公开(公告)号：US06520109B2

公开(公告)日：2003-02-18

申请号：US09816143

申请日：2001-03-26

Applicant: Takashi Komura

Inventor： Takashi Komura

IPC: G01D1124

CPC classification number: H05K1/18 ,  B60K2350/408 ,  G01D3/08 ,  H02K5/225 ,  H02K2203/03 ,  H02K2211/03 ,  H05K3/3447 ,  H05K2201/09972 ,  H05K2201/1009 ,  H05K2201/10106

Abstract: An indicating instrument includes a transparent dial plate, a printed circuit board disposed behind the dial plate, a drive unit disposed behind the printed circuit board having a plurality of lead wires soldered to the printed circuit board, a light conductive luminous pointer and a light emitting diode disposed on the printed circuit board near a rotary shaft so that the pointer can receive light emitted from the light emitting diode. Each end of the plurality of lead wires is disposed on the printed circuit board at a distance from the light emitting diode sufficient to insulate the light emitting diode from heat of soldering the plurality of lead wires to the circuit board.

Abstract translation: 指示仪器包括透明拨盘，布置在表盘后面的印刷电路板，布置在印刷电路板后面的驱动单元，该驱动单元具有焊接到印刷电路板的多根引线，导光发光指示器和发光 二极管设置在印刷电路板附近的旋转轴上，使得指针能够接收从发光二极管发出的光。 多个引线的每个端部设置在与发光二极管相距一定距离的印刷电路板上，足以将发光二极管与多个引线焊接到电路板的热绝缘。

公开(公告)号：US5313128A

公开(公告)日：1994-05-17

申请号：US012897

申请日：1993-02-03

Applicant: Peter G. Robinson ,  James S. Bowdoin ,  Robert A. Nottingham

Inventor： Peter G. Robinson ,  James S. Bowdoin ,  Robert A. Nottingham

IPC: H02K3/50 ,  H02K5/22 ,  H05K1/11 ,  H05K3/00 ,  H05K3/30 ,  H05K3/34 ,  H01B7/08 ,  H02K15/00

CPC classification number: H02K3/50 ,  H02K5/225 ,  H05K1/118 ,  H02K2203/03 ,  H02K2211/03 ,  H05K2201/052 ,  H05K2201/1009 ,  H05K3/0058 ,  H05K3/305 ,  H05K3/3447 ,  Y10S310/06

Abstract: In summary, the present invention is a flexible printed circuit that eliminates the need for lead wire routing. The flexible printed circuit of the present invention comprises a plurality of electrical paths surrounded by a sheath of pliable MYLAR (polyester film) plastic. One side of the plastic is an adhesive that holds the circuit in place after it is wrapped around the shaft of the motor. On the other side, the mylar sheath opens to expose the ends of each electrical path. Small amounts of solder are pre-deposited at these exposed ends. A probe, suitably heated and applied to these ends, releases the solder to form a electrical and physical contact.

Abstract translation: 总之，本发明是一种柔性印刷电路，其不需要引线布线。 本发明的柔性印刷电路包括由柔韧的MYLAR（聚酯膜）塑料的护套包围的多个电路径。 塑料的一侧是将电路缠绕在电动机轴上之后将电路保持在适当位置的粘合剂。 另一方面，聚酯薄膜护套打开以露出每个电气路径的端部。 在这些暴露的端部预先沉积少量焊料。 适当加热并施加到这些端部的探头释放焊料以形成电气和物理接触。

公开(公告)号：US5064377A

公开(公告)日：1991-11-12

申请号：US635771

申请日：1990-12-28

Applicant: Roy L. Wood

Inventor： Roy L. Wood

IPC: H01R12/70 ,  H05K1/18 ,  H05K3/32

CPC classification number: H01R23/661 ,  H05K3/326 ,  H05K1/189 ,  H05K2201/1009 ,  H05K2201/10393

Abstract: The present invention is a compression connection apparatus for electrically connecting a disc drive motor to electronic signal sources. The apparatus comprises a circuit board attached to a disc drive motor having a pattern of metal contacts and each metal contact is attached to the internal motor electronics, a flexible printed circuit cable attached to the disc drive assembly's base deck having a pattern of metal contacts matching the metal contacts on the motor mounted circuit board, and a means for providing compressive force to maintain conductive contact between the aforementioned metal contacts.

Abstract translation: 本发明是用于将盘驱动马达电连接到电子信号源的压缩连接装置。 该装置包括连接到具有金属触点图案的磁盘驱动电动机的电路板，并且每个金属触点附接到内部电动机电子装置，柔性印刷电路电缆，其附接到盘驱动器组件的底座甲板，其具有匹配的金属触点的图案 马达安装电路板上的金属触点，以及用于提供压缩力以维持上述金属触点之间的导电接触的装置。

公开(公告)号：US20240237235A1

公开(公告)日：2024-07-11

申请号：US18002199

申请日：2022-08-19

Applicant: Honor Device Co., Ltd.

