公开(公告)号：US11885747B2

公开(公告)日：2024-01-30

申请号：US17180373

申请日：2021-02-19

Applicant: Ecolab USA Inc.

Inventor： Brandon Matthew Davis ,  Stephen J. Hinterlong ,  David Alan Ambrose

IPC: G01N21/77 ,  G01N21/64 ,  H05K1/02 ,  H05K1/18

CPC classification number: G01N21/77 ,  G01N21/6428 ,  H05K1/0274 ,  H05K1/181 ,  G01N2021/7763 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: An optical sensor may include a housing, a printed circuit board, an optical emitter, and an optical detector. The housing can define a channel configured to receive a transparent tubing line through which fluid can flow during operation. The housing can have multiple optical pathways, including a primary optical pathway transecting the channel, a light emission optical pathway, and a light detection optical pathway. The optical emitter and optical detector can each be mounted on the printed circuit board. Further, the housing may be positioned on the printed circuit board with the optical emitter aligned to emit light into the light emission optical pathway and the optical detector aligned to receive light from the light detection optical pathway.

公开(公告)号：US11882651B2

公开(公告)日：2024-01-23

申请号：US17612985

申请日：2020-05-13

Applicant: SIGNIFY HOLDING B.V.

Inventor： Rifat Ata Mustafa Hikmet ,  Ties Van Bommel ,  Grigory Onushkin

IPC: H05K1/02 ,  F21V29/503 ,  F21V19/00 ,  H05K1/05 ,  F21Y115/10

CPC classification number: H05K1/0274 ,  F21V19/0025 ,  F21V29/503 ,  H05K1/0203 ,  H05K1/056 ,  F21Y2115/10 ,  H05K2201/0224 ,  H05K2201/0245 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: The invention provides a lighting device (1000) comprising (i) a light source (100) configured to generate light source light (101), wherein the light source (100) comprises a solid state light source, and (ii) a support (200) configured to support the light source (100), wherein the support (200) comprises a metal based thermally conductive material (201), wherein the lighting device (1000) further comprises (iii) a layered element (300), configured in physical contact with the support (200), wherein the layered element (300) comprises one or more layers (310), wherein the layered element (300) at least comprises an electrically insulating first layer (311), wherein at least part of the layered element (300) is configured between the light source (100) and the support (200) such that during operation part of the light source light (101) irradiates the layered element (300), wherein the layered element (300) comprises light reflective particles (410), wherein at least 50 wt. % of the particles have a flake-like shape.

公开(公告)号：US11879620B2

公开(公告)日：2024-01-23

申请号：US17476736

申请日：2021-09-16

Applicant: Ciena Corporation

Inventor： Victor Aldea ,  Michael Ledwinka ,  Trevor Meunier

IPC: F21V23/00 ,  H05K3/30 ,  F21V8/00 ,  F21Y115/10

CPC classification number: F21V23/005 ,  G02B6/0073 ,  H05K3/303 ,  F21Y2115/10 ,  H05K2201/10106 ,  H05K2201/10121

Abstract: A combination standoff and LED includes a surface mount solder standoff which can be either threaded or unthreaded, and a surface mount LED disposed and fixed in the center of the base of the standoff. The combination standoff and LED is adapted to receive a lightpipe via the either threaded or unthreaded portion of the surface mount solder standoff. This combination standoff and LED results in a single piece of hardware which simplifies the physical PCBA layout design and removes any Computer Aided Design (CAD) placement errors that would normally be present if two separate hardware components were placed together manually.

