公开(公告)号：US06828512B2

公开(公告)日：2004-12-07

申请号：US10267158

申请日：2002-10-08

Applicant: C. Key Chung ,  Sook Chien Chan ,  Kum Foo Leong

Inventor： C. Key Chung ,  Sook Chien Chan ,  Kum Foo Leong

IPC: H05K116

CPC classification number: H05K3/3436 ,  H05K1/113 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2201/10992 ,  H05K2203/043 ,  H05K2203/0455 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A substrate has at least one via-in-pad that includes a bond pad and a bore. In addition, the substrate has a plug coupled to the at least one via-in-pad, the plug has a first conductive material and adapted to couple with a solder ball having a second conductive material, the first conductive material having a higher reflow temperature than the second conductive material.

Abstract translation: 衬底具有至少一个包括焊盘和孔的通孔内焊盘。 另外，衬底具有耦合到至少一个通孔焊盘中的插塞，该插头具有第一导电材料并且适于与具有第二导电材料的焊料球耦合，第一导电材料具有较高的回流温度 比第二导电材料。

公开(公告)号：US20040238211A1

公开(公告)日：2004-12-02

申请号：US10474427

申请日：2004-06-17

Inventor： Yuki Momokawa ,  Eiichi Kono ,  Masaru Saitou ,  Kazuhiko Tanabe

IPC: H05K001/11 ,  H05K003/34

CPC classification number: H05K3/3426 ,  H05K1/0201 ,  H05K1/09 ,  H05K1/114 ,  H05K3/0094 ,  H05K3/3415 ,  H05K3/3421 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3468 ,  H05K3/3494 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/09263 ,  H05K2201/09572 ,  H05K2201/09727 ,  H05K2201/10909 ,  H05K2201/2054 ,  H05K2203/0191 ,  H05K2203/047 ,  H05K2203/081 ,  H05K2203/1105 ,  H05K2203/1121 ,  H05K2203/1394 ,  H05K2203/304 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A through hole 2 in a circuit board 1 and to be joined to a lead 5 in a surface mounting component 6 is prepared from a material such as nickel, and palladium having a thermal conductivity equal to or less than 100 W/m.K, the circuit board 1 involving a alloy layer composed of at least a member selected from elements of solder 8, a pad 7, and the lead 5 in a solder joined site of the lead 5 and the pad 7, whereby a quantity of heat transmitted to the joined site via the through hole 2 is reduced at the time when wave-soldering is applied to the back of the circuit board 1 after the surface mounting component 6 was mounted, so that the joined site is maintained at a temperature equal to or less than a melting point of the alloy layer, and hence, exfoliation in an interface of the joined site is prevented, and reliability in the joint of the lead 5 and the pad 7 is elevated.

Abstract translation: 电路板1中的通孔2并且与表面安装部件6中的引线5接合，由诸如镍的材料和热导率等于或小于100W / mK的钯制成，电路 板1，其包括在引线5和焊盘7的焊料接合部位中至少由焊料8，焊盘7和引线5的元件组成的合金层，由此传递到接合部 在安装表面安装部件6之后，当在电路板1的背面上施加波峰焊时，通过通孔2的位置被减小，使得接合部位保持在等于或小于 合金层的熔点，因此防止了接合部位的界面的剥离，引线5和焊盘7的接头的可靠性提高。

公开(公告)号：US06705505B2

公开(公告)日：2004-03-16

申请号：US10278917

申请日：2002-10-24

Applicant: Fumio Yoshikawa ,  Hideyuki Fukasawa ,  Mitsugu Shirai ,  Hideaki Sasaki ,  Toshitaka Murakawa ,  Kenichi Hamamura

Inventor： Fumio Yoshikawa ,  Hideyuki Fukasawa ,  Mitsugu Shirai ,  Hideaki Sasaki ,  Toshitaka Murakawa ,  Kenichi Hamamura

IPC: B23K306

CPC classification number: H05K3/3484 ,  B23K3/0638 ,  B23K2101/42 ,  H05K3/1216 ,  H05K3/1233 ,  H05K3/3415 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09572 ,  H05K2203/0143

Abstract: A soldering system which reduces the numbers of steps for paste supply and soldering onto a printed circuit board. A printed circuit board has through holes through which a lead of each provided part is to be inserted. A printing mask is matched with the through holes and a paste receiving plate having holes to which solder paste is supplied corresponding to the through holes is disposed. A printing roller is swept by forcibly rotating it to fill with solder paste, then a printing squeegee follows the printing roller to further fill through holes. Parts are loaded on the through holes and reflowing is carried out on the printed circuit board and paste receiving plate, so that the parts are soldered to the printed circuit board.

