of the wiring pattern of a printed wiring board. For that purpose, the transformer includes, a transformer body 10 configured by winding a winding on a ferrite core, and a seating 20 that has an insulating substrate 21 having a size necessary to place said transformer body thereon, a wiring pattern formed on at least one surface thereof, and connection terminals 22 for connecting the edges of the winding formed on the circumference of said insulating substrate.

Abstract translation: 旨在提供一种可安装的表面贴装变压器，而不影响印刷电路板的布线图案的构造。 为此，变压器包括通过将绕组卷绕在铁氧体磁芯上而构成的变压器主体10和具有绝缘基板21的座部20，该绝缘基板21具有将所述变压器主体放置在其上的必要尺寸，至少形成有布线图案 一个表面，以及用于连接形成在所述绝缘基板的圆周上的绕组的边缘的连接端子22。

公开(公告)号：US20060001181A1

公开(公告)日：2006-01-05

申请号：US11223260

申请日：2005-09-12

Applicant: Seok Jun

Inventor： Seok Jun

IPC: H01L29/739

CPC classification number: H05K3/3442 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/48227 ,  H01L2924/09701 ,  H05K2201/09172 ,  H05K2201/10727 ,  Y02P70/613

Abstract: Disclosed is a terminal structure of a multi-layer substrate and a method for forming the same. In the terminal structure, a plurality of terminals are formed on at least two adjacent substrate layers, each of the terminals being spaced from adjacent ones to a predetermined interval. Openings are formed in at least one of the substrate layers. Each of the openings is formed between each adjacent ones of first terminals in the at least one substrate layer, and spaced from the each first terminals to a predetermined gap, and has a size same as that of the first terminals. The substrate layers are stacked one atop another and compressed together so that second terminals formed on at least one corresponding substrate layer are projected to a plane of an outermost substrate layer on which corresponding terminals are formed. The terminal structure and the method can secure a predetermined interval to a plurality of terminals in a package when the terminals are formed as well as simplify formation thereof.

Abstract translation: 公开了多层基板的端子结构及其形成方法。 在端子结构中，在至少两个相邻的基板层上形成多个端子，每个端子与相邻的基板间隔开至预定间隔。 开口形成在至少一个基板层中。 每个开口形成在至少一个基板层中的每个相邻的第一端子之间，并且与每个第一端子间隔开至预定的间隙，并且具有与第一端子的尺寸相同的尺寸。 将基板层叠在一起并压缩在一起，使形成在至少一个对应基板层上的第二端子突出到形成相应端子的最外层基板层的平面上。 当端子形成时，端子结构和方法可以确保封装中的多个端子的预定间隔，并且简化其形成。

公开(公告)号：US20050285713A1

公开(公告)日：2005-12-29

申请号：US10533035

申请日：2003-10-28

Applicant: Takahiro Kuriyama

Inventor： Takahiro Kuriyama

IPC: H01C1/16 ,  H01C13/02 ,  H05K3/34 ,  H01C1/02

CPC classification number: H05K3/3442 ,  H01C1/16 ,  H01C13/02 ,  H05K2201/09172 ,  H05K2201/10045 ,  Y02P70/613

Abstract: A fixed resistor network has an insulating substrate, a plurality of film resistors arranged on a top surface of the insulating substrate, terminal electrodes formed for the film resistors on each lengthwise sidewall of the insulating substrate at a given pitch along the sidewall, and recesses provided between the terminal electrodes. The occurrence of solder bridges between the terminal electrodes during solder mounting and the occurrence of chipping in the terminal-electrode-forming areas between the recesses on the lengthwise sidewall are both reduced by making the width of the recesses along the lengthwise sidewall either 0.44 to 0.48 times or 0.525 to 0.625 times the pitch.

Abstract translation: 固定电阻网络具有绝缘基板，布置在绝缘基板的顶表面上的多个薄膜电阻器，沿着侧壁以给定的间距为绝缘基板的每个纵向侧壁上的薄膜电阻器形成的端子电极和设置的凹部 在端子电极之间。 在焊接安装期间在端子电极之间出现焊接桥，并且在纵向侧壁上的凹部之间的端子电极形成区域中发生切屑的情况都通过使沿着纵向侧壁的凹部的宽度为0.44至0.48 次或0.525到0.625倍。

公开(公告)号：US20050252683A1

公开(公告)日：2005-11-17

申请号：US11078123

申请日：2005-03-09

Applicant: Chi-Hsing Hsu

Inventor： Chi-Hsing Hsu

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/115 ,  H05K3/403 ,  H05K3/4602 ,  H05K2201/09172 ,  H05K2201/09645 ,  H05K2201/09854 ,  H05K2203/1476

Abstract: A circuit substrate and a method of manufacturing a slot-shaped plated through slot thereon are provided. The circuit substrate has a linear slot. A slot-shaped plated through hole with a multiple transmission paths is formed in the linear slot so that a multiple of signals can be transmitted through the linear slot at one time. The circuit substrate and the method of manufacturing the slot-shaped plated through hole thereon can increase the level of integration of the circuit, decrease the average routing length of the circuit, boost the production efficiency and lower the production cost.