公开(公告)号：US11877407B2

公开(公告)日：2024-01-16

申请号：US16995402

申请日：2020-08-17

Applicant: Eaton Intelligent Power Limited

Inventor： Ramesh Shivaji Powar ,  Ramesh Jagadale ,  Jeffrey Cox ,  Jeffrey W. Lockhart ,  Victor Epee

IPC: H05K5/00 ,  H05K5/02 ,  H05K1/18 ,  H01C1/02 ,  H01C7/12

CPC classification number: H05K5/006 ,  H01C1/02 ,  H01C7/12 ,  H05K1/18 ,  H05K5/0052 ,  H05K5/0247 ,  H05K5/0069 ,  H05K2201/09163 ,  H05K2201/10106 ,  H05K2201/10196

Abstract: A surge protection device has a housing that is formed from a first lateral portion, a middle portion, and a second lateral portion that are connected together with a plurality of fasteners. The surge protection device includes an electronic apparatus having a neutral wire and further includes a housing that advantageously includes a strain relief that causes the neutral wire to frictionally engage the housing with sufficient friction to resist a predetermined tension applied to the free end or other portion of the neutral wire at the exterior of the housing from damaging an electrical connection between the neutral wire and a circuit board within an interior region of the surge protection device.

公开(公告)号：US20240008173A1

公开(公告)日：2024-01-04

申请号：US18248257

申请日：2020-11-20

Applicant: KOREA PHOTONICS TECHNOLOGY INSTITUTE

Inventor： Gi Dong SA ,  Ja Yeon KIM ,  Sa Ung KIM ,  Ji Ho JEONG ,  Eunbee KIM

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/0283 ,  H05K1/0346 ,  H05K1/111 ,  H05K3/005 ,  H05K2201/0154 ,  H05K2201/09227 ,  H05K2201/10106 ,  H05K2201/10037 ,  H05K2201/10545

Abstract: A stretchable substrate and a manufacturing method of the stretchable substrate are disclosed. In a step of manufacturing a flexible substrate, a circuit pattern composed of one or more mounting pad parts configured to cause electronic parts to be mounted to a polyimide film PI having a fixed size is formed, and a wiring pattern configured to circuit-connect the mounting pad parts is formed, and further an outer circumferential line of the circuit pattern is realized in a cutting line for cutting. In a step of mounting parts, the electronic parts are mounted on the circuit pattern of the flexible substrate. In a punching step for cutting the cutting line, a punching jig set to be aligned to the cutting line of the flexible substrate on which the parts are mounted is utilized, thereby realizing the excellent tensile performance of wiring configured to connect a circuit.

公开(公告)号：US11855468B2

公开(公告)日：2023-12-26

申请号：US18061578

申请日：2022-12-05

Applicant: MILWAUKEE ELECTRIC TOOL CORPORATION

Inventor： Wyatt R. Silha ,  Cameron R. Schulz ,  Kyle C. Fassbender ,  Zhi Wei Meng

IPC: H01M10/46 ,  H02J7/00 ,  H05K1/18 ,  H01M10/44 ,  H05K7/20 ,  H05K1/02

CPC classification number: H02J7/0042 ,  H01M10/44 ,  H02J7/0013 ,  H02J7/0045 ,  H02J7/0047 ,  H02J7/00047 ,  H02J7/00309 ,  H05K1/0295 ,  H05K1/18 ,  H05K7/20154 ,  H05K7/20209 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10522

Abstract: A battery charger may include a printed circuit board (PCB) having a first portion supporting alternating current (AC) electrical components and a second portion supporting direct current (DC) electrical components; an indicator including a light-emitting diode (LED) supported on the first portion of the PCB and operable to emit light; and an isolating member positioned on the first portion between the AC electrical components and the LED. A trace on the PCB may be electrically connected to the second portion of the PCB, the trace extending from the second portion and along the first portion, and the LED may be electrically connected to and receiving DC power through the trace, the LED being selectively positioned along a length of the trace. The LED may be positioned more than about 8 mm from the AC electrical components.