Abstract translation: 一种焊接系统，其减少了将糊料供应和焊接到印刷电路板上的步骤数量。 印刷电路板具有通孔，每个所提供的部分的引线将被插入。 打印掩模与通孔匹配，并且设置具有孔的糊状物接收板，相应于通孔向其供应焊膏。 通过强力旋转印刷辊以填充焊膏，印刷辊被跟随印刷辊，以进一步填充通孔。 零件加载在通孔上，并在印刷电路板和糊状物接收板上进行回流，从而将零件焊接到印刷电路板上。

公开(公告)号：US20030082356A1

公开(公告)日：2003-05-01

申请号：US10247264

申请日：2002-09-19

Applicant: Fujikura Ltd.

Inventor： Tatsuo Suemasu ,  Takashi Takizawa

IPC: B32B003/00 ,  B05D001/18 ,  B05D007/22

CPC classification number: H01L21/76877 ,  C23C2/00 ,  C23C2/02 ,  C23C2/26 ,  H01L21/288 ,  H01L21/76882 ,  H01L21/76898 ,  H01L25/0657 ,  H01L2224/05556 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2924/00014 ,  H05K3/3468 ,  H05K3/4038 ,  H05K3/4076 ,  H05K3/426 ,  H05K2201/0305 ,  H05K2201/09572 ,  H05K2203/044 ,  H05K2203/085 ,  H05K2203/1394 ,  Y10S428/901 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/31678 ,  H01L2224/05599

Abstract: In the formation of through wirings in a silicon substrate and so forth, there was a need for the development of a technology that would allow metal to be reliably filled particularly in the vicinity of openings of through holes and other fine holes. This invention provides a metal filling method and member with filled metal sections in which, in the inflow and filling of a plating solution into through holes 11 of a substrate 10 by immersing said substrate 10 in heated and melted conductive metal, filled metal sections are formed by preliminarily forming a metal layer 15 on the inner surface of one of the ends of through holes 11 of this substrate 10 as well as on substrate top surface 13 around those openings, removing substrate 10 on which inflow and filling of the plating solution into through holes 11 has been completed from the plating solution, and then cooling to solidify the plating solution that has been filled into the through holes.

Abstract translation: 在硅衬底等中形成通过布线的方法中，需要开发一种能够使金属被可靠地填充到特别是通孔和其它细孔的开口附近的技术。 本发明提供了一种金属填充方法和具有填充金属部分的部件，其中，通过将所述基板10浸入加热和熔化的导电金属中，在将电镀液流入和填充到基板10的通孔11中时，形成填充的金属部分 通过在该基板10的通孔11的一个端部的内表面以及围绕这些开口的基板顶表面13上预先形成金属层15，去除基板10，电镀液的流入和填充通过 从电镀液中完成孔11，然后冷却固化已经填充到通孔中的电镀液。

公开(公告)号：US06518868B1

公开(公告)日：2003-02-11

申请号：US09639189

申请日：2000-08-15

Applicant: Gerald Miller ,  William Ng ,  Bernhard Schroter

Inventor： Gerald Miller ,  William Ng ,  Bernhard Schroter

IPC: H01F2708

CPC classification number: H05K1/0206 ,  G06F1/20 ,  H01F17/043 ,  H01F27/22 ,  H05K1/0203 ,  H05K3/429 ,  H05K7/209 ,  H05K2201/09572 ,  H05K2201/1003 ,  H05K2201/10166

Abstract: An inductor for a computer power supply module is provided. The inductor includes a one-piece, single turn winding formed of a material for conducting heat and electrical current. The material having at least about five times the amount of electrically conductive material necessary for conducting electrical current.