Abstract translation: 提供电路基板及其上形成槽形电镀通孔的方法。 电路基板具有线性槽。 在线性槽中形成具有多个传输路径的槽形电镀通孔，以便一次可以通过线性槽传输多个信号。 电路基板和其上形成槽形电镀通孔的方法可以增加电路的集成度，降低电路的平均布线长度，提高生产效率并降低生产成本。

公开(公告)号：US20040114338A1

公开(公告)日：2004-06-17

申请号：US10321991

申请日：2002-12-17

Inventor： Raymond J. Blasko ,  Mark Wayne Smith

IPC: H05K007/02

CPC classification number: H01R13/113 ,  H01R12/721 ,  H05K1/0263 ,  H05K1/117 ,  H05K2201/09172 ,  H05K2201/09481

Abstract: An electrical connection system is provided that includes a circuit board having a substrate layer with a projection. Electrically conductive contact pads are disposed on each side of the projection and electrically connected together by a plated through hole. An electrical connection system is provided including the circuit board and a high current terminal.

Abstract translation: 提供了一种电连接系统，其包括具有带突起的基底层的电路板。 导电接触焊盘设置在突起的每一侧，并通过电镀通孔电连接在一起。 提供包括电路板和高电流端子的电连接系统。

公开(公告)号：US20020015290A1

公开(公告)日：2002-02-07

申请号：US09915682

申请日：2001-07-26

Inventor： Johannes Franciscus Adrianus Reniers

IPC: H05K001/14

CPC classification number: H05K3/366 ,  H01R12/52 ,  H05K2201/048 ,  H05K2201/09172

Abstract: In a system comprising two printed circuit boards, each printed circuit board is provided with at least one electrical contact element for electrically interconnecting the printed circuit boards. One of the electrical contact elements comprises at least one electroconductive pin formed from one of the printed circuit boards, while the other electrical contact element is formed by at least one hole in the other printed circuit board, a wall of said hole being covered with an electrically conducting layer.

Abstract translation: 在包括两个印刷电路板的系统中，每个印刷电路板设置有用于电连接印刷电路板的至少一个电接触元件。 电接触元件中的一个包括由一个印刷电路板形成的至少一个导电销，而另一个电接触元件由另一个印刷电路板中的至少一个孔形成，所述孔的壁被覆盖有 导电层。

公开(公告)号：US06195257B1

公开(公告)日：2001-02-27

申请号：US09248963

申请日：1999-02-13

Applicant: George M. Janicek ,  Rui Liu ,  Anthony J. Scocca

Inventor： George M. Janicek ,  Rui Liu ,  Anthony J. Scocca

IPC: H05K720

CPC classification number: H05K3/366 ,  H05K1/0203 ,  H05K7/209 ,  H05K2201/048 ,  H05K2201/09172

Abstract: A module mount for use in electrically and mechanically mounting an encapsulated power rectifier module, having a plurality of rigid leads protruding from a major mounting surface thereof, in an orientation in which the major mounting surface is substantially normal with respect to a substantially planar circuit board. In one embodiment, the module mount includes (1) a substantially planar substrate having a plurality of apertures located to register with the plurality of rigid leads and (2) a plurality of power conductors, associated with the plurality of apertures, that electrically couple the plurality of rigid leads to an edge interface on the substrate, the edge interface adapted to be coupled to the circuit board.

Abstract translation: 一种用于电气和机械安装封装的功率整流器模块的模块安装座，其具有从其主要安装表面突出的多个刚性引线，其中所述主安装表面相对于基本上平面的电路板基本上是正常的 。 在一个实施例中，模块安装件包括（1）基本平坦的基板，具有多个孔，定位成与多个刚性引线对准，和（2）多个电源导体，其与多个孔相关联， 多个刚性引线到衬底上的边缘接口，边缘接口适于耦合到电路板。

公开(公告)号：US5844468A

公开(公告)日：1998-12-01

申请号：US855813

申请日：1997-05-12

Applicant: Masato Doi ,  Yoshinori Matsumoto

Inventor： Masato Doi ,  Yoshinori Matsumoto

IPC: H01C1/144 ,  H01C13/02 ,  H01C17/00 ,  H01C17/02 ,  H01G4/40 ,  H05K1/09 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H01C1/02

CPC classification number: H01G4/40 ,  H01C1/144 ,  H01C13/02 ,  H01C17/006 ,  H01C17/02 ,  H05K3/403 ,  H05K1/092 ,  H05K2201/09172 ,  H05K2201/09854 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061

Abstract: Disclosed is a chip network electronic component prevents a short circuit between adjacent electrodes upon soldering, and the strength of the projecting portion is increased to improve reliability. The chip network electronic component includes an insulator substrate having recessed portions in opposite side surfaces to have a plurality of pairs of projecting portions. Electrodes are formed respectively at the projecting portions so as to extend from a main surface to a back surface of the substrate. Electrical elements are each formed on the main surface of the substrate to electrically connect between one pair of the electrodes. A coating layer covers a surface of the electrical elements. The recessed portion includes a pair of opposite flat planes and a flat-planed bottom connecting between the flat planes. The flat plane and the bottom has a connecting portion formed therebetween to have a curvature of 0.1 mm or greater.