Inventor： Kangle Xue ,  Jiuliang Gao ,  Lijun Yang ,  Baojun Gao

IPC: H05K5/00 ,  H05K1/02 ,  H05K13/00

CPC classification number: H05K5/003 ,  H05K1/0277 ,  H05K5/0065 ,  H05K13/0015 ,  H05K2201/10083 ,  H05K2201/1009 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: An electronic assembly includes a first electronic component, a second electronic component, and a primary circuit board. The first electronic component is provided with a first secondary circuit board, the second electronic component is provided with a second secondary circuit board, the first secondary circuit board is electrically connected to the primary circuit board by using a first electrical connector, interlayer space is formed between the first secondary circuit board and the primary circuit board, a portion of the second secondary circuit board that enters the interlayer space overlaps the first secondary circuit board and is electrically connected to the primary circuit board by using a second electrical connector, the first electrical connector is located between the first secondary circuit board and the primary circuit board, and the second electrical connector is located between the second secondary circuit board and the primary circuit board.

公开(公告)号：US11894732B2

公开(公告)日：2024-02-06

申请号：US17241193

申请日：2021-04-27

Applicant: SPAL AUTOMOTIVE S.r.l.

Inventor： Pietro De Filippis

IPC: H02K11/33 ,  H02K9/22 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H02K11/33 ,  H02K9/227 ,  H05K1/0206 ,  H05K1/115 ,  H05K1/181 ,  H02K2211/03 ,  H05K2201/066 ,  H05K2201/1009 ,  H05K2201/10166

Abstract: An electric machine includes a casing, a cap covering the casing to define an enclosure, a heat sink, a circuit board in the enclosure having a first conductive layer as a top face, a second conductive layer as a bottom face, and vias passing through the circuit board between the top and bottom faces. An electronic component is soldered to the circuit board on the first conductive layer and disposed on top of a first part of the vias. A conductive mass is soldered to the circuit board proximal to the electronic component and disposed on top of a second part of the vias. The conductive mass forms part of the circuit through which a power supply of the electric machine flows and is in electric and heat exchange relationship with the electronic component, while the bottom face is in heat exchange relationship with the heat sink.

公开(公告)号：US11770051B2

公开(公告)日：2023-09-26

申请号：US17186403

申请日：2021-02-26

Applicant: MOBILETRON ELECTRONICS CO., LTD.

Inventor： Wen-Shing Hon ,  Shih-Hao Wang

IPC: H02K9/22 ,  H02K11/33 ,  H05K7/20 ,  H05K1/02

CPC classification number: H02K9/22 ,  H02K9/227 ,  H02K11/33 ,  H02K2211/03 ,  H05K1/0209 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/1009

Abstract: A brushless motor assembly includes a motor body, a circuit board, and a plurality of electronic elements. The circuit board is disposed on the motor body and has a first surface and a second surface which face opposite directions. The first surface faces the motor body. The second surface has a plurality of thermoconductive layouts. The electronic elements include a plurality of power switching elements disposed on the second surface. A plurality of heat sinks is disposed on the second surface. Each of the power switching elements and each of the heat sinks are connected to each of the thermoconductive layouts, so that a thermal energy generated by each of the power switching elements is transferred to each of the heat sinks through each of the thermoconductive layouts. This configuration thereby reduces an overall volume of the brushless motor assembly.

公开(公告)号：US20180336926A1

公开(公告)日：2018-11-22

申请号：US15924541

申请日：2018-03-19

Applicant: Nidec Corporation

Inventor： Shingo Suginobu

IPC: G11B19/20 ,  H02K3/50 ,  H05K1/11 ,  H05K1/02

CPC classification number: G11B19/2045 ,  H02K1/2786 ,  H02K3/50 ,  H02K5/1677 ,  H02K5/1737 ,  H02K11/33 ,  H02K2203/03 ,  H02K2203/06 ,  H05K1/028 ,  H05K1/111 ,  H05K2201/09072 ,  H05K2201/09409 ,  H05K2201/1009 ,  H05K2201/10159 ,  H05K2201/10287

Abstract: This motor includes a base and a circuit board arranged on a lower surface of the base. The base includes a first annular portion and a second annular portion. The first annular portion is arranged under a stator. The second annular portion is arranged under a flange portion of a hub. A conducting wire drawn out from the stator is arranged to pass through a through hole defined in the first annular portion, and is soldered to a land portion of the circuit board. The second annular portion is arranged to have an axial thickness smaller than that of the first annular portion. The land portion is arranged radially inward of the through hole. The above arrangement makes it easier to achieve a reduced axial dimension of the motor while ensuring a sufficient axial dimension of the hub, which is arranged axially above the second annular portion.

公开(公告)号：US20170012593A1

公开(公告)日：2017-01-12

申请号：US15271879

申请日：2016-09-21

Applicant: KITAGAWA INDUSTRIES CO., LTD.