Abstract translation: 提供了一种用于计算机电源模块的电感器。 电感器包括由用于传导热和电流的材料形成的单件式单匝绕组。 该材料具有导电电流所需的导电材料的量的至少约五倍。

公开(公告)号：US20020114726A1

公开(公告)日：2002-08-22

申请号：US10104108

申请日：2002-03-22

Applicant: Hitachi, Ltd.

Inventor： Tasao Soga ,  Hanae Shimokawa ,  Tetsuya Nakatsuka ,  Kazuma Miura ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

IPC: H01L023/48

CPC classification number: H01L24/13 ,  B32B15/01 ,  C22C5/02 ,  C22C9/02 ,  C22C11/06 ,  C22C13/00 ,  H01L21/50 ,  H01L21/56 ,  H01L21/563 ,  H01L23/10 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/4924 ,  H01L23/49513 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/10135 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81139 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81409 ,  H01L2224/81815 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/045 ,  H05K2201/09572 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01031 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/83205

Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

Abstract translation: 在半导体器件和衬底之间形成的每一个接合点包括Cu的金属球或Sn的其它材料和化合物以及金属球，金属球通过化合物结合在一起。

公开(公告)号：US06378757B1

公开(公告)日：2002-04-30

申请号：US09773075

申请日：2001-01-31

Applicant: Brent A. Holcombe ,  Steven D Draving

Inventor： Brent A. Holcombe ,  Steven D Draving

IPC: B23K3102

CPC classification number: H05K3/363 ,  H05K3/0052 ,  H05K3/3405 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/09163 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09572 ,  Y10T29/49144

Abstract: Edge mounting flexible media to a rigid PC board construction can be achieved by various methods. In any method used, there is a desire to create solderable pads on the edge of the rigid PC board. In accordance with the invention, the solderable pads are created by edge plating the PC Board or by a sliced via method. Depending on the type of flexible transmission line used, the construction will differ accordingly. For terminating flexible circuit media, the flex pads are laid out in such a way that the pads are etched in a configuration that matches up with the edge pads on the rigid PC Board. Solder past is then applied to the pads on the flex. The rigid PC Board is fixtured at a right angle to the flex and run through the reflow oven.

Abstract translation: 通过各种方法可以实现将柔性介质固定到刚性PC板结构上。 在任何使用的方法中，希望在刚性PC板的边缘上形成可焊接焊盘。 根据本发明，通过边缘电镀PC板或通过切片通孔方法来产生可焊焊盘。 根据所使用的柔性传输线的类型，施工方式会有所不同。 为了终止柔性电路介质，柔性焊盘以这样一种方式布置，使得焊盘以与刚性PC板上的边缘焊盘相配合的构造被蚀刻。 然后将焊锡过去施加到柔性件上的焊盘。 刚性PC板与弯曲件成直角固定，并穿过回流炉。

公开(公告)号：US20020014346A1

公开(公告)日：2002-02-07

申请号：US09872256

申请日：2001-06-01

Applicant: NEC Corporation

Inventor： Kimio Tsunemasu ,  Yasunori Tanaka

IPC: H02G003/08

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L2224/13 ,  H01L2924/00014 ,  H05K1/112 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09572 ,  Y02P70/613 ,  H01L2224/0401

Abstract: A mounting structure of a semiconductor package can improve resistance against thermal and mechanical external force. The mounting structure of a semiconductor package establishes electrical connection of a pad on a printing circuit board to a connection wiring by soldering the semiconductor package. The pad may be integrally formed with a via. The soldering may be performed by penetrating a part of solder within the via so that the connection wiring is connected to the pad through the via at a layer different from a layer of the pad.

Abstract translation: 半导体封装的安装结构可以提高对热和机械外力的抵抗力。 半导体封装的安装结构通过焊接半导体封装而将印刷电路板上的焊盘电连接到连接布线。 垫可以与通孔一体地形成。 可以通过穿过通孔内的焊料的一部分来进行焊接，使得连接布线通过​​通孔在不同于焊盘层的层处连接到焊盘。

