中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

36 records (took 0.016 seconds)

    IMPRINTED MULTI-LAYER MICRO-STRUCTURE METHOD WITH MULTI-LEVEL STAMP
    24.
    发明申请
    IMPRINTED MULTI-LAYER MICRO-STRUCTURE METHOD WITH MULTI-LEVEL STAMP 有权
    具有多层压印的多层微结构方法

    公开(公告)号：US20150060393A1

    公开(公告)日：2015-03-05

    申请号：US14012173

    申请日：2013-08-28

    Applicant: RONALD STEVEN COK

    Inventor： RONALD STEVEN COK

    IPC: H05K3/12

    CPC classification number: H05K1/0274 ,  H05K1/0298 ,  H05K1/097 ,  H05K3/0041 ,  H05K3/12 ,  H05K3/1258 ,  H05K3/1275 ,  H05K3/1283 ,  H05K3/1291 ,  H05K3/465 ,  H05K3/4685 ,  H05K2201/09209 ,  H05K2201/09281 ,  H05K2201/0979 ,  H05K2201/09845 ,  H05K2203/0108

    Abstract: A method of making an imprinted micro-wire structure includes providing a substrate, a first stamp, and a different multi-level second stamp. A curable bottom layer is provided over the substrate. One or more bottom-layer micro-channels) are imprinted in the curable bottom layer with the first stamp and a bottom-layer micro-wire formed in each bottom-layer micro-channel. A curable multi-layer is formed adjacent to and in contact with the cured bottom layer. First and second multi-layer micro-channels and a top-layer micro-channel are imprinted in the curable multi-layer with the multi-level second stamp. Either two bottom-layer micro-wires are electrically connected through the first and second multi-layer micro-wires and a top-layer micro-wire or two top-layer micro-wires are electrically connected through the first and second multi-layer micro-wires and a bottom-layer micro-wire.

    Abstract translation: 制造压印微线结构的方法包括提供衬底，第一印模和不同的多级第二印模。 在基板上设置可固化的底层。 一个或多个底层微通道）印刷在可固化底层中，第一印模和底层微线形成在每个底层微通道中。 在固化的底层附近形成可固化的多层，并且与固化的底层接触。 第一和第二多层微通道和顶层微通道用多级第二印记印在可固化多层中。 两个底层微电线通过第一和第二多层微线电连接，并且顶层微线或两个顶层微线通过第一和第二多层微电子电连接 电线和底层微线。

    Imprinted multi-layer micro structure method
    25.
    发明授权
    Imprinted multi-layer micro structure method 有权
    印刷多层微结构法

    公开(公告)号：US08932474B1

    公开(公告)日：2015-01-13

    申请号：US14012150

    申请日：2013-08-28

    Applicant: Ronald Steven Cok

    Inventor： Ronald Steven Cok

    IPC: H01B13/00 ,  H05K3/46 ,  H05K3/12 ,  H05K3/00

    CPC classification number: H05K1/0274 ,  H05K1/0298 ,  H05K1/097 ,  H05K3/0041 ,  H05K3/12 ,  H05K3/1258 ,  H05K3/1275 ,  H05K3/1283 ,  H05K3/1291 ,  H05K3/465 ,  H05K3/4685 ,  H05K2201/09209 ,  H05K2201/09281 ,  H05K2201/0979 ,  H05K2201/09845 ,  H05K2203/0108

    Abstract: A method of making an imprinted micro-wire structure includes providing a substrate and first, second, and third different stamps. A curable first layer is provided in relation to a substrate and imprinted with first, second, and third micro-channels using the first stamp. First, second, and third micro-wires are formed in the first, second, and third micro-channels. A curable second layer is provided adjacent to the first layer and imprinted with first and second connecting micro-channels. First and second connecting micro-wires are formed in the first and second connecting micro-channels. A curable third layer is provided and imprinted with a bridge micro-channel and a bridge micro-wire formed in the bridge micro-channel. The first and second micro-wires, the first and second connecting micro-wires, and the bridge micro-wire are electrically connected and electrically isolated from the third micro-wire.

    Abstract translation: 制作印刷微线结构的方法包括提供基底和第一，第二和第三不同的印记。 相对于基板设置可固化的第一层，并使用第一印模印刷第一，第二和第三微通道。 在第一，第二和第三微通道中形成第一，第二和第三微细线。 可固化的第二层被设置成与第一层相邻并且印有第一和第二连接微通道。 第一和第二连接微线形成在第一和第二连接微通道中。 提供可固化的第三层并印刷桥接微通道和形成在桥式微通道中的桥式微型电线。 第一和第二微型电线，第一和第二连接微线以及桥式微型电线与第三微型电线电连接并电隔离。

Patent Agency Ranking