Abstract translation: 披露了芯片网络电子部件防止焊接时相邻电极之间的短路，并且突出部分的强度增加以提高可靠性。 芯片网络电子部件包括具有在相对侧表面中具有多个突出部分的多个凹部的绝缘体基板。 在突出部分分别形成电极，以便从基板的主表面延伸到后表面。 电气元件各自形成在基板的主表面上以电连接在一对电极之间。 涂层覆盖电气元件的表面。 凹部包括一对相对的平面和连接在平面之间的平坦的平面。 平面和底部具有形成在其间的连接部分，具有0.1mm或更大的曲率。

公开(公告)号：US5668698A

公开(公告)日：1997-09-16

申请号：US589689

申请日：1996-01-22

Applicant: Andrew Joseph Jozwiak ,  Melodee Ann Chapin

Inventor： Andrew Joseph Jozwiak ,  Melodee Ann Chapin

IPC: B60R16/02 ,  B60R16/023 ,  H05K1/00 ,  H05K1/11 ,  H05K5/00 ,  H05K5/06

CPC classification number: B60R16/0238 ,  H05K1/119 ,  H05K5/0026 ,  H05K5/06 ,  H05K1/0284 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09172

Abstract: A smart connector for an electrical device comprising: a circuit board including a flat surface for receiving at least one surface-mounted circuit component, a plurality of extending male blades formed in a first end of the circuit board, a plurality of female receptacles formed at a second end of the circuit board opposite the first end, wherein (i) an exterior of each of the extending male blades, (ii) an interior of each of the female receptacles and (iii) a select portion of the flat surface all include electrically conductive circuit traces; and a connector housing having a first end with a plurality of female terminal receptacles for terminating a wiring harness, a body portion for housing the circuit board and a second end, wherein the male blades are each received in a separate one of the plurality of female terminal receptacles and wherein the plurality of female receptacles are located at the second end of the housing for receiving a set of extending male terminals of an electrical device. The smart connector is capable of being sealed to the electrical device to provide protection of the circuit board from an environment outside the housing.

Abstract translation: 一种用于电气设备的智能连接器，包括：电路板，包括用于接收至少一个表面安装电路部件的平坦表面，形成在所述电路板的第一端中的多个延伸的阳片，多个阴插座，形成在 所述电路板的与所述第一端相对的第二端，其中（i）每个所述延伸阳片的外部，（ii）每个所述插座的内部，和（iii）所述平坦表面的选择部分全部包括 导电电路迹线; 以及连接器壳体，其具有第一端部，该第一端部具有用于端接线束的多个阴性端子插座，用于容纳电路板的主体部分和第二端，其中所述阳性叶片各自容纳在所述多个母体中的单独的一个中 端子插座，并且其中多个阴插座位于壳体的第二端处，用于接收一组电气设备的延伸的阳端子。 智能连接器能够被密封到电气设备，以便将电路板与壳体外部的环境保护起来。

公开(公告)号：US5602422A

公开(公告)日：1997-02-11

申请号：US491229

申请日：1995-06-16

Applicant: Randolph D. Schueller ,  David J. Windschitl

Inventor： Randolph D. Schueller ,  David J. Windschitl

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/498 ,  H05K1/02 ,  H05K3/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K3/363 ,  H01L23/49816 ,  H01L24/50 ,  H01L2924/14 ,  H05K1/0271 ,  H05K2201/0397 ,  H05K2201/09109 ,  H05K2201/09172 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K3/0058 ,  H05K3/326 ,  H05K3/4007

Abstract: A flexible circuit construction includes a polymeric sheet, via holes in the sheet and metal circuitry disposed on the sheet. The circuitry terminates at a cantilever end partially spanning the via hole to which a solder ball is subsequently attached. The cantilever end allows the solder ball to move relative to the flexible circuit and thus compensate for misalignment and-differential thermal expansion effects.

Abstract translation: 柔性电路结构包括聚合物片材，片材中的通孔和设置在片材上的金属电路。 电路终止于部分跨越随后连接焊球的通孔的悬臂端。 悬臂端允许焊球相对于柔性电路移动，从而补偿不对准和差动热膨胀效应。