公开(公告)号：US06300578B1

公开(公告)日：2001-10-09

申请号：US09512131

申请日：2000-02-24

Applicant: Mark Kenneth Hoffmeyer ,  Phillip Duane Isaacs

Inventor： Mark Kenneth Hoffmeyer ,  Phillip Duane Isaacs

IPC: H01R1204

CPC classification number: H05K3/3436 ,  B23K1/0016 ,  B23K2101/42 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/09481 ,  H05K2201/09572 ,  H05K2201/10992 ,  H05K2201/2081 ,  H05K2203/043 ,  H05K2203/0455 ,  Y02P70/613

Abstract: Fine pitch area array packaging is achieved using a via-in-pad design within the area array attach portion of a printed circuit board (PCB). The limitation of the design is the wicking action, whereby solder applied to the capture pad contact surface is depleted by capillary action into the via hole when reflowed, causing insufficient solder to be present at the contact surface to effect reliable and repeatable electrical connections. In one implementation, an initial application of solder is applied to plug the via hole with a material having a higher final melting temperature than eutectic solder, thereby providing a stable plug. This plug is formed by the initial solder application that may be either a eutectic solder containing a third metal that forms intermetallic compounds, when reflowed, that elevate the liquidus temperature or a solder having a different formulation with an inherent higher melting temperature. An alternative implementation is to plate the via hole with a material, such as nickel, which prevents eutectic solder, applied to the via capture pad contact surface, from wetting the hole surface and being drawn away from the contact surface by capillary action. Thus, the solder, applied to the via capture pad and used to establish an electrical connection is not depleted.

Abstract translation: 使用在印刷电路板（PCB）的区域阵列附着部分内的通孔焊盘设计实现细间距区域阵列封装。 设计的限制是芯吸作用，由此当回流时，施加到捕获垫接触表面的焊料被毛细管作用通入通孔中，导致在接触表面处存在不足的焊料以实现可靠和可重复的电连接。 在一个实施方案中，施加焊料的初始应用以用比共晶焊料更高的最终熔融温度的材料堵塞通孔，从而提供稳定的插塞。 该插头由初始焊料应用形成，其可以是包含形成金属间化合物的第三金属的共晶焊料，当回流时，提高液相线温度的焊料或具有固有的较高熔融温度的不同配方的焊料。 另一种实施方案是用诸如镍的材料对通孔进行平板化，其防止施加到通孔捕获垫接触表面的共晶焊料润湿孔表面并通过毛细管作用从接触表面拉出。 因此，施加到通孔捕获垫并用于建立电连接的焊料不会耗尽。

公开(公告)号：US06199273B1

公开(公告)日：2001-03-13

申请号：US08769449

申请日：1996-12-19

Applicant: Toshihiko Kubo ,  Takuji Ito ,  Hiroshi Takamichi ,  Akihiro Hidaka

Inventor： Toshihiko Kubo ,  Takuji Ito ,  Hiroshi Takamichi ,  Akihiro Hidaka

IPC: H01R900

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L2224/11334 ,  H01L2924/15173 ,  H05K1/113 ,  H05K3/0094 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K2201/0379 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/10666 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/074 ,  H05K2203/1394 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: A ball-grid array connector structure for an electronic package in which the ball pitch can be reduced to increase the packaging density has a plastic substrate having at least one hollow through-hole and an electrode covering the wall of the through-hole and forming an electrode pad surrounding the through-hole on each surface of the substrate. A metallic ball is joined, either directly or through a solder or a combination of a metallic bump and a solder, to the electrode pad on at least one surface of the substrate at the position of the through-hole. The connector structure can be formed either by sealing an open end of the through-hole on the side to which the ball is not joined, or increasing the pressure within the through-hole by a pressure-control mechanism, before the through-hole is blocked by reflowing the ball itself or the metallic bump or solder used to connect the ball.

Abstract translation: 用于电子封装的球栅阵列连接器结构，其中球节距可以减小以增加封装密度，具有具有至少一个中空通孔的塑料基板和覆盖通孔壁的电极，并形成 围绕基板每个表面上的通孔的电极焊盘。 金属球直接或通过焊料或金属凸块和焊料的组合连接到通孔位置处的基板的至少一个表面上的电极焊盘。 连接器结构可以通过在通孔之前通过密封球体未接合的一侧上的通孔的开口端或通过压力控制机构来增加通孔内的压力来形成 通过回流球本身或用于连接球的金属凸块或焊料来阻止。