Inventor： Tomokazu TANIMIZU ,  Kazushige UENO ,  Katsuyuki MORITA ,  Yoshinori OHASHI

IPC: H03H1/00 ,  H01F17/06

CPC classification number: H03H1/00 ,  H01F17/06 ,  H01F27/022 ,  H01F27/06 ,  H01F27/2885 ,  H01F2017/065 ,  H03H2001/0021 ,  H05K1/0215 ,  H05K1/0233 ,  H05K3/42 ,  H05K2201/1006 ,  H05K2201/1009 ,  H05K2201/10409

Abstract: An object is to provide an output-noise reduction device that can prevent noise from an electronic device accommodated in a metal casing from being transmitted due to electromagnetic coupling. An output voltage is extracted to the outside through a conducting bar. A magnetic body core includes a through hole through which the conducting bar is inserted. A chip capacitor is mounted on a mounting board and connects between the output terminal VO and ground potential. A section from the output terminal VO to at least part of the chip capacitor mounted on the mounting board is isolated from the electromagnetic coupling from the electronic device. Thus, noise is prevented from being transmitted to the output terminal VO.

Abstract translation: 本发明的目的是提供一种输出噪声降低装置，其可以防止由于电磁耦合而容纳在金属壳体中的电子装置的噪声被传输。 通过导线将输出电压提取到外部。 磁体芯包括导电棒插入的通孔。 芯片电容器安装在安装板上，并连接在输出端子VO和地电位之间。 从输出端子VO到安装在安装板上的芯片电容器的至少一部分的部分与电子设备的电磁耦合隔离。 因此，防止噪声被传输到输出端子VO。

公开(公告)号：US20160309592A1

公开(公告)日：2016-10-20

申请号：US15099905

申请日：2016-04-15

Applicant: Rohm Co., Ltd.

Inventor： Masashi Nagasato

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/0243 ,  H05K1/0242 ,  H05K1/025 ,  H05K3/4685 ,  H05K2201/09154 ,  H05K2201/09609 ,  H05K2201/09618 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10053 ,  H05K2201/1009 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734

Abstract: A printed wiring board used to suppress parasitic component is provided. The printed wiring board 100 includes a multi-layer substrate 110, and a power line 50 laid on the multi-layer substrate 110 and connected with a power terminal row T11a-T11d of a semiconductor device 10. The power line 50 includes a first wiring pattern 51 formed on a surface of the multi-layer substrate 110, a second wiring pattern 52 formed within the multi-layer substrate 110, and interlayer connections 53x and 53y electrically conducting the first wiring pattern 51 and the second wiring pattern 52 to bypass at least a portion of the power terminal row T11a-T11d.

Abstract translation: 提供了用于抑制寄生成分的印刷线路板。 印刷电路板100包括多层基板110和布置在多层基板110上并与半导体装置10的电源端子排T11a-T11d连接的电力线50.电力线50包括第一布线 形成在多层基板110的表面上的图案51，形成在多层基板110内的第二布线图案52，以及导电第一布线图案51和第二布线图案52旁路的层间连接53x和53y 电力端子排T11a-T11d的至少一部分。

公开(公告)号：US20160050765A1

公开(公告)日：2016-02-18

申请号：US14825855

申请日：2015-08-13

Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I

Inventor： Jeffrey Spencer Pulskamp

IPC: H05K3/32 ,  H05K1/02

CPC classification number: H05K3/303 ,  H01L27/20 ,  H01L41/094 ,  H02N2/0095 ,  H05K1/029 ,  H05K3/0008 ,  H05K2201/1009 ,  H05K2203/1509 ,  H05K2203/173 ,  Y02P70/613 ,  Y10T29/53174

Abstract: A system for controlled motion of circuit components to create reconfigurable circuits comprising: a support; a substrate operatively associated with the support; actuators operatively associated with the support configured to physically move circuit components and to move the circuit components into physical and electrical contact with the substrate; the substrate comprising at least one conductive segment arranged to electrically connect circuit components when electrical contacts of circuit components are placed in contact with at least one conductive segment; and control circuitry configured to control the first and second actuators to thereby position the circuit components relative to the substrate; whereby circuit function is determined by the selection of circuit components and the location and orientation of circuit components relative to the substrate and conductive segments to create a reconfigurable circuit.

Abstract translation: 一种用于电路组件的受控运动以产生可重构电路的系统，包括：支架; 与所述支撑件可操作地相关联的基板; 与所述支撑件可操作地相关联的致动器构造成物理地移动电路部件并且将所述电路部件移动到与所述基板物理和电接触; 所述衬底包括至少一个导电段，布置成当电路部件的电触点与至少一个导电段接触放置时电连接电路部件; 以及控制电路，其被配置为控制所述第一和第二致动器从而相对于所述衬底定位所述电路部件; 由此电路功能由电路元件的选择以及电路元件相对于衬底和导电段的位置和取向来确定，以产生可重构电路。