公开(公告)号：US20230413445A1

公开(公告)日：2023-12-21

申请号：US18240032

申请日：2023-08-30

Applicant: WHIRLPOOL CORPORATION

Inventor： MATTHEW P. EBROM ,  NEOMAR GIACOMINI ,  MARK E. GLOTZBACH ,  BRIAN N. RADFORD

IPC: H05K1/18 ,  G06F1/16 ,  G06F3/041 ,  H05K3/32 ,  H05K1/14

CPC classification number: H05K1/181 ,  G06F1/1637 ,  G06F3/041 ,  H05K3/325 ,  H05K1/144 ,  G06F2203/04103 ,  H05K2201/0367 ,  H05K2201/10598 ,  H05K2201/041 ,  H05K2201/10106

Abstract: Example human-machine interface (HMI) assemblies are disclosed. One example HMI assembly includes a printed circuit board (PCB) and a backer selectively flexible between a first curved state and a second flexed state, and attached to the fascia in the second flexed state to bias the PCB against the fascia.

公开(公告)号：US11843169B2

公开(公告)日：2023-12-12

申请号：US17994544

申请日：2022-11-28

Applicant: ARRIS Enterprises LLC

Inventor： Qiang Bai ,  Ian Clarke

IPC: H01Q1/52 ,  H05K1/02 ,  H04W84/12

CPC classification number: H01Q1/523 ,  H05K1/0243 ,  H04W84/12 ,  H05K2201/10106

Abstract: A multiple-antenna device including a printed circuit board, a first antenna formed into a first corner of the printed circuit board, a second antenna formed into a second corner of the printed circuit board, and a dual-band decoupler formed in the printed circuit board between the first antenna and the second antenna. The multiple-antenna device includes WLAN circuitry located on the printed circuit board between the first antenna and the decoupler. The first and second antennas have polarizations orthogonal to each other.

公开(公告)号：US11841553B2

公开(公告)日：2023-12-12

申请号：US17725190

申请日：2022-04-20

Applicant: Snap Inc.

Inventor： Julio Cesar Castañeda

IPC: G02C11/04 ,  F21V23/00 ,  H05K1/18 ,  F21V23/04 ,  G02C11/00 ,  F21Y115/10 ,  F21Y113/13 ,  F21V33/00 ,  F21V21/084

CPC classification number: G02C11/04 ,  F21V23/005 ,  F21V23/0478 ,  F21V23/0485 ,  G02C11/10 ,  H05K1/189 ,  F21V21/084 ,  F21V33/0008 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05K2201/0999 ,  H05K2201/10106

Abstract: An embodiment includes eyewear having an optical element, electronic components, a support structure configured to support the optical element and the electronic components, and light emitting diodes (LEDs) coupled to the electronic components and supported by the support structure. The LEDs are positioned to illuminate the support structure according to a lighting scheme.

公开(公告)号：US20230395766A1

公开(公告)日：2023-12-07

申请号：US18032212

申请日：2021-10-14

Applicant: TDK CORPORATION

Inventor： Tomohisa MITOSE ,  Kenichi KAWABATA ,  Susumu TANIGUCHI ,  Akiko SEKI

IPC: H01L33/62 ,  H01L23/00 ,  H05K1/18

CPC classification number: H01L33/62 ,  H01L24/16 ,  H01L24/13 ,  H05K1/181 ,  H01L24/73 ,  H01L24/32 ,  H01L2933/0066 ,  H01L2224/73204 ,  H01L2224/32237 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/81815 ,  H01L2224/81192 ,  H05K2201/10106 ,  H05K2201/09472 ,  H01L2924/12041 ,  H05K2201/09827

Abstract: A mounting board includes an electronic component having at least a pair of first terminals, and a circuit board having at least a pair of second terminals. The first terminal and the second terminal are bonded to each other by a bonding material. The first terminal, the second terminal, and the bonding material are disposed inside a recessed portion formed in a resin layer such that the periphery thereof is surrounded by the resin layer. When a total thickness of the first terminal, the second terminal, and the bonding material is a dimension h1, the dimension h1 is 1 μm to 20 μm. When a width of the first terminal is a dimension d1 and a width of the recessed portion of the resin layer is a dimension d2, a value of (dimension d2—dimension d1) is 10 μm or